Patent EP0472768A1 successfully refreshed from Google Patents.
EP0472768A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method and attaching a chip module to an IC-card
Assignee: Siemens AG
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Filing: 1990-08-30
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Granted: —
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Expires: 2010-08-30
Abstract
Abstract In the case of a method of attaching a chip module (2) to an IC card (1), consisting of plastic, in which the glass fibre reinforced plastic substrate (3) of the chip module (2) is attached to a predetermined point on the IC card, the adherence of the chip module (2) on the IC card (1) is to be improved. Before attaching the chip module (2), the surface of the glass fibre reinforced plastic substrate (3) is worked in such a way that a surface having a greater surface roughness is formed. The method according to the invention is used in particular for the adhesive bonding of chip modules in IC cards. <IMAGE>
Inventors
- 👤 Gottfried Ing. Beer (Fh)
- 👤 Richard Ing. Scheuenpflug (Fh)
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:30
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
EP0197847A1
Cited
EP0359632A1
Cited
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