MOS field effect transistor with improved pocket regions for suppressing any short channel effects and method for fabricating the same

Claim 1

A method for ion-implantation of an impurity of a first conductivity into a substrate of the same conductivity type as said first conductivity to form pocket regions at limited positions in the vicinity of an inside edge portion of source/drain re,regions of a second conductivity type in a MOS field effect transistor having a gate electrode with side wall silicon oxide films, said method comprising the steps of: forming semiconductor epitaxial layers on said source/drain regions under conditions of a high selectivity to silicon oxide of said side wall silicon oxide films so that said semiconductor epitaxial layers have facets which face to said side wall silicon oxide films and said facets are almost linearly sloped down to bottom portions of said side wall silicon oxide films; and implanting said impurity of said first conductivity type into said substrate at its limited positions in the vicinity of said inside edge portion of said source/drain regions by using said semiconductor epitaxial layers with said facets and said side wall silicon oxide films as masks in an oblique direction tilted by a tilting angle θ from the normal of a surface of said substrate, wherein said angle θ satisfies an equation represented by θ≦θ 1 where: (θ 1 is an angle by which said facets are tilted from the normal of said surface of said substrate, and wherein a thickness of said silicon selective growth layers satisfies an equation represented by Tepi>(Xj'/tan θ)-Xj where: Tepi is said thickness of said silicon selective growth layers except for said facet portions; Xj is a junction depth of said source/drain diffusion regions; and Xj' is a distance between a top edge portion of each of said source/drain diffusion regions and a bottom side edge of each of said side wall silicon oxide films.

Claim 2

A method for ion-implantation of an impurity of a first conductivity into a substrate of the same conductivity type as said first conductivity to form pocket regions at limited positions in the vicinity of an inside edge portion of source/drain re,regions of a second conductivity type in a MOS field effect transistor having a gate electrode with side wall silicon oxide films, said method comprising the steps of: forming semiconductor epitaxial layers on said source/drain regions under conditions of a high selectivity to silicon oxide of said side wall silicon oxide films so that said semiconductor epitaxial layers have facets which face to said side wall silicon oxide films and said facets are almost linearly sloped down to bottom portions of said side wall silicon oxide films; and implanting said impurity of said first conductivity type into said substrate at its limited positions in the vicinity of said inside edge portion of said source/drain regions by using said semiconductor epitaxial layers with said facets and said side wall silicon oxide films as masks in an oblique direction tilted by a tilting angle θ from the normal of a surface of said substrate, wherein said angle θ satisfies an equation represented by θ≦θ 1 where: (θ 1 is an angle by which said facets are tilted from the normal of said surface of said substrate, and wherein a thickness of said silicon selective growth layers satisfies an equation represented by Tepi>(Xj'/tan θ)-Xj where: Tepi is said thickness of said silicon selective growth layers except for said facet portions; Xj is a junction depth of said source/drain diffusion regions; and Xj' is a distance between a top edge portion of each of said source/drain diffusion regions and a bottom side edge of each of said side wall silicon oxide films.

Claim 5

A method for forming pocket regions of a first conductivity type in a substrate of said first conductivity type at its limited positions in the vicinity of an inside edge portion of source/drain regions of a second conductivity type in a MOS field effect transistor having a gate electrode with side wall silicon oxide films, said method comprising the steps of: forming semiconductor epitaxial layers on said source/drain regions under conditions of a high selectivity to silicon oxide of said side wall silicon oxide films so that said semiconductor epitaxial layers have facets which face to said side wall silicon oxide films and said facets are almost linearly sloped down to bottom portions of said side wall silicon oxide films; and implanting said impurity of said first conductivity type into said substrate at its limited positions in the vicinity of said inside edge portion of said source/drain regions by using said semiconductor epitaxial layers with said facets and said side wall silicon oxide films as masks m an oblique direction tilted by a tilting angle θ from the normal of a surface of said substrate, wherein said angle θ satisfies an equation represented by θ≦θ 1 where:θ 1 is an angle by which said facets are tilted from the normal of said surface of said substrate, and wherein a thickness of said silicon selective growth layers satisfies an equation represented by Tepi>(Xj'/tan θ)-Xj where: Tepi is said thickness of said silicon selective growth layers except for said facet portions; Xj is a junction depth of said source/drain diffusion regions; and Xj' is a distance between a top edge portion of each of said source/drain diffusion regions and a bottom side edge of each of said side wall silicon oxide films.

Claim 6

A method for forming pocket regions of a first conductivity type in a substrate of said first conductivity type at its limited positions in the vicinity of an inside edge portion of source/drain regions of a second conductivity type in a MOS field effect transistor having a gate electrode with side wall silicon oxide films, said method comprising the steps of: forming semiconductor epitaxial layers on said source/drain regions under conditions of a high selectivity to silicon oxide of said side wall silicon oxide films so that said semiconductor epitaxial layers have facets which face to said side wall silicon oxide films and said facets are almost linearly sloped down to bottom portions of said side wall silicon oxide films; and implanting said impurity of said first conductivity type into said substrate at its limited positions in the vicinity of said inside edge portion of said source/drain regions by using said semiconductor epitaxial layers with said facets and said side wall silicon oxide films as masks m an oblique direction tilted by a tilting angle θ from the normal of a surface of said substrate, wherein said angle θ satisfies an equation represented by θ≦θ 1 where:θ 1 is an angle by which said facets are tilted from the normal of said surface of said substrate, and wherein a thickness of said silicon selective growth layers satisfies an equation represented by Tepi>(Xj'/tan θ)-Xj where: Tepi is said thickness of said silicon selective growth layers except for said facet portions; Xj is a junction depth of said source/drain diffusion regions; and Xj' is a distance between a top edge portion of each of said source/drain diffusion regions and a bottom side edge of each of said side wall silicon oxide films.

Claim 9

A method for fabricating a MOS field effect transistor with pocket regions of a first conductivity type in a substrate of said first conductivity type at its limited positions m the vicinity of an inside edge portion of source/drain regions of a second conductivity type, said method comprising the steps of: forming a gate electrode on a gate oxide film over a semiconductor substrate; forming side wall silicon oxide films at opposite sides of said gate electrode; forming source/drain diffusion regions by ion-implantation of an impurity of said second conductivity type into said substrate in a direction vertical to a surface of said substrate by use of said gate electrode and said side wall silicon oxide films as masks; subjecting said substrate to cause an activation of said source/drain diffusion regions and a diffusion of said impurity of said second conductivity type; forming semiconductor epitaxial layers on said source/drain regions under conditions of a high selectivity to silicon oxide of said side wall silicon oxide films so that said semiconductor epitaxial layers to said side wall sch face to said side wall silicon oxide films and said facets are almost linearly sloped down to bottom portions of said side wall silicon oxide films; and implanting said impurity of said first conductivity type into said substrate at its limited positions in the vicinity of said inside edge portion of said source/drain regions by using said semiconductor epitaxial layers with said facets and said side wall silicon oxide films as masks in an oblique direction tilted by a tilting angle θ from the normal of a surface of said substrate, wherein said angle θ satisfies an equation represented by θ≦θ 1 where: θ 1 is an angle by which said facets are tilted from the normal of said surface of said substrate, and wherein a thickness of said silicon selective growth layers satisfies an equation represented by Tepi>(Xj'/tan θ)-Xj where: Tepi is said thickness of said silicon selective growth layers except for said facet portions; Xj is a junction depth of said source/drain diffusion regions; and Xj' is a distance between a top edge portion of each of said source/drain diffusion regions and a bottom side edge of each of said side wall silicon oxide films.

Claim 10

A method for fabricating a MOS field effect transistor with pocket regions of a first conductivity type in a substrate of said first conductivity type at its limited positions m the vicinity of an inside edge portion of source/drain regions of a second conductivity type, said method comprising the steps of: forming a gate electrode on a gate oxide film over a semiconductor substrate; forming side wall silicon oxide films at opposite sides of said gate electrode; forming source/drain diffusion regions by ion-implantation of an impurity of said second conductivity type into said substrate in a direction vertical to a surface of said substrate by use of said gate electrode and said side wall silicon oxide films as masks; subjecting said substrate to cause an activation of said source/drain diffusion regions and a diffusion of said impurity of said second conductivity type; forming semiconductor epitaxial layers on said source/drain regions under conditions of a high selectivity to silicon oxide of said side wall silicon oxide films so that said semiconductor epitaxial layers to said side wall sch face to said side wall silicon oxide films and said facets are almost linearly sloped down to bottom portions of said side wall silicon oxide films; and implanting said impurity of said first conductivity type into said substrate at its limited positions in the vicinity of said inside edge portion of said source/drain regions by using said semiconductor epitaxial layers with said facets and said side wall silicon oxide films as masks in an oblique direction tilted by a tilting angle θ from the normal of a surface of said substrate, wherein said angle θ satisfies an equation represented by θ≦θ 1 where: θ 1 is an angle by which said facets are tilted from the normal of said surface of said substrate, and wherein a thickness of said silicon selective growth layers satisfies an equation represented by Tepi>(Xj'/tan θ)-Xj where: Tepi is said thickness of said silicon selective growth layers except for said facet portions; Xj is a junction depth of said source/drain diffusion regions; and Xj' is a distance between a top edge portion of each of said source/drain diffusion regions and a bottom side edge of each of said side wall silicon oxide films.