US4093958A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device assembly with improved fatigue resistance
Assignee: Motorola Solutions Inc
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Filing: 1976-12-09
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Granted: 1978-06-06
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Expires: 1996-12-09
Abstract
Abstract A semiconductor diode package which permits improved thermal and mechanical connection in soldered assemblies. Structural features which result in this improvement comprise double contacting studs having tapered end portions and an area somewhat larger than the semiconductor diode, and an organic encapsulant which seals the diode and the ends of the studs soldered to the diode while leaving the tapered ends of the studs exposed.
Inventors
- 👤 Joseph F. Riccio, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 06:57
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W70/00; H10W70/20; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
47 words
An axial-leaded semiconductor assembly comprising conducting studs soldered directly to the major surfaces of a semiconductor chip, each of said studs having a cross-sectional area larger than said major surface and having a tapered extremity away from said surfaces, said assembly being substantially symmetrical about said chip.
Claim 2
Dependent Claim
47 words
An axial-leaded semiconductor assembly comprising conducting studs soldered directly to the major surfaces of a semiconductor chip, each of said studs having a cross-sectional area larger than said major surface and having a tapered extremity away from said surfaces, said assembly being substantially symmetrical about said chip.
Claim 3
Dependent Claim
19 words
The assembly of claim 1, where said tapered extremities are substantially symmetrical about the major axis of said assembly.
Claim 4
Dependent Claim
28 words
The assembly of claim 1, where major portions of said tapered extremities lie at an angle between 3° and 8° to a plane parallel to said major surfaces.
Claim 5
Dependent Claim
26 words
The assembly of claim 3 where the extremities of said studs away from said surfaces further having plane portions parallel to the plane of said surfaces.
Claim 6
Dependent Claim
16 words
The assembly of claim 1 further including an organic encapsulant encircling said chip and said studs.
Claim 7
Dependent Claim
19 words
The assembly of claim 5 further including locking means radially inhomogeneous about the major axis for retaining said encapsulant.
Claim 8
Dependent Claim
14 words
The assembly of claim 1 further including conducting members soldered to said tapered extremities.
Claim 9
Dependent Claim
25 words
The assembly of claim 7, where the thickness of the solder fillet between the conductive members and the tapered extremities varies by about 7-20 mils.
Claim 10
Dependent Claim
28 words
A semiconductor assembly comprising a semiconductor chip and tapered conducting means each soldered to conducting surfaces to control the solder thickness variation between about 7 and 20 mils.
Claim 11
Dependent Claim
28 words
A semiconductor assembly comprising a semiconductor chip and tapered conducting means each soldered to conducting surfaces to control the solder thickness variation between about 7 and 20 mils.
Claim 12
Dependent Claim
17 words
The assembly of claim 9 where said tapered conducting means are each soldered to said semiconductor chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-06-05 | 1981-12-05 | 1982-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-06-05 | 1985-12-05 | 1986-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-06-05 | 1989-12-05 | 1990-06-06 | $7700.00 | Window Closed / Lapsed |