Patent US5751262A successfully refreshed from Google Patents.
US5751262A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for testing emissive cathodes
Assignee: Round Rock Research LLC
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Filing: 1997-08-15
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Granted: 1998-05-12
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Expires: 2017-08-15
Abstract
Abstract A method of electrically testing pixel functionality is provided comprising releasably disposing a wafer in a socket. The wafer has at least one baseplate comprised of cathode emitters arranged in pixels. The socket has pads. The socket pads are contacted with test pins, and each of the pixels is addressed individually, thereby causing the cathode emitters to emit electrons in a current. The current is collected from each of the pixels on an anode screen. Alternatively, the anode card may have pins, and these pins contact pads on the baseplate. The baseplate, or substrate with baseplates, does not require a socket with pins.
Inventors
- 👤 Jim Browning
- 👤 Charles M. Watkins
- 👤 David A. Cathey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:11
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/24; G01R31/25; G01R31/257; G01R35/00; G01R35/002; Y; Y10; Y10S; Y10S345/00; Y10S345/904
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
96 words
A method of testing a field emitter array, said method comprising the following steps of: releasably disposing a wafer in a socket, said wafer having at least one baseplate comprising cathode emitters arranged in pixels, and an extraction grid spaced above said cathode emitters, said socket having pads; contacting said socket pads with test pins; addressing each of said pixels individually, to cause said cathode emitters to emit electrons in a current; collecting and measuring said current from each of said pixels on an anode screen, and comparing each said current measurement to an expected value.
Claim 2
Independent Claim
96 words
A method of testing a field emitter array, said method comprising the following steps of: releasably disposing a wafer in a socket, said wafer having at least one baseplate comprising cathode emitters arranged in pixels, and an extraction grid spaced above said cathode emitters, said socket having pads; contacting said socket pads with test pins; addressing each of said pixels individually, to cause said cathode emitters to emit electrons in a current; collecting and measuring said current from each of said pixels on an anode screen, and comparing each said current measurement to an expected value.
Claim 3
Dependent Claim
21 words
The method of testing a field emitter array, according to claim 1, wherein said pads are approximately 100×100 μm in size.
Claim 4
Dependent Claim
20 words
The method of testing a field emitter array, according to claim 1, wherein said cathode emitters have been burned in.
Claim 5
Dependent Claim
30 words
The method of testing a field emitter array, according to claim 1, wherein said cathode emitters are cleaned in at least one of hydrogen (H 2 ) and argon (Ar).
Claim 6
Dependent Claim
22 words
The method of testing a field emitter array, according to claim 1, wherein said cathode emitters are baked prior to said addressing.
Claim 7
Dependent Claim
23 words
The method of testing a field emitter array, according to claim 1, further comprising the step of: removing said wafer from said socket.
Claim 8
Independent Claim
99 words
The method of electrically testing pixel functionality, said method comprising the following steps of: releasably disposing a wafer in a socket, said wafer having at least one baseplate comprised of cathode emitters arranged in pixels said socket having pads: contacting said socket pads with test pins; addressing each of said pixels individually, thereby causing said cathode emitters to emit electrons in a current; and collecting said current from each of said pixels on an anode screen, wherein a very high vacuum exists between said socket and said anode screen, said very high vacuum being below 1 motor of pressure.
Claim 9
Independent Claim
99 words
The method of electrically testing pixel functionality, said method comprising the following steps of: releasably disposing a wafer in a socket, said wafer having at least one baseplate comprised of cathode emitters arranged in pixels said socket having pads: contacting said socket pads with test pins; addressing each of said pixels individually, thereby causing said cathode emitters to emit electrons in a current; and collecting said current from each of said pixels on an anode screen, wherein a very high vacuum exists between said socket and said anode screen, said very high vacuum being below 1 motor of pressure.
Claim 10
Dependent Claim
20 words
The method of electrically testing pixel functionality, according to claim 7, wherein said pads are approximately 100×100 μm in size.
Claim 11
Dependent Claim
19 words
The method of electrically testing pixel functionality, according to claim 7, wherein said cathode emitters have been burned in.
Claim 12
Dependent Claim
29 words
The method of electrically testing pixel functionality, according to claim 7, wherein said cathode emitters are cleaned in at least one of hydrogen (H 2 ) and argon (Ar).
Claim 13
Dependent Claim
21 words
The method of electrically testing pixel functionality, according to claim 7, wherein said cathode emitters are baked prior to said addressing.
Claim 14
Dependent Claim
22 words
The method of electrically testing pixel functionality, according to claim 7, further comprising the step of: removing said wafer from said socket.
Claim 15
Independent Claim
85 words
A method of electrically testing pixel functionality in a display, said method comprising the following steps of: releasably disposing a wafer in a socket, said wafer having at least one baseplate comprised of pixels, each of said pixels comprising at least one emitter, said socket having pads; contacting said socket pads with test pins; addressing each of said pixels individually, thereby causing said pixels to emit electrons in a current; collecting said current from each of said pixels on an anode; and measuring said current.
Claim 16
Independent Claim
85 words
A method of electrically testing pixel functionality in a display, said method comprising the following steps of: releasably disposing a wafer in a socket, said wafer having at least one baseplate comprised of pixels, each of said pixels comprising at least one emitter, said socket having pads; contacting said socket pads with test pins; addressing each of said pixels individually, thereby causing said pixels to emit electrons in a current; collecting said current from each of said pixels on an anode; and measuring said current.
Claim 17
Dependent Claim
20 words
The method of electrically testing pixel functionality, according to claim 13, wherein said pads are approximately 100×100 μm in size.
Claim 18
Dependent Claim
18 words
The method of electrically testing pixel functionality, according to claim 13, wherein said pixels have been burned in.
Claim 19
Dependent Claim
20 words
The method of electrically testing pixel functionality, according to claim 13, wherein said pixels are baked prior to said addressing.
Claim 20
Dependent Claim
22 words
The method of electrically testing pixel functionality, according to claim 13, further comprising the step of: removing said wafer from said socket.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-11 | 2001-11-10 | 2002-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-11 | 2005-11-10 | 2006-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-11 | 2009-11-10 | 2010-05-12 | $7700.00 | Window Closed / Lapsed |