Patent US6330372B1 successfully refreshed from Google Patents.
Patent US5757611A successfully refreshed from Google Patents.
US5757611A
Expired / Lapsed
US
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Electronic package having buried passive components
Assignee: Northrop Grumman Systems Corp
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Filing: 1996-04-12
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Granted: 1998-05-26
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Expires: 2016-04-12
Abstract
Abstract The invention provides for an electronic package having a buried passive component such as a capacitor therein, and a method for fabricating the same. The electronic package preferably includes a passive component portion which includes a plurality of layers of high K dielectric material, a signal processing portion which includes a plurality of layers of low K dielectric material, and at least one buffer layer interposed between the passive component portion and the signal processing portion. Metallization is preferably printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material. Preferably, the layers are co-fired at a temperature below approximately 1200° C. to form the electronic package and each of the buffer layers contains approximately 25 to 100% barium compound. Via conductors may also be provided through the buffer layers to electrically couple the passive component portion and the signal processing portion and the metallization and the via conductors may be selected from highly conductive materials such as gold, silver, copper and alloys thereof.
Inventors
- 👤 Stephen R. Gurkovich
- 👤 Theodore R. Vasilow
- 👤 Andrew J. Piloto
- 👤 Deborah P. Partlow
- 👤 Kenneth C. Radford
- 👤 Alex E. Bailey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10W70/69; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H05K3/4688
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
99 words
An electronic package having a buried passive component therein, comprising: a. a passive component portion including a plurality of layers of high K dielectric material; b. a signal processing portion including a plurality of layers of low K dielectric material; c. at least one buffer layer interposed between said passive component portion and said signal processing portion and said at least one buffer layer containing approximately 25 to 100% barium compound; and d. metallization printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material.
Claim 2
Dependent Claim
99 words
An electronic package having a buried passive component therein, comprising: a. a passive component portion including a plurality of layers of high K dielectric material; b. a signal processing portion including a plurality of layers of low K dielectric material; c. at least one buffer layer interposed between said passive component portion and said signal processing portion and said at least one buffer layer containing approximately 25 to 100% barium compound; and d. metallization printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material.
Claim 3
Dependent Claim
34 words
The electronic package of claim 1 wherein the barium compound within said at least one buffer layer is selected from the group consisting of BaO, BaCO 3 , and BaTiO 3 and combinations thereof.
Claim 4
Dependent Claim
26 words
The electronic package of claim 1 further comprising via conductors through the buffer layers to electrically couple said passive component portion and said signal processing portion.
Claim 5
Dependent Claim
26 words
The electronic package of claim 3 wherein said metallization and said via conductors are selected from the group consisting of gold, silver, copper and alloys thereof.
Claim 6
Dependent Claim
24 words
The electronic package of claim 1 wherein said metallization includes a plurality of opposing electrodes within said passive component portion to form a capacitor.
Claim 7
Dependent Claim
15 words
The electronic package of claim 1 wherein the high K dielectric material is lead based.
Claim 8
Dependent Claim
21 words
The electronic package of claim 1 wherein the high K dielectric material is substantially Pb(Mg 0 .33,Nb 0 .67)O 3 .
Claim 9
Dependent Claim
25 words
The electronic package of claim 1 wherein said at least one buffer layer includes a buffer layer having a barium compound content of approximately 50%.
Claim 10
Dependent Claim
26 words
The electronic package of claim 8 wherein said at least one buffer layer includes a thin buffer layer having a barium compound content of approximately 100%.
Claim 11
Dependent Claim
26 words
The electronic package of claim 1 wherein said at least one buffer layer includes a thin buffer layer having a barium compound content of approximately 100%.
Claim 12
Dependent Claim
17 words
The electronic package of claim 10 wherein the thin buffer layer is within said passive component portion.
Claim 13
Dependent Claim
18 words
The electronic package of claim 1 wherein each of said at least one buffer layer includes inorganic fillers.
Claim 14
Dependent Claim
14 words
The electronic package of claim 1 wherein the low K dielectric material includes borosilicate.
Claim 15
Dependent Claim
17 words
The electronic package of claim 13 wherein the low K dielectric material includes a crystalline ceramic filler.
Claim 16
Dependent Claim
13 words
The electronic package of claim 14 wherein the crystalline ceramic filler is quartz.
Claim 17
Dependent Claim
71 words
The electronic package of claim 3 wherein the barium compound within said at least one buffer layer is selected from the group consisting of BaO, BaCO 3 , and BaTiO 3 and combinations thereof and said metallization and said via conductors are selected from the group consisting of gold, silver, copper and alloys thereof and the high K dielectric material is lead based and the low K dielectric material includes borosilicate.
Claim 18
Dependent Claim
122 words
An electronic package having a buried passive component therein, comprising: a. a passive component portion including a plurality of layers of high K dielectric material; b. a signal processing portion including a plurality of layers of low K dielectric material; c. at least one buffer layer interposed between said passive component portion and said signal processing portion; and d. metallization printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material; wherein the layers of high K dielectric material and the layers of low K dielectric material and said at least one buffer layers are co-fired at a temperature below approximately 1200° C. to form said electronic package.
Claim 19
Dependent Claim
122 words
An electronic package having a buried passive component therein, comprising: a. a passive component portion including a plurality of layers of high K dielectric material; b. a signal processing portion including a plurality of layers of low K dielectric material; c. at least one buffer layer interposed between said passive component portion and said signal processing portion; and d. metallization printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material; wherein the layers of high K dielectric material and the layers of low K dielectric material and said at least one buffer layers are co-fired at a temperature below approximately 1200° C. to form said electronic package.
Claim 20
Dependent Claim
22 words
The electronic package of claim 17 wherein each of said at least one buffer layer contains approximately 25 to 100% barium compound.
Claim 21
Dependent Claim
34 words
The electronic package of claim 18 wherein the barium compound within said at least one buffer layer is selected from the group consisting of BaO, BaCO 3 , and BaTiO 3 and combinations thereof.
Claim 22
Dependent Claim
26 words
The electronic package of claim 17 further comprising via conductors through the buffer layers to electrically couple said passive component portion and said signal processing portion.
Claim 23
Dependent Claim
26 words
The electronic package of claim 20 wherein said metallization and said via conductors are selected from the group consisting of gold, silver, copper and alloys thereof.
Claim 24
Dependent Claim
24 words
The electronic package of claim 17 wherein said metallization includes a plurality of opposing electrodes within said passive component portion to form a capacitor.
Claim 25
Dependent Claim
15 words
The electronic package of claim 17 wherein the high K dielectric material is lead based.
Claim 26
Dependent Claim
21 words
The electronic package of claim 17 wherein the high K dielectric material is substantially Pb(Mg 0 .33,Nb 0 .67)O 3 .
Claim 27
Dependent Claim
25 words
The electronic package of claim 17 wherein said at least one buffer layer includes a buffer layer having a barium compound content of approximately 50%.
Claim 28
Dependent Claim
26 words
The electronic package of claim 25 wherein said at least one buffer layer includes a thin buffer layer having a barium compound content of approximately 100%.
Claim 29
Dependent Claim
26 words
The electronic package of claim 17 wherein said at least one buffer layer includes a thin buffer layer having a barium compound content of approximately 100%.
Claim 30
Dependent Claim
17 words
The electronic package of claim 27 wherein the thin buffer layer is within said passive component portion.
Claim 31
Dependent Claim
18 words
The electronic package of claim 17 wherein each of said at least one buffer layer includes inorganic fillers.
Claim 32
Dependent Claim
14 words
The electronic package of claim 17 wherein the low K dielectric material includes borosilicate.
Claim 33
Dependent Claim
17 words
The electronic package of claim 30 wherein the low K dielectric material includes a crystalline ceramic filler.
Claim 34
Dependent Claim
13 words
The electronic package of claim 31 wherein the crystalline ceramic filler is quartz.
Claim 35
Dependent Claim
75 words
The electronic package of claim 20 wherein each of said at least one buffer layer contains approximately 25 to 100% barium compound selected from the group consisting of BaO, BaCO 3 , and BaTiO 3 and combinations thereof and said metallization and said via conductors are selected from the group consisting of gold, silver, copper and alloys thereof and the high K dielectric material is lead based and the low K dielectric material includes borosilicate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-25 | 2001-11-24 | 2002-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-25 | 2005-11-24 | 2006-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-25 | 2009-11-24 | 2010-05-26 | $7700.00 | Window Closed / Lapsed |