Method and attaching a chip module to an IC-card

Abstract

Abstract In the case of a method of attaching a chip module (2) to an IC card (1), consisting of plastic, in which the glass fibre reinforced plastic substrate (3) of the chip module (2) is attached to a predetermined point on the IC card, the adherence of the chip module (2) on the IC card (1) is to be improved. Before attaching the chip module (2), the surface of the glass fibre reinforced plastic substrate (3) is worked in such a way that a surface having a greater surface roughness is formed. The method according to the invention is used in particular for the adhesive bonding of chip modules in IC cards. <IMAGE>

Inventors

• 👤 Gottfried Ing. Beer (Fh)
• 👤 Richard Ing. Scheuenpflug (Fh)

Bibliographic Details