Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
73 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate comprising: (1) a low temperature co-fired ceramic substrate comprising multiple layers; and (2) an electronic power converter circuit wherein a selected plurality of the passive components thereof are chosen from the group consisting of capacitors, resistors, inductors, and transformers and are formed as an integral part of one or more of said multiple layers of said low-temperature co-fired ceramic substrate.
Claim 2
Dependent Claim
73 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate comprising: (1) a low temperature co-fired ceramic substrate comprising multiple layers; and (2) an electronic power converter circuit wherein a selected plurality of the passive components thereof are chosen from the group consisting of capacitors, resistors, inductors, and transformers and are formed as an integral part of one or more of said multiple layers of said low-temperature co-fired ceramic substrate.
Claim 3
Dependent Claim
47 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate as described in claim 1, and further comprising at least one conductive layer located on or within the low temperature co-fired ceramic substrate, which electrically connects the circuitry of the electronic power converter circuit.
Claim 4
Dependent Claim
41 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate as described in claim 2, and further comprising a plurality of conductive pads for electronically connecting the components of the electronic power converter circuit to said conductive layer.
Claim 5
Dependent Claim
33 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate as described in claim 3, and further comprising at least one non-semiconductor element formed within said low temperature ceramic substrate.
Claim 6
Dependent Claim
33 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate as described in claim 3, and further comprising at least one cavity formed within said low temperature co-fired ceramic substrate.
Claim 7
Dependent Claim
34 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate as described in claim 5, and further comprising at least one thermal via formed within said low temperature co-fired ceramic substrate.
Claim 8
Dependent Claim
34 words
An electronic power converter circuit formed within a low temperature co-fired ceramic substrate as described in claim 1, and further comprising at least one discrete component mounted on said low temperature co-fired ceramic substrate.
Claim 9
Dependent Claim
20 words
A low temperature co-fired ceramic structure as defined in claim 1 in which said passive components comprise a power oscillator.
Claim 10
Dependent Claim
20 words
A low temperature co-fired ceramic structure as defined in claim 1, in which said passive components comprise an RF amplifier.
Claim 11
Dependent Claim
124 words
In a power conversion system incorporating a low temperature co-fired ceramic structure containing first and second filter networks, a low temperature co-fired ceramic structure containing a plurality of buried capacitor, buried inductor and buried resistor elements comprising: a plurality of capacitors, inductors and resistors configured to form a first filter network and a plurality of capacitors, inductors and resistors configured to form a second filter network; and an active circuit amplifier means mounted on the external surface of said co-fired ceramic structure, the input to said amplifier means being supplied by the output of said first filter network, the input of said first filter network being supplied by external means, said output of said amplifier means driving the input of said second filter network.
Claim 12
Dependent Claim
124 words
In a power conversion system incorporating a low temperature co-fired ceramic structure containing first and second filter networks, a low temperature co-fired ceramic structure containing a plurality of buried capacitor, buried inductor and buried resistor elements comprising: a plurality of capacitors, inductors and resistors configured to form a first filter network and a plurality of capacitors, inductors and resistors configured to form a second filter network; and an active circuit amplifier means mounted on the external surface of said co-fired ceramic structure, the input to said amplifier means being supplied by the output of said first filter network, the input of said first filter network being supplied by external means, said output of said amplifier means driving the input of said second filter network.
Claim 13
Dependent Claim
24 words
In the power conversion system of claim 10, said low temperature co-fired ceramic structure comprising additionally: transformer means coupled to said first filter network.
Claim 14
Dependent Claim
23 words
In the power conversion system of claim 11, said low temperature co-fired ceramic structure comprising additionally: said transformer means buried within said structure.
Claim 15
Dependent Claim
24 words
In the power conversion system of claim 10, said low temperature co-fired ceramic structure comprising additionally: transformer means coupled to said second filter network.
Claim 16
Dependent Claim
23 words
In the power conversion system of claim 13, said low temperature co-fired ceramic structure comprising additionally: said transformer means buried within said structure.
Claim 17
Dependent Claim
71 words
A circuit for use in an electronic power converter formed on and within a low temperature co-fired ceramic substrate and comprising; a low temperature co-fired ceramic substrate comprising multiple layers; a plurality of circuit components formed as an integral part of one or more of said multiple layers of said low temperature co-fired ceramic substrate; and a plurality of circuit components mounted on or within said low temperature co-fired ceramic substrate.
Claim 18
Dependent Claim
71 words
A circuit for use in an electronic power converter formed on and within a low temperature co-fired ceramic substrate and comprising; a low temperature co-fired ceramic substrate comprising multiple layers; a plurality of circuit components formed as an integral part of one or more of said multiple layers of said low temperature co-fired ceramic substrate; and a plurality of circuit components mounted on or within said low temperature co-fired ceramic substrate.
Claim 19
Dependent Claim
137 words
A low temperature co-fired ceramic structure containing buried passive circuitry comprising: a low temperature co-fired ceramic substrate comprising multiple layers; and passive circuitry formed as an integral part of one or more of said multiple layers of said substrate to provide said buried passive circuitry, wherein: said passive circuitry includes at least one component selected from the class consisting of resistors, capacitors, inductors, and transformers; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried passive components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.
Claim 20
Dependent Claim
137 words
A low temperature co-fired ceramic structure containing buried passive circuitry comprising: a low temperature co-fired ceramic substrate comprising multiple layers; and passive circuitry formed as an integral part of one or more of said multiple layers of said substrate to provide said buried passive circuitry, wherein: said passive circuitry includes at least one component selected from the class consisting of resistors, capacitors, inductors, and transformers; said buried passive components being surrounded on all sides by non-conductive ceramic material; said buried passive components being interconnected with other buried passive components by way of at least one interconnection means selected from the class consisting of vias and conductive structures; said buried passive components being connected to other components which are not buried through interconnection contact pads which are located on a surface of said low temperature co-fired ceramic structure.