US5725819A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Injection molding method for board for IC card
Assignee: Maxell Seiki Ltd
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Filing: 1995-07-21
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Granted: 1998-03-10
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Expires: 2015-07-21
Abstract
Abstract A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.
Inventors
- 👤 Masayoshi Onishi
- 👤 Seiji Kegai
- 👤 Koichi Ozaki
- 👤 Kaname Tamada
- 👤 Hiroyoshi Takagi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:23
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/0772; G06K19/07724; B; B29; B29C; B29C45/00; B29C45/17; B29C45/38; B29C45/46; B29C45/56; B29C45/5675; G06K19/07745; B29L; B29L2017/00; B29L2017/006
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
198 words
A method for manufacturing a board for an IC card, wherein the board comprises a main body having a shape of a plate, and a recess having a space for receiving and adhering a component, the recess being formed in one of the planes of the main body, the recess comprising a bottom wall integrated as one body with the main body, the method comprising the steps of: providing a pair of molds combined for injection molding, the molds forming a cavity between them for forming the board, one of the molds comprising a slide core facing the cavity so as to be able to protrude into the cavity, the slide core comprising a top portion having a contour of the recess with the bottom wall; injecting molten resin into the cavity; moving the slide core into the cavity to a prescribed position after the molten resin is injected and before a constant pressure is applied to the molten resin until the resin begins to solidify; moving back the slide core to a retracted position after the resin in the cavity solidifies; opening the molds; and moving the slide core into the cavity to separate the solidified board.
Claim 2
Independent Claim
198 words
A method for manufacturing a board for an IC card, wherein the board comprises a main body having a shape of a plate, and a recess having a space for receiving and adhering a component, the recess being formed in one of the planes of the main body, the recess comprising a bottom wall integrated as one body with the main body, the method comprising the steps of: providing a pair of molds combined for injection molding, the molds forming a cavity between them for forming the board, one of the molds comprising a slide core facing the cavity so as to be able to protrude into the cavity, the slide core comprising a top portion having a contour of the recess with the bottom wall; injecting molten resin into the cavity; moving the slide core into the cavity to a prescribed position after the molten resin is injected and before a constant pressure is applied to the molten resin until the resin begins to solidify; moving back the slide core to a retracted position after the resin in the cavity solidifies; opening the molds; and moving the slide core into the cavity to separate the solidified board.
Claim 3
Dependent Claim
20 words
The method according to claim 1, wherein the thickness of the bottom wall is in a range from 0.05-0.5 mm.
Claim 4
Dependent Claim
89 words
The method according to claim 1, wherein said molds further form a gate space connected to the cavity and one of said molds comprises a gate pin facing the gate space so as to be able to protrude into the gate space for blocking the cavity from the gate space, the method further comprising the step of: projecting the gate pin into the gate space to seal the cavity and to cut off resin in the gate section after injection of the molten resin into the cavity is complete.
Claim 5
Dependent Claim
32 words
The method according to claim 3, wherein the board has a rectangular plate having longer and shorter sides, and the gate space is provided at one of the longer and shorter sides.
Claim 6
Dependent Claim
47 words
The method according to claim 1, wherein the board has a shape of a rectangular plate having longer and shorter sides, a part of the longer and shorter sides being used as reference edges, and a gate is provided at one of the longer and shorter sides.
Claim 7
Dependent Claim
55 words
The method according to claim 1, wherein the top portion of said slide core having a contour of the recess comprises a first part having a plane facing the cavity and a second part connected to the plane of the first part, the second part having a sectional area more narrow than the first one.
Claim 8
Dependent Claim
21 words
The method according to claim 6, wherein said slide core has an uneven surface in the plane connecting the second part.
Claim 9
Dependent Claim
67 words
The method according to claim 1, wherein said main body has a shape of a rectangular plate of a longer side of 84.00-86.00 mm, a shorter side of 53.00-55.00 mm and a thickness of 0.5-0.9 mm, and a ratio of a thickness of the bottom wall of the recess to an area of the board is in a range of 1/(9.5*10 4 ) to 1/(8.90*10 3 ).
Claim 10
Dependent Claim
30 words
The method according to claim 1, wherein a ratio of an area of the bottom wall to an area of the board is in a range of 0.8 to 27%.
Claim 11
Dependent Claim
30 words
The method according to claim 8, wherein a ratio of an area of the bottom wall to an area of the board is in a range of 0.8 to 27%.
Claim 12
Dependent Claim
60 words
The method according to claim 1, wherein said main body has a longer side of 15.00-80.00 mm, a shorter side of 10.00-50.00 mm, and a thickness of 0.5-0.9 mm, and a ratio of a thickness of the bottom wall of the recess to an area of the board is in a range of 1/(8.5*10 4 ) to 1/(3.0*10 3 ).
Claim 13
Dependent Claim
30 words
The method according to claim 11, wherein a ratio of an area of the bottom wall to an area of the board is in a range of 4 to 8%.
Claim 14
Dependent Claim
30 words
The method according to claim 1, wherein a ratio of an area of the bottom wall to an area of the board is in a range of 4 to 8%.
Claim 15
Independent Claim
267 words
A method for manufacturing a board for an IC card, wherein the board comprises a main body having a shape of a plate, and a recess having a space for receiving and adhering a component, the recess being formed in one of the planes of the main body, the recess comprising a bottom wall integrated as one body with the main body, the method comprising the steps of: providing a pair of molds combined for injection molding, the molds forming a cavity between them for forming the board, said molds further forming a gate space connected to the cavity, one of the molds comprising a slide core facing the cavity and movable along a first longitudinal axis so as to be able to protrude into the cavity, the slide core comprising a top portion having a contour of the recess with the bottom wall, one of said molds comprising a gate pin facing the gate space and movable along a second longitudinal axis parallel to said first longitudinal axis; injecting molten resin into the cavity; moving the slide core along said first longitudinal axis and into the cavity to a prescribed position before the resin solidifies; then projecting the gate pin along said second longitudinal axis and into the gate space to seal the cavity and to cut off resin in the gate space after injection of the molten resin into the cavity is complete; moving back the slide core to a retracted position after the resin in the cavity solidifies; opening the molds; and moving the slide core into the cavity to separate the solidified board.
Claim 16
Independent Claim
267 words
A method for manufacturing a board for an IC card, wherein the board comprises a main body having a shape of a plate, and a recess having a space for receiving and adhering a component, the recess being formed in one of the planes of the main body, the recess comprising a bottom wall integrated as one body with the main body, the method comprising the steps of: providing a pair of molds combined for injection molding, the molds forming a cavity between them for forming the board, said molds further forming a gate space connected to the cavity, one of the molds comprising a slide core facing the cavity and movable along a first longitudinal axis so as to be able to protrude into the cavity, the slide core comprising a top portion having a contour of the recess with the bottom wall, one of said molds comprising a gate pin facing the gate space and movable along a second longitudinal axis parallel to said first longitudinal axis; injecting molten resin into the cavity; moving the slide core along said first longitudinal axis and into the cavity to a prescribed position before the resin solidifies; then projecting the gate pin along said second longitudinal axis and into the gate space to seal the cavity and to cut off resin in the gate space after injection of the molten resin into the cavity is complete; moving back the slide core to a retracted position after the resin in the cavity solidifies; opening the molds; and moving the slide core into the cavity to separate the solidified board.
Claim 17
Independent Claim
28 words
The method for manufacturing a board for an IC card according to claims 14, wherein the thickness of the bottom wall is in a range from 0.05-0.5 mm.
Claim 18
Dependent Claim
43 words
The method for manufacturing a board for an IC card according to claim 14, wherein the board has a shape of a rectangular plate having longer and shorter sides, and the gate space is provided at one of the longer and shorter sides.
Claim 19
Dependent Claim
63 words
The method for manufacturing a board for an IC card according to claim 14, wherein the top portion of said slide core having a contour of the recess comprises a first part having a plane facing the cavity and a second part connected to the plane for the first part, the second part having a sectional area more narrow than the first one.
Claim 20
Dependent Claim
38 words
The method for manufacturing a board for an IC card according to claim 14, wherein a ratio of an area of the bottom wall to an area of the board is in a range of 0.8 to 27%.
Claim 21
Dependent Claim
68 words
The method for manufacturing a board for an IC card according to claim 14, wherein said main body has a longer side of 15.00-80.00 mm, a shorter side of 10.00-50.00 mm, and a thickness of 0.5-0.9 mm, and a ratio of a thickness of the bottom wall of the recess to an area of the board is in a range of 1/(8.5*10 4 ) to 1/(3.0*10 3 ).
References Cited (Backward Citations)
JPS56148533A
Cited
JPS6135923A
Cited
JPS62202373A
Cited
US4849844A
Cited
US4980115A
Cited
US4954308A
Cited
EP0359632A1
Cited
JPH0377333A
Cited
EP0472768A1
Cited
US5254304A
Cited
US5405259A
Cited
US5419697A
Cited
EP0527438A2
Cited
US5340528A
Cited
US5520863A
Cited
US5439371A
Cited
US5472335A
Cited
FR2700041A1
Cited
US5476629A
Cited
US5492658A
Cited
US5512223A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-09 | 2001-09-08 | 2002-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-09 | 2005-09-08 | 2006-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-09 | 2009-09-08 | 2010-03-10 | $7700.00 | Window Closed / Lapsed |