Patent US5767568A successfully refreshed from Google Patents.
US5767568A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Sony Corp
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Filing: 1995-12-07
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Granted: 1998-06-16
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Expires: 2015-12-07
Abstract
Abstract A highly reliable semiconductor device with an increased life is provided as comprising a wiring substrate comprising a portion for mounting a semiconductor pellet, a semiconductor pellet mounted on the portion for mounting the semiconductor pellet, an electrode provided on the wiring substrate connected to an electrode of the semiconductor pellet, a layer comprising a sealing material which seals the semiconductor pellet and the electrode provided on the wiring substrate, wherein at least a through hole for discharging water vapor is formed in the portion for mounting the semiconductor pellet provided on the wiring substrate, and the protective film for preventing the adhesion of solder or plating is removed from not only the soldered or plated portion but also the periphery of the portion for mounting the semiconductor pellet.
Inventors
- 👤 Kimihiro Tsuruzono
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W70/681; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07353; H10W72/075; H10W72/30; H10W72/331; H10W72/334; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
93 words
A semiconductor device, comprising: a semiconductor pellet; a wiring substrate comprising a portion for mounting the semiconductor pellet; an electrode provided on the wiring substrate connected to an electrode of the semiconductor pellet; and a layer comprising a sealing material which seals the semiconductor pellet and the electrode provided on the wiring substrate; the wiring substrate being provided with at least a through hole formed in the portion for mounting the semiconductor pellet, wherein a protrusion is formed around the periphery of the through hole on the side for mounting the semiconductor pellet.
Claim 2
Dependent Claim
93 words
A semiconductor device, comprising: a semiconductor pellet; a wiring substrate comprising a portion for mounting the semiconductor pellet; an electrode provided on the wiring substrate connected to an electrode of the semiconductor pellet; and a layer comprising a sealing material which seals the semiconductor pellet and the electrode provided on the wiring substrate; the wiring substrate being provided with at least a through hole formed in the portion for mounting the semiconductor pellet, wherein a protrusion is formed around the periphery of the through hole on the side for mounting the semiconductor pellet.
Claim 3
Dependent Claim
119 words
A semiconductor device, comprising: a semiconductor pellet; a wiring substrate having a portion for mounting the semiconductor pellet, said semiconductor pellet being adhered to said portion of said wiring substrate for mounting the semiconductor pellet with an adhesive interposed therebetween; an electrode of the semiconductor pellet and an electrode provided on the wiring substrate being electrically connected with each other; at least one water vapor discharging opening provided in the wiring substrate and formed through the portion of said wiring substrate for mounting the semiconductor pellet to an opposed surface of the wiring substrate; and a frame-like protrusion formed in the periphery of the water vapor discharging opening to prevent adhesive from entering into the water vapor discharging opening.
Claim 4
Dependent Claim
119 words
A semiconductor device, comprising: a semiconductor pellet; a wiring substrate having a portion for mounting the semiconductor pellet, said semiconductor pellet being adhered to said portion of said wiring substrate for mounting the semiconductor pellet with an adhesive interposed therebetween; an electrode of the semiconductor pellet and an electrode provided on the wiring substrate being electrically connected with each other; at least one water vapor discharging opening provided in the wiring substrate and formed through the portion of said wiring substrate for mounting the semiconductor pellet to an opposed surface of the wiring substrate; and a frame-like protrusion formed in the periphery of the water vapor discharging opening to prevent adhesive from entering into the water vapor discharging opening.
Claim 5
Dependent Claim
45 words
A semiconductor device as set forth in claim 2, wherein a plurality of water vapor discharging openings are provided in the wiring substrate and formed through the portion of the wiring substrate for mounting the semiconductor pellet and an opposed surface of the wiring substrate.
Claim 6
Dependent Claim
49 words
A semiconductor device as set forth in claim 2, further including a protective film formed on the substrate between the portion for mounting the semiconductor pellet and the electrode on the wiring substrate wherein a portion of the protective film is removed to expose a surface of the substrate.
References Cited (Backward Citations)
US4866506A
Cited
US4814943A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-15 | 2001-12-15 | 2002-06-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-15 | 2005-12-15 | 2006-06-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-15 | 2009-12-15 | 2010-06-16 | $7700.00 | Window Closed / Lapsed |