US5751555A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic component having reduced capacitance
Assignee: NXP USA Inc
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Filing: 1996-08-19
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Granted: 1998-05-12
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Expires: 2016-08-19
Abstract
Abstract An electronic component with reduced capacitance includes a substrate (12) with an interconnect line (14), an additional substrate (11) with an interconnect line (13) wherein the substrate (12) overlies the additional substrate (11), an electronic device (15) overlying the substrate (12) and electrically coupled to the interconnect line (14) of the substrate (12), and an additional electronic device (17) having a lead (23) and an additional lead (26) wherein the lead (23) overlies the substrate (12) and is electrically coupled to the interconnect line (14) of the substrate (12) and wherein the additional lead (26) overlies the additional substrate (11) and is electrically coupled to the interconnect line (13) of the additional substrate (11).
Inventors
- 👤 Henry L. Pfizenmayer
- 👤 Frederick C. Wernett, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:11
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/0213; H05K1/0216; H05K1/145; H05K2201/00; H05K2201/07; H05K2201/0776; H05K2201/0792; H05K2201/10; H05K2201/10007; H05K2201/1003; H05K2201/10166; H05K2201/10431; H05K2201/10507; H05K2201/10515; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3431; H05K3/3442; H05K3/36; H05K3/368
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
127 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate; and a third electronic device electrically coupled to the electrically conductive path of the second substrate, the third electronic device underlying the second electronic device and overlying the second substrate.
Claim 2
Dependent Claim
127 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate; and a third electronic device electrically coupled to the electrically conductive path of the second substrate, the third electronic device underlying the second electronic device and overlying the second substrate.
Claim 3
Dependent Claim
28 words
The electronic component of claim 1 wherein an end portion of the second lead is absent over the first substrate and is bent underneath the second electronic device.
Claim 4
Dependent Claim
113 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein an end portion of the second lead is located underneath the second electronic device.
Claim 5
Dependent Claim
113 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein an end portion of the second lead is located underneath the second electronic device.
Claim 6
Dependent Claim
20 words
The electronic component of claim 3 wherein an end portion of the first lead points away from the second lead.
Claim 7
Dependent Claim
125 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein the second electronic device includes a third lead wherein the third lead is devoid of direct physical contact with the first substrate and the second substrate.
Claim 8
Dependent Claim
125 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein the second electronic device includes a third lead wherein the third lead is devoid of direct physical contact with the first substrate and the second substrate.
Claim 9
Dependent Claim
27 words
The electronic component of claim 5 wherein the electrically conductive path of the first substrate is electrically coupled to the electrically conductive path of the second substrate.
Claim 10
Dependent Claim
108 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein the first lead is shorter than the second lead.
Claim 11
Dependent Claim
108 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein the first lead is shorter than the second lead.
Claim 12
Dependent Claim
125 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein the first substrate has a lower dielectric constant than the second substrate and wherein the first substrate has a higher thermal conductivity than the second substrate.
Claim 13
Dependent Claim
125 words
An electronic component comprising: a first substrate having an electrically conductive path; a second substrate having an electrically conductive path, the first substrate overlying the second substrate; a first electronic device overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate; and a second electronic device having a first lead and a second lead, the first lead overlying the first substrate and electrically coupled to the electrically conductive path of the first substrate, the second lead overlying the second substrate and electrically coupled to the electrically conductive path of the second substrate, wherein the first substrate has a lower dielectric constant than the second substrate and wherein the first substrate has a higher thermal conductivity than the second substrate.
Claim 14
Dependent Claim
192 words
An electronic component comprising: a first electrically insulative substrate having metal lines; a transistor mounted over the first electrically insulative substrate and electrically coupled to a first one of the metal lines of the first electrically insulative substrate and thermally coupled to the first electrically insulative substrate; a second electrically insulative substrate having metal lines wherein the first electrically insulative substrate is mounted over the second electrically insulative substrate and wherein a portion of the metal lines of the first electrically insulative substrate are electrically coupled to a portion of the metal lines of the second electrically insulative substrate; a transformer mount having a plurality of leads wherein a first one of the plurality of leads is mounted over and electrically coupled to a second one of the metal lines of the first electrically insulative substrate and wherein a second one of the plurality of leads is mounted over and electrically coupled to a first one of the metal lines of the second electrically insulative substrate; a transformer core mounted over the transformer mount; and a plurality of wires wrapped around the transformer core and electrically coupled to the plurality of leads.
Claim 15
Dependent Claim
192 words
An electronic component comprising: a first electrically insulative substrate having metal lines; a transistor mounted over the first electrically insulative substrate and electrically coupled to a first one of the metal lines of the first electrically insulative substrate and thermally coupled to the first electrically insulative substrate; a second electrically insulative substrate having metal lines wherein the first electrically insulative substrate is mounted over the second electrically insulative substrate and wherein a portion of the metal lines of the first electrically insulative substrate are electrically coupled to a portion of the metal lines of the second electrically insulative substrate; a transformer mount having a plurality of leads wherein a first one of the plurality of leads is mounted over and electrically coupled to a second one of the metal lines of the first electrically insulative substrate and wherein a second one of the plurality of leads is mounted over and electrically coupled to a first one of the metal lines of the second electrically insulative substrate; a transformer core mounted over the transformer mount; and a plurality of wires wrapped around the transformer core and electrically coupled to the plurality of leads.
Claim 16
Dependent Claim
40 words
The electronic component of claim 9 wherein the first electrically insulative substrate is comprised of aluminum oxide and wherein the second electrically insulative substrate is comprised of a material selected from the group consisting of beryllium oxide or aluminum nitride.
Claim 17
Dependent Claim
52 words
The electronic component of claim 9 wherein the transformer mount has a first side and a second side opposite the first side and wherein the first one of the plurality of leads extends from the first side and wherein the second one of the plurality of leads extends from the second side.
Claim 18
Dependent Claim
32 words
The electronic component of claim 9 wherein the second one of the plurality of leads is bent underneath the transformer mount and points towards the first one of the plurality of leads.
Claim 19
Dependent Claim
44 words
The electronic component of claim 9 further comprising an electronic device electrically coupled to at least one of the metal lines of the second electrically insulative substrate wherein the electronic device is located underneath the transformer mount and over the second electrically insulative substrate.
Claim 20
Dependent Claim
65 words
The electronic component of claim 9 wherein a third one of the plurality of leads is mounted over and electrically coupled to a third one of the metal lines of the first electrically insulative substrate and wherein a fourth one of the plurality of leads is mounted over and electrically coupled to a second one of the metal lines of the second electrically insulative substrate.
Claim 21
Dependent Claim
44 words
The electronic component of claim 1 wherein the second electronic device includes a third lead devoid of direct physical contact with the electrically conductive paths of the first and second substrates and wherein the third electronic device is devoid of overlying the first substrate.
Claim 22
Dependent Claim
29 words
The electronic component of claim 1 wherein the first lead is shorter than the second lead and wherein the third electronic device is devoid of overlying the first substrate.
Claim 23
Dependent Claim
50 words
The electronic component of claim 3 wherein the second electronic component includes a third lead devoid of direct physical contact with the electrically conductive paths of the first and second substrates and wherein a dielectric constant of the first substrate is lower than a dielectric constant of the second substrate.
Claim 24
Dependent Claim
48 words
The electronic component of claim 5 further comprising a semiconductor device underlying the second electronic device, electrically coupled to the second substrate, and absent over the first substrate wherein the first lead of the second electronic device is shorter than the second lead of the second electronic device.
Claim 25
Dependent Claim
37 words
The electronic component of claim 7 wherein an end portion of the second lead is located underneath the second electronic device wherein the end portion is physically coupled to the electrically conductive path of the second substrate.
Claim 26
Dependent Claim
31 words
The electronic component of claim 8 wherein the second electronic device includes a third lead wherein the third lead is devoid of direct physical contact with the first and second substrates.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-11 | 2001-11-10 | 2002-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-11 | 2005-11-10 | 2006-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-11 | 2009-11-10 | 2010-05-12 | $7700.00 | Window Closed / Lapsed |