Semiconductor diode device with non-planar heatsink and method of manufacture

Claim 2

A semiconductor diode device comprising: a p-n junction having a first region and a second region; a first heatsink coupled to the first region of the p-n junction, the first heatsink having a first dome-shaped surface facing towards the p-n junction; and a second heatsink coupled to the second region of the p-n junction, the second heatsink having a second dome-shaped surface and facing towards the p-n junction.

Claim 3

The semiconductor diode device according to claim 1, wherein the first region is n-type, and wherein the second region is p-type.

Claim 4

The semiconductor diode device according to claim 1, further comprising an encapsulant covering the p-n junction, a first portion of the first dome-shaped surface of the first heatsink, and a second portion of the second dome-shaped surface of the second heatsink.

Claim 5

The semiconductor diode device according to claim 3, wherein the first heatsink has a protrusion circumscribing the first dome-shaped surface, the protrusion covered by the encapsulant.

Claim 6

The semiconductor diode device according to claim 1, further comprising a semiconductor substrate containing the p-n junction, the semiconductor substrate having a surface facing the first dome-shaped surface of the first heatsink, wherein a first surface area of the first dome-shaped surface of the first heatsink is larger than a second surface area of the surface of the semiconductor substrate.

Claim 7

The semiconductor diode device according to claim 5, wherein a minimum distance between the first heatsink and the semiconductor substrate is approximately 25-75 microns.

Claim 8

The semiconductor diode device according to claim 1, wherein the first and second heatsinks are electrical contacts for the p-n junction.

Claim 9

The semiconductor diode device according to claim 1, wherein the first and second heatsinks are substantially symmetrical.

Claim 10

A semiconductor diode device comprising: a p-n junction having a first region and a second region; a first heatsink coupled to the first region of the p-n junction, the first heatsink having a first dome-shaped surface; a second heatsink coupled to the second region of the p-n junction, the second heatsink having a second dome-shaped surface; and a semiconductor substrate containing the p-n junction, the semiconductor substrate having a surface facing the first dome-shaped surface of the first heatsink, wherein a first surface area of the first dome-shaped surface of the first heatsink is larger than a second surface area of the surface of the semiconductor substrate, wherein a minimum distance between the first heatsink and the semiconductor substrate is approximately 25-75 microns, and wherein a distance between the first heatsink and the semiconductor substrate increases from a central region of the semiconductor substrate to an outer region of the semiconductor substrate.

Claim 11

A semiconductor diode device comprising: a p-n junction having a first region and a second region; a first heatsink coupled to the first region of the p-n junction, the first heatsink having a first dome-shaped surface; a second heatsink coupled to the second region of the p-n junction, the second heatsink having a second dome-shaped surface; and a semiconductor substrate containing the p-n junction, the semiconductor substrate having a surface facing the first dome-shaped surface of the first heatsink, wherein a first surface area of the first dome-shaped surface of the first heatsink is larger than a second surface area of the surface of the semiconductor substrate, wherein a minimum distance between the first heatsink and the semiconductor substrate is approximately 25-75 microns, and wherein a distance between the first heatsink and the semiconductor substrate increases from a central region of the semiconductor substrate to an outer region of the semiconductor substrate.

Claim 12

A semiconductor component comprising: a semiconductor substrate having a surface with a region and an outer perimeter; a heatsink having a surface facing towards the surface of the semiconductor substrate wherein a distance between the surface of the heatsink and the surface of the semiconductor substrate increases from the region of the semiconductor substrate to the outer perimeter of the semiconductor substrate; and an encapsulant covering the semiconductor substrate and the heatsink.

Claim 13

A semiconductor component comprising: a semiconductor substrate having a surface with a region and an outer perimeter; a heatsink having a surface facing towards the surface of the semiconductor substrate wherein a distance between the surface of the heatsink and the surface of the semiconductor substrate increases from the region of the semiconductor substrate to the outer perimeter of the semiconductor substrate; and an encapsulant covering the semiconductor substrate and the heatsink.

Claim 14

The semiconductor component according to claim 10, further comprising solder between the semiconductor substrate and the heatsink.

Claim 15

The semiconductor component according to claim 11, wherein the solder forms a plano-concave lens shaped solder joint between the surface of the semiconductor substrate and the round surface of the heatsink.

Claim 16

The semiconductor component according to claim 10, wherein the heatsink has a protrusion covered by the encapsulant.

Claim 17

A semiconductor component comprising: a semiconductor substrate having a surface; and a heatsink having a round surface adjacent to the surface of the semiconductor substrate wherein the round surface has a flat portion, the flat portion having a surface area less than a surface area of the surface of the semiconductor substrate.

Claim 18

A semiconductor component comprising: a semiconductor substrate having a surface; and a heatsink having a round surface adjacent to the surface of the semiconductor substrate wherein the round surface has a flat portion, the flat portion having a surface area less than a surface area of the surface of the semiconductor substrate.

Claim 19

The semiconductor component of claim 14 wherein the semiconductor substrate overlies the flat portion of the heatsink.

Claim 20

A semiconductor component comprising: a semiconductor substrate having a p-n junction, a first surface, and a second surface opposite the first surface, wherein a p-type region of the p-n junction extends to the first surface and wherein an n-type region of the p-n junction extends to the second surface; a first solder joint adjacent to the first surface of the semiconductor substrate; a second solder joint adjacent to the second surface of the semiconductor substrate; a first heatsink having a first curved surface facing towards the first solder joint; a second heatsink having a second curved surface facing towards the second solder joint; and a packaging material encapsulating the semiconductor substrate, the first solder joint, the second solder joint, a first portion of the first curved surface of the first heatsink, and a second portion of the second curved surface of the second heatsink.

Claim 21

A semiconductor component comprising: a semiconductor substrate having a p-n junction, a first surface, and a second surface opposite the first surface, wherein a p-type region of the p-n junction extends to the first surface and wherein an n-type region of the p-n junction extends to the second surface; a first solder joint adjacent to the first surface of the semiconductor substrate; a second solder joint adjacent to the second surface of the semiconductor substrate; a first heatsink having a first curved surface facing towards the first solder joint; a second heatsink having a second curved surface facing towards the second solder joint; and a packaging material encapsulating the semiconductor substrate, the first solder joint, the second solder joint, a first portion of the first curved surface of the first heatsink, and a second portion of the second curved surface of the second heatsink.

Claim 22

The semiconductor component according to claim 16, wherein the first heatsink is a portion of a first wire and wherein the second heatsink is a portion of a second wire.

Claim 23

The semiconductor component according to claim 16, wherein the first heatsink has a first protrusion around a first perimeter of the first curved surface and wherein the second heatsink has a second protrusion around a second perimeter of the second curved surface.

Claim 24

A semiconductor component comprising: a semiconductor substrate having a p-n junction, a first surface, and a second surface opposite the first surface, wherein a p-type region of the p-n junction extends to the first surface and wherein an n-type region of the p-n junction extends to the second surface; a first solder joint adjacent to the first surface of the semiconductor substrate; a second solder joint adjacent to the second surface of the semiconductor substrate; a first heatsink having a first curved surface adjacent to the first solder joint; a second heatsink having a second curved surface adjacent to the second solder joint; and a packaging material encapsulating the semiconductor substrate, the first solder joint, the second solder joint, a first portion of the first curved surface of the first heatsink, and a second portion of the second curved surface of the second heatsink wherein the first and second curved surfaces are portions of a sphere having a radius of approximately 3-7 centimeters, wherein the first curved surface has a flat portion, wherein the flat portion has a diameter of approximately 0.13-0.2 centimeters, wherein the flat portion is positioned such that a first distance between the flat portion and the semiconductor substrate is smaller than a second distance between the first curved surface and the semiconductor substrate, and wherein the first and second heatsinks each have a height of approximately 0.1-0.6 centimeters and a diameter of approximately 0.3-0.9 centimeters.

Claim 25

A semiconductor component comprising: a semiconductor substrate having a p-n junction, a first surface, and a second surface opposite the first surface, wherein a p-type region of the p-n junction extends to the first surface and wherein an n-type region of the p-n junction extends to the second surface; a first solder joint adjacent to the first surface of the semiconductor substrate; a second solder joint adjacent to the second surface of the semiconductor substrate; a first heatsink having a first curved surface adjacent to the first solder joint; a second heatsink having a second curved surface adjacent to the second solder joint; and a packaging material encapsulating the semiconductor substrate, the first solder joint, the second solder joint, a first portion of the first curved surface of the first heatsink, and a second portion of the second curved surface of the second heatsink wherein the first and second curved surfaces are portions of a sphere having a radius of approximately 3-7 centimeters, wherein the first curved surface has a flat portion, wherein the flat portion has a diameter of approximately 0.13-0.2 centimeters, wherein the flat portion is positioned such that a first distance between the flat portion and the semiconductor substrate is smaller than a second distance between the first curved surface and the semiconductor substrate, and wherein the first and second heatsinks each have a height of approximately 0.1-0.6 centimeters and a diameter of approximately 0.3-0.9 centimeters.

Claim 26

A semiconductor component comprising: a semiconductor substrate having a surface; and a heatsink having a curved surface facing towards the surface of the semiconductor substrate wherein the curved surface of the heatsink has a flat portion and wherein the semiconductor substrate overlies the flat portion.

Claim 27

A semiconductor component comprising: a semiconductor substrate having a surface; and a heatsink having a curved surface facing towards the surface of the semiconductor substrate wherein the curved surface of the heatsink has a flat portion and wherein the semiconductor substrate overlies the flat portion.