US5745334A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Capacitor formed within printed circuit board
Assignee: International Business Machines Corp
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Filing: 1996-03-25
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Granted: 1998-04-28
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Expires: 2016-03-25
Abstract
Abstract A multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta 2 O 5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta 2 O 5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta 2 O 5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta 2 O 5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta 2 O 5 or HfO layer opposite the second Ta or Hf layer, and a third dielectric layer on the fourth metallic layer opposite the second Ta 2 O 5 or HfO layer.
Inventors
- 👤 Joseph Gerard Hoffarth
- 👤 John Matthew Lauffer
- 👤 Issa Said Mahmoud, deceased
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:21
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2203/00; H05K2203/03; H05K2203/0315; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H05K3/46; H05K3/4611
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
99 words
A multi-layer printed circuit board comprising: a first copper layer; a Ta or Hf layer on one face of said first copper layer; a Ta 2 O 5 or HfO layer on a face of said Ta or Hf layer, respectively, opposite said first copper layer; a second copper layer on said Ta 2 O 5 or HfO layer opposite said Ta or Hf layer; a first dielectric layer on said first copper layer opposite said Ta or Hf layer; and a second dielectric layer on said second copper layer opposite said Ta 2 O 5 or HfO layer.
Claim 2
Dependent Claim
99 words
A multi-layer printed circuit board comprising: a first copper layer; a Ta or Hf layer on one face of said first copper layer; a Ta 2 O 5 or HfO layer on a face of said Ta or Hf layer, respectively, opposite said first copper layer; a second copper layer on said Ta 2 O 5 or HfO layer opposite said Ta or Hf layer; a first dielectric layer on said first copper layer opposite said Ta or Hf layer; and a second dielectric layer on said second copper layer opposite said Ta 2 O 5 or HfO layer.
Claim 3
Dependent Claim
46 words
A multi-layer printed circuit board as set forth in claim 1 wherein all of said layers are integral with said printed circuit board and further comprising another layer of Ta 2 O 5 or HfO layer on side edges of said Ta or HfO layer, respectively.
Claim 4
Dependent Claim
26 words
A multi-layer printed circuit board as set forth in claim 1 wherein said Ta 2 O 5 or HfO layer is 0.1 to 2.0 microns thick.
Claim 5
Dependent Claim
23 words
A multi-layer printed circuit board as set forth in claim 1 wherein said Ta or Hf layer is 1 to 20 microns thick.
Claim 6
Dependent Claim
38 words
A multi-layer printed circuit board as set forth in claim 1 wherein said Ta 2 O 5 or HfO layer is 0.1 to 2.0 microns thick, and said Ta or Hf layer is 1 to 20 microns thick.
Claim 7
Dependent Claim
154 words
A multi-layer printed circuit board comprising: a first metallic layer: a Ta or Hf layer on one face of said first metallic layer; A Ta 2 O 5 or HfO layer on a face of said Ta or Hf layer, respectively, opposite said first metallic a second metallic layer on said Ta 2 O 5 or HfO layer opposite said Ta or Hf layer; a first dielectric layer on said first metallic layer opposite said Ta or Hf layer; a second dielectric layer on said second metallic layer opposite said Ta 2 ) 5 or HfO layer; a first conductive via which passes through said first or second dielectric layer and makes electrical contact with said first metallic layer but not said second metallic layer; and a second conductive via which passes through said first or second dielectric layer and makes electrical contact with said second metallic layer but not said first metallic layer.
Claim 8
Dependent Claim
154 words
A multi-layer printed circuit board comprising: a first metallic layer: a Ta or Hf layer on one face of said first metallic layer; A Ta 2 O 5 or HfO layer on a face of said Ta or Hf layer, respectively, opposite said first metallic a second metallic layer on said Ta 2 O 5 or HfO layer opposite said Ta or Hf layer; a first dielectric layer on said first metallic layer opposite said Ta or Hf layer; a second dielectric layer on said second metallic layer opposite said Ta 2 ) 5 or HfO layer; a first conductive via which passes through said first or second dielectric layer and makes electrical contact with said first metallic layer but not said second metallic layer; and a second conductive via which passes through said first or second dielectric layer and makes electrical contact with said second metallic layer but not said first metallic layer.
Claim 9
Dependent Claim
63 words
A multi-layer printed circuit board as set forth in claim 6 wherein: said first conductive via also passes through said second metallic layer, said Ta or Hf layer and said Ta 2 O 5 or HfO layer; and said second conductive via also passes through said first metallic layer, said Ta or Hf layer and said Ta 2 O 5 or HfO layer.
Claim 10
Dependent Claim
203 words
A multi-layer printed circuit board comprising: a first metallic layer; a first Ta or Hf layer on a face of said first metallic layer; a first Ta 2 O 5 or HfO layer on a face of said first Ta or Hf layer, respectively, opposite said first metallic layer; a second metallic layer on said Ta 2 O 5 or HfO layer opposite said first Ta or Hf layer; a first dielectric layer on said first metallic electrode layer opposite said first Ta of Hf layer; a second dielectric layer on said second metallic layer opposite said Ta 2 O 5 or HfO layer; a third metallic layer on said second dielectric layer opposite said second metallic layer; a second Ta or Hf layer on a face of said third metallic layer opposite said second dielectric layer; a second Ta 2 O 5 or HfO layer on a face of said second Ta or Hf layer, respectively, opposite said third metallic layer; a fourth metallic layer on said second Ta 2 O 5 or HfO layer opposite said second Ta or Hf layer; and a third dielectric layer on said fourth metallic layer opposite said second Ta 2 O 5 or HfO layer.
Claim 11
Dependent Claim
203 words
A multi-layer printed circuit board comprising: a first metallic layer; a first Ta or Hf layer on a face of said first metallic layer; a first Ta 2 O 5 or HfO layer on a face of said first Ta or Hf layer, respectively, opposite said first metallic layer; a second metallic layer on said Ta 2 O 5 or HfO layer opposite said first Ta or Hf layer; a first dielectric layer on said first metallic electrode layer opposite said first Ta of Hf layer; a second dielectric layer on said second metallic layer opposite said Ta 2 O 5 or HfO layer; a third metallic layer on said second dielectric layer opposite said second metallic layer; a second Ta or Hf layer on a face of said third metallic layer opposite said second dielectric layer; a second Ta 2 O 5 or HfO layer on a face of said second Ta or Hf layer, respectively, opposite said third metallic layer; a fourth metallic layer on said second Ta 2 O 5 or HfO layer opposite said second Ta or Hf layer; and a third dielectric layer on said fourth metallic layer opposite said second Ta 2 O 5 or HfO layer.
Claim 12
Dependent Claim
101 words
A multi-layer printed circuit board as set forth in claim 8 wherein said first metallic layer, said first Ta or Hf layer, said first Ta 2 O 5 or HfO layer, and said second metallic layer form a first capacitor, and said third metallic layer, said second Ta or Hf layer, said second Ta 2 O 5 or HfO layer, and said fourth metallic layer form a second capacitor, and further comprising a conductor connected between said first or second metallic layer and said third or fourth metallic layer to connect said first and second capacitors in parallel with each other.
Claim 13
Dependent Claim
38 words
A multi-layer printed circuit board as set forth in claim 8 wherein said Ta 2 O 5 or HfO layer is 0.1 to 2.0 microns thick, and said Ta or Hf layer is 1 to 20 microns thick.
Claim 14
Dependent Claim
67 words
A multi-layer printed circuit board as set forth in claim 8 wherein all of said layers are integral with said printed circuit board and further comprising a third Ta 2 O 5 or HfO layer on side edges of said first Ta or Hf layer, respectively, and a fourth Ta 2 O 5 or HfO layer on side edges of said second Ta or Hf layer, respectively.
Claim 15
Dependent Claim
24 words
A multi-layer printed circuit board as set forth in claim 8 wherein said first, second, third and fourth metallic layers are all copper layers.
Claim 16
Dependent Claim
263 words
A multi-layer printed circuit board comprising: a first metallic layer; a first Ta or Hf layer on a face of said first metallic layer; a first Ta 2 O 5 or HfO layer on a face of said first Ta or Hf layer, respectively, opposite said first metallic layer: a second metallic layer on said Ta 2 O 5 or HfO layer opposite said first Ta or Hf layer; a first dielectric layer on said first metallic electrode layer opposite said first Ta of Hf layer; a second dielectric layer on said second metallic layer opposite said Ta 2 O 5 or Hf layer; a third metallic layer on said second dielectric layer opposite said second metallic layer; a second Ta or Hf layer on a face of said third metallic layer opposite said second dielectric layer; a second Ta 2 O 5 or HfO layer on a face of said second Ta or Hf layer, respectively, opposite said third metallic layer; a fourth metallic layer on said second Ta 2 O 5 or HfO layer opposite said second Ta or Hf layer: a third dielectric layer on said fourth metallic layer opposite said second Ta 2 O 5 or HfO layer; a first conductive via passing through all of said layers and making an electrical connection to said first and fourth metallic layers but not said second or third metallic layers; and a second conductive via passing through all of said layers and making an electrical connection to said second and third metallic layers but not said first or fourth metallic layers.
Claim 17
Dependent Claim
263 words
A multi-layer printed circuit board comprising: a first metallic layer; a first Ta or Hf layer on a face of said first metallic layer; a first Ta 2 O 5 or HfO layer on a face of said first Ta or Hf layer, respectively, opposite said first metallic layer: a second metallic layer on said Ta 2 O 5 or HfO layer opposite said first Ta or Hf layer; a first dielectric layer on said first metallic electrode layer opposite said first Ta of Hf layer; a second dielectric layer on said second metallic layer opposite said Ta 2 O 5 or Hf layer; a third metallic layer on said second dielectric layer opposite said second metallic layer; a second Ta or Hf layer on a face of said third metallic layer opposite said second dielectric layer; a second Ta 2 O 5 or HfO layer on a face of said second Ta or Hf layer, respectively, opposite said third metallic layer; a fourth metallic layer on said second Ta 2 O 5 or HfO layer opposite said second Ta or Hf layer: a third dielectric layer on said fourth metallic layer opposite said second Ta 2 O 5 or HfO layer; a first conductive via passing through all of said layers and making an electrical connection to said first and fourth metallic layers but not said second or third metallic layers; and a second conductive via passing through all of said layers and making an electrical connection to said second and third metallic layers but not said first or fourth metallic layers.
Claim 18
Dependent Claim
59 words
A multi-layer printed circuit board as set forth in claim 13 further comprising: a fifth metallic layer on said first dielectric layer opposite said first metallic layer and electrically connected to one of said conductive vias; and a sixth metallic layer on said third dielectric layer opposite said fourth metallic layer and electrically connected to the other conductive via.
Claim 19
Dependent Claim
85 words
A multi-layer printed circuit board comprising: first and second, parallel copper layers; a Ta 2 O 5 or HfO layer sandwiched between and intimately connected to both said first and second copper layers, whereby there is no Ta or Hf layer between said first and second copper layers; a first dielectric layer on said first copper layer opposite said Ta 2 O 5 or HfO layer; and a second dielectric layer on said second copper layer opposite said Ta 2 O 5 or HfO layer.
Claim 20
Dependent Claim
85 words
A multi-layer printed circuit board comprising: first and second, parallel copper layers; a Ta 2 O 5 or HfO layer sandwiched between and intimately connected to both said first and second copper layers, whereby there is no Ta or Hf layer between said first and second copper layers; a first dielectric layer on said first copper layer opposite said Ta 2 O 5 or HfO layer; and a second dielectric layer on said second copper layer opposite said Ta 2 O 5 or HfO layer.
Claim 21
Dependent Claim
23 words
A multi-layer printed circuit board as set forth in claim 15 wherein all of said layers are internal to said printed circuit board.
Claim 22
Dependent Claim
26 words
A multi-layer printed circuit board as set forth in claim 15 wherein said Ta 2 O 5 or HfO layer is 0.1 to 2.0 microns thick.
Claim 23
Dependent Claim
75 words
A multi-layer printed circuit board comprising: a first copper layer; an Hf layer on one face of said first copper layer; an HfO layer on a face of said Hf layer opposite said first copper layer; a second copper layer on said HfO layer opposite said Hf layer; a first dielectric layer on said first copper layer opposite said Hf layer; and a second dielectric layer on said second copper layer opposite said HfO layer.
Claim 24
Dependent Claim
75 words
A multi-layer printed circuit board comprising: a first copper layer; an Hf layer on one face of said first copper layer; an HfO layer on a face of said Hf layer opposite said first copper layer; a second copper layer on said HfO layer opposite said Hf layer; a first dielectric layer on said first copper layer opposite said Hf layer; and a second dielectric layer on said second copper layer opposite said HfO layer.
Claim 25
Dependent Claim
24 words
A multi-layer printed circuit board as set forth in claim 18 further comprising a layer of HfO on side edges of said Hf layer.
Claim 26
Dependent Claim
101 words
A multi-layer printed circuit board comprising: a first metallic layer; a Ta layer on one face of said first metallic layer; a first Ta 2 O 5 layer on a face of said Ta layer opposite said first metallic layer; a second Ta 2 O 5 layer on side edges of said Ta layer; a second metallic layer on said first Ta 2 O 5 layer opposite said Ta layer; a first dielectric layer on said first metallic layer opposite said Ta layer; and a second dielectric layer on said second metallic layer opposite said first Ta 2 O 5 layer.
Claim 27
Dependent Claim
101 words
A multi-layer printed circuit board comprising: a first metallic layer; a Ta layer on one face of said first metallic layer; a first Ta 2 O 5 layer on a face of said Ta layer opposite said first metallic layer; a second Ta 2 O 5 layer on side edges of said Ta layer; a second metallic layer on said first Ta 2 O 5 layer opposite said Ta layer; a first dielectric layer on said first metallic layer opposite said Ta layer; and a second dielectric layer on said second metallic layer opposite said first Ta 2 O 5 layer.
Claim 28
Dependent Claim
91 words
A multi-layer printed circuit board comprising: first and second, parallel highly-conductive metallic layers; a Ta 2 O 5 layer sandwiched between and intimately connected to both said first and second metallic layers, whereby there is no Ta layer between said first and second metallic layers; a first dielectric layer on said first metallic layer opposite said Ta 2 O 5 layer; and a second dielectric layer on said second metallic layer opposite said Ta 2 O 5 layer; and wherein all of said layers are internal to said printed circuit board.
Claim 29
Dependent Claim
91 words
A multi-layer printed circuit board comprising: first and second, parallel highly-conductive metallic layers; a Ta 2 O 5 layer sandwiched between and intimately connected to both said first and second metallic layers, whereby there is no Ta layer between said first and second metallic layers; a first dielectric layer on said first metallic layer opposite said Ta 2 O 5 layer; and a second dielectric layer on said second metallic layer opposite said Ta 2 O 5 layer; and wherein all of said layers are internal to said printed circuit board.
Claim 30
Dependent Claim
81 words
A multi-layer printed circuit board comprising: first and second, parallel highly-conductive metallic layers; an HfO layer sandwiched between and intimately connected to said first and second metallic layers, whereby there is no Hf layer between said first and second metallic layers; a first dielectric layer on said first metallic layer opposite said HfO layer; and a second dielectric layer on said second metallic layer opposite said HfO layer; and wherein all of said layers are internal to said printed circuit board.
Claim 31
Dependent Claim
81 words
A multi-layer printed circuit board comprising: first and second, parallel highly-conductive metallic layers; an HfO layer sandwiched between and intimately connected to said first and second metallic layers, whereby there is no Hf layer between said first and second metallic layers; a first dielectric layer on said first metallic layer opposite said HfO layer; and a second dielectric layer on said second metallic layer opposite said HfO layer; and wherein all of said layers are internal to said printed circuit board.
References Cited (Backward Citations)
US3699011A
Cited
US4460938A
Cited
JPS62166616A
Cited
US4749449A
Cited
US5079069A
Cited
US5161086A
Cited
US5027253A
Cited
US5172304A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-27 | 2001-10-27 | 2002-04-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-27 | 2005-10-27 | 2006-04-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-27 | 2009-10-27 | 2010-04-28 | $7700.00 | Window Closed / Lapsed |