Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto

Claim 1

An electronic package comprising: a substantially rigid, thermally conductive support member; a thin, flexible circuitized substrate including a dielectric member having a first layer of circuitry positioned on a first surface thereof, said thin, flexible circuitized substrate including a plurality of conductive through-holes located within said dielectric member and electrically connected to said first layer of circuitry, said thin circuitized substrate being directly bonded to said support member in an electrically insulative manner, including along the portion of said dielectric member having said plurality of conductive through-holes therein; a semiconductor device bonded to said support member in a thermally conductive manner at a location relative to said first layer of circuitry of said circuitized substrate, said semiconductor device including a surface having a plurality of electrical contact sites thereon for being electrically coupled to said first layer of said circuitry of said circuitized substrate; and a plurality of solder elements each positioned on selected ones of said conductive through-holes and electrically connected thereto, each of said solder elements including a first portion thereof extending within a respective one of said selected ones of said conductive through-holes and a rounded second portion projecting from said conductive through-hole and adapted for being electrically coupled to an external circuitized substrate.