Patent US5745984A successfully refreshed from Google Patents.
US5745984A
Expired / Lapsed
US
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Method for making an electronic module
Assignee: Lockheed Martin Corp
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Filing: 1995-07-10
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Granted: 1998-05-05
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Expires: 2015-07-10
Abstract
Abstract A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.
Inventors
- 👤 Herbert Stanley Cole, Jr.
- 👤 Theresa Ann Sitnik-Nieters
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W70/099; H10W70/60; H10W70/611; H10W70/614; H10W74/00; H10W74/40; H10W74/47; H10W90/00; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/0183; H05K2201/0195; H05K3/38; H05K3/386; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07339; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/90; H10W72/941; H10W72/9413; H10W90/701; H10W90/731; H10W90/734; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49146; Y10T29/49155; Y10T29/49156; Y10T29/49163; Y10T29/49165
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
204 words
A method for making an electronic circuit module, comprising the steps of: disposing a plurality of electronic chips on a substrate, the chips including contact pads; adhesively laminating a first thermoset polymer film layer, over the chips and areas of the substrate surface surrounding the chips, with a thermoplastic adhesive; providing a plurality of via openings over at least some of the contact pads in the first polymer film/adhesive layer; providing a first pattern of electrical conductors on the first film layer so that conductors extend between the via openings so as to electrically connect selected contact pads; adhesively laminating at least one additional polymer film over at least a portion of each of the first polymer film layer and the first electrical conductor pattern, with a benzocyclobutene polymer adhesive; providing a plurality of additional via openings in each additional polymer/benzocyclobutene polymer film, the openings being disposed over at least some of electrical conductors of an associated next lower layer; and providing an additional pattern of electrical conductors on each of the at least one additional polymer film so that conductors extend into the associated via openings so as to electrically connect with some of the electrical conductors of the associated next lower layer.
Claim 2
Independent Claim
204 words
A method for making an electronic circuit module, comprising the steps of: disposing a plurality of electronic chips on a substrate, the chips including contact pads; adhesively laminating a first thermoset polymer film layer, over the chips and areas of the substrate surface surrounding the chips, with a thermoplastic adhesive; providing a plurality of via openings over at least some of the contact pads in the first polymer film/adhesive layer; providing a first pattern of electrical conductors on the first film layer so that conductors extend between the via openings so as to electrically connect selected contact pads; adhesively laminating at least one additional polymer film over at least a portion of each of the first polymer film layer and the first electrical conductor pattern, with a benzocyclobutene polymer adhesive; providing a plurality of additional via openings in each additional polymer/benzocyclobutene polymer film, the openings being disposed over at least some of electrical conductors of an associated next lower layer; and providing an additional pattern of electrical conductors on each of the at least one additional polymer film so that conductors extend into the associated via openings so as to electrically connect with some of the electrical conductors of the associated next lower layer.
Claim 3
Dependent Claim
95 words
The method of claim 1, where the step of disposing a plurality of electronic chips on a substrate surface further includes the step of forming chipwells in the substrate surface and disposing the chips into the chipwells, and where the first polymer film is polyimide, and further where the step of adhesively laminating the first polymer film further comprises the steps of applying a thermoplastic adhesive to the polyimide film, placing the polyimide/adhesive composite onto the substrate and applying heat and pressure sufficient to cause the thermoplastic adhesive to flow and bond to the substrate.
Claim 4
Dependent Claim
13 words
The method of claim 2, where the thermoplastic adhesive is a plasticized polyetherimide.
Claim 5
Dependent Claim
83 words
The method of claim 2, where each of the at least one additional polymer film is polyimide, and where the step of adhesively laminating each of the at least one additional polymer film further comprises the steps of applying a layer of benzocyclobutene polymer adhesive to each respective polymer film, placing the polyimide/benzocyclobutene composite onto an associated lower layer and applying heat and pressure sufficient to cause the thermosetting adhesive to flow and bond the additional polymer film to the associated lower layer.
Claim 6
Dependent Claim
28 words
The method of claim 4, where, prior to lamination, the benzocyclobutene polymer adhesive for each of the at least one additional polymer film is in a B-staged state.
Claim 7
Dependent Claim
50 words
The method of claim 5, where the step of adhesively laminating each of the at least one additional polymer film occurs at a temperature of at least 190° C. and a pressure of at least 5 psi and is held at this temperature and pressure for at least 2 hours.
Claim 8
Dependent Claim
50 words
The method of claim 5, where the step of adhesively laminating each of the at least one additional polymer film occurs at a temperature of at least 200° C. and a pressure of at least 5 psi and is held at this temperature and pressure for at least 90 minutes.
Claim 9
Dependent Claim
47 words
The method of claim 5, where the step of adhesively laminating each of the additional polymer films occurs at a temperature of at least 230° C. and a pressure of at least 5 psi and is held at this temperature and pressure for at least 30 minutes.
References Cited (Backward Citations)
US4783695A
Cited
US5108825A
Cited
US5169678A
Cited
US5388328A
Cited
US5255431A
Cited
US5353498A
Cited
US5546654A
Cited
US5564181A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-04 | 2001-11-03 | 2002-05-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-04 | 2005-11-03 | 2006-05-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-04 | 2009-11-03 | 2010-05-05 | $7700.00 | Window Closed / Lapsed |