Integrated circuits encapsulation process, especially for chip cards

Abstract

Abstract To improve the dimensional characteristics of micromodules which are incorporated into chip cards, and to improve their reliability and their mechanical resilience, it is proposed to start from a metal conductor gate (10), to perform an overmoulding with a plastic material (20) thereby defining a cavity for the chip (12) and its connection wires (16) and leaving therein gate zones (14, 18) which are not covered by the overmoulding material. It is only then that the chip is positioned; the cavity is filled with a protective resin and the micromodule thus put together is incorporated in a chip card. The plastic overmoulding material is chosen to be compatible with the material of the card since these two materials will be stuck together (or soldered by ultrasound). <IMAGE>

Inventors

• 👤 Francis Steffen

Bibliographic Details