Patent US5742007A successfully refreshed from Google Patents.
US5742007A
Expired / Lapsed
US
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Electronic device package and method for forming the same
Assignee: NXP USA Inc
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Filing: 1996-08-05
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Granted: 1998-04-21
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Expires: 2016-08-05
Abstract
Abstract An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).
Inventors
- 👤 Robert R. Kornowski
- 👤 Carl Missele
- 👤 Thomas W. Rice
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:38
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H05; H05K; H05K5/00; H05K5/0091; H05K5/0095
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
108 words
A gas permeable package, comprising: a support structure having a major surface; a cap over the major surface of the support structure, the cap including a top and a porous side-wall, wherein the porous side-wall is substantially permeable to a gas; and a bonding agent being in one of a first state characterized by a low viscosity of the bonding agent or a second state characterized by a solidity of the bonding agent, the bonding agent coupling the porous side-wall of the cap to the major surface of the support structure, wherein the bonding agent in the first state is absorbable by the porous side-wall of the cap.
Claim 2
Dependent Claim
108 words
A gas permeable package, comprising: a support structure having a major surface; a cap over the major surface of the support structure, the cap including a top and a porous side-wall, wherein the porous side-wall is substantially permeable to a gas; and a bonding agent being in one of a first state characterized by a low viscosity of the bonding agent or a second state characterized by a solidity of the bonding agent, the bonding agent coupling the porous side-wall of the cap to the major surface of the support structure, wherein the bonding agent in the first state is absorbable by the porous side-wall of the cap.
Claim 3
Dependent Claim
16 words
The gas permeable package of claim 1, wherein the support structure includes a non-porous ceramic structure.
Claim 4
Dependent Claim
19 words
The gas permeable package of claim 1, wherein the top of the cap is substantially impermeable to the gas.
Claim 5
Dependent Claim
21 words
The gas permeable package of claim 1, wherein the porous side-wall of the cap is substantially impermeable to a liquid solder.
Claim 6
Dependent Claim
24 words
The gas permeable package of claim 1, wherein the top and the porous side-wall of the cap are integrally made of a porous material.
Claim 7
Dependent Claim
25 words
The gas permeable package of claim 5, wherein the top and the porous side-wall of the cap are integrally made of a porous ceramic material.
Claim 8
Dependent Claim
25 words
The gas permeable package of claim 5, wherein the top and the porous side-wall of the cap are integrally made of a porous plastic material.
Claim 9
Dependent Claim
23 words
The gas permeable package of claim 1, wherein the bonding agent is substantially impermeable to the gas and substantially impermeable to a liquid.
Claim 10
Dependent Claim
15 words
The gas permeable package of claim 8, wherein the bonding agent is an epoxy adhesive.
Claim 11
Dependent Claim
110 words
An electronic device package for packaging an electronic device, comprising: a support structure having a major surface on which the electronic device is disposed; a housing over the major surface of the support structure, the housing and the support structure enclosing the electronic device, wherein the housing allows a gas to pass substantially unimpeded therethrough and substantially impedes a liquid solder from passing therethrough; and a bonding agent which couples the housing to the support structure, the bonding agent being in one of a low viscosity state and a solid state, wherein the housing is absorbent to the bonding agent when the bonding agent is in the low viscosity state.
Claim 12
Dependent Claim
110 words
An electronic device package for packaging an electronic device, comprising: a support structure having a major surface on which the electronic device is disposed; a housing over the major surface of the support structure, the housing and the support structure enclosing the electronic device, wherein the housing allows a gas to pass substantially unimpeded therethrough and substantially impedes a liquid solder from passing therethrough; and a bonding agent which couples the housing to the support structure, the bonding agent being in one of a low viscosity state and a solid state, wherein the housing is absorbent to the bonding agent when the bonding agent is in the low viscosity state.
Claim 13
Dependent Claim
17 words
The electronic device package of claim 10, wherein the housing is made of a porous ceramic material.
Claim 14
Dependent Claim
17 words
The electronic device package of claim 10, wherein the housing is made of a porous plastic material.
Claim 15
Dependent Claim
18 words
The electronic device package of claim 10, wherein the bonding agent substantially impedes the gas from passing therethrough.
Claim 16
Dependent Claim
15 words
The electronic device package of claim 13, wherein the bonding agent includes an epoxy adhesive.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-20 | 2001-10-20 | 2002-04-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-20 | 2005-10-20 | 2006-04-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-20 | 2009-10-20 | 2010-04-21 | $7700.00 | Window Closed / Lapsed |