US5749772A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for polishing wafer
Assignee: Lapis Semiconductor Co Ltd
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Filing: 1996-12-02
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Granted: 1998-05-12
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Expires: 2016-12-02
Abstract
Abstract A polishing pad is conditioned using a conditioning disc whose temperature is controlled upon Chemical Mechanical Polish. The temperature of the polishing pad remains unchanged upon conditioning and uniform CMP can be carried out.
Inventors
- 👤 Kimiaki Shimokawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:01
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; H; H10; H10P; H10P52/00; B24B37/00; B24B37/04
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
67 words
A method of polishing a wafer, comprising the following steps: a step for pressing the wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer; a step for controlling a conditioning tool to a predetermined temperature; and a step for conditioning the polishing portion using the conditioning tool.
Claim 2
Independent Claim
67 words
A method of polishing a wafer, comprising the following steps: a step for pressing the wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer; a step for controlling a conditioning tool to a predetermined temperature; and a step for conditioning the polishing portion using the conditioning tool.
Claim 3
Dependent Claim
24 words
A method according to claim 1, wherein said predetermined temperature is a stable temperature of the polishing portion in said wafer surface polishing step.
Claim 4
Dependent Claim
14 words
A method according to claim 2, wherein said stable temperature is about 28° C.
Claim 5
Dependent Claim
58 words
A wafer polishing apparatus for pressing a wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer, comprising: a conditioning tool for conditioning the polishing portion; and a control mechanism for controlling said conditioning tool to a predetermined temperature.
Claim 6
Dependent Claim
58 words
A wafer polishing apparatus for pressing a wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer, comprising: a conditioning tool for conditioning the polishing portion; and a control mechanism for controlling said conditioning tool to a predetermined temperature.
Claim 7
Dependent Claim
20 words
A wafer polishing apparatus according to claim 4, wherein said control mechanism is a heater provided within said conditioning tool.
Claim 8
Dependent Claim
26 words
A wafer polishing apparatus according to claim 4, wherein said predetermined temperature is a stable temperature of the polishing portion in a wafer surface polishing step.
Claim 9
Dependent Claim
16 words
A wafer polishing apparatus according to claim 6, wherein said stable temperature is about 28° C.
Claim 10
Dependent Claim
64 words
A wafer polishing apparatus for pressing a wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer, comprising: a conditioning tool for conditioning the polishing portion; and a water tank storing therein a liquid of a predetermined temperature, into which said conditioning tool is immersed.
Claim 11
Dependent Claim
64 words
A wafer polishing apparatus for pressing a wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer, comprising: a conditioning tool for conditioning the polishing portion; and a water tank storing therein a liquid of a predetermined temperature, into which said conditioning tool is immersed.
Claim 12
Dependent Claim
30 words
A wafer polishing apparatus according to claim 8, wherein said predetermined temperature is a stable temperature of the polishing portion in a step for polishing the surface of the wafer.
Claim 13
Dependent Claim
16 words
A wafer polishing apparatus according to claim 9, wherein said stable temperature is about 28° C.
Claim 14
Dependent Claim
26 words
A wafer polishing apparatus according to claim 8, further comprising a control device for controlling the temperature of the liquid which flows into said water tank.
Claim 15
Dependent Claim
17 words
A wafer polishing apparatus according to claim 8, further comprising a heater provided within said water tank.
Claim 16
Dependent Claim
69 words
A wafer polishing apparatus for pressing a wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer, comprising: a conditioning tool for conditioning the polishing portion; and a control device for controlling the temperature of a liquid; said conditioning tool having a channel defined thereinside through which the liquid flows.
Claim 17
Dependent Claim
69 words
A wafer polishing apparatus for pressing a wafer against a polishing portion on a polish wheel and applying relative motion between the wafer and the polish wheel so as to polish the surface of the wafer, comprising: a conditioning tool for conditioning the polishing portion; and a control device for controlling the temperature of a liquid; said conditioning tool having a channel defined thereinside through which the liquid flows.
Claim 18
Dependent Claim
30 words
A wafer polishing apparatus according to claim 13, wherein said predetermined temperature is a stable temperature of the polishing portion in a step for polishing the surface of the wafer.
Claim 19
Dependent Claim
16 words
A wafer polishing apparatus according to claim 14, wherein said stable temperature is about 28° C.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-11 | 2001-11-10 | 2002-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-11 | 2005-11-10 | 2006-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-11 | 2009-11-10 | 2010-05-12 | $7700.00 | Window Closed / Lapsed |