US5719447A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal alloy interconnections for integrated circuits
Assignee: Intel Corp
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Filing: 1995-05-30
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Granted: 1998-02-17
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Expires: 2015-05-30
Abstract
Abstract Novel metal-alloy interconnections for integrated circuits. The metal-alloy interconnections of the present invention comprise a substantial portion of either copper or silver alloyed with a small amount of an additive having a low residual resistivity and solid solubility in either silver or copper such that the resultant electrical resistivity is less than 3 μΩ-cm.
Inventors
- 👤 Donald S. Gardner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 03:55
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/44; H10W20/4403; H10W20/4421; H10W20/4424; H10W20/425; H10W20/4432; H10W20/4435
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
38 words
A metal alloy interconnection for an integrated circuit comprising: silver; and an additive having a low residual resistivity and a low solid solubility in silver wherein said metal alloy interconnection comprises between 0.01-1.0 atomic percent of said additive.
Claim 2
Dependent Claim
38 words
A metal alloy interconnection for an integrated circuit comprising: silver; and an additive having a low residual resistivity and a low solid solubility in silver wherein said metal alloy interconnection comprises between 0.01-1.0 atomic percent of said additive.
Claim 3
Dependent Claim
21 words
The metal alloy interconnection of claim 1 wherein said additive is selected from the group consisting of niobium, palladium, and vanadium.
Claim 4
Dependent Claim
17 words
The metal alloy interconnection of claim 1 wherein said metal alloy comprises between 0.01-1.0 atomic percent niobium.
Claim 5
Dependent Claim
17 words
The metal alloy interconnection of claim 1 wherein said metal alloy comprises between 0.01-1.0 atomic percent palladium.
Claim 6
Dependent Claim
17 words
The metal alloy interconnection of claim 1 wherein said metal alloy comprises between 0.01-1.0 atomic percent vanadium.
Claim 7
Independent Claim
77 words
A method of forming interconnection lines for an integrated circuit formed on a semiconductor substrate comprising the steps of: forming an insulating layer above said substrate; forming a silver-alloy layer above said insulating layer wherein said silver-alloy layer comprises: silver; and an additive having a low residual resistivity and a low solid solubility in silver wherein said metal alloy layer comprises between 0.01-1.0 atomic percent of said additive; and patterning said silver-alloy layer into said interconnection lines.
Claim 8
Independent Claim
77 words
A method of forming interconnection lines for an integrated circuit formed on a semiconductor substrate comprising the steps of: forming an insulating layer above said substrate; forming a silver-alloy layer above said insulating layer wherein said silver-alloy layer comprises: silver; and an additive having a low residual resistivity and a low solid solubility in silver wherein said metal alloy layer comprises between 0.01-1.0 atomic percent of said additive; and patterning said silver-alloy layer into said interconnection lines.
Claim 9
Dependent Claim
19 words
The method of claim 6 wherein said additive is selected from the group consisting of niobium, palladium, and vanadium.
Claim 10
Dependent Claim
15 words
The method of claim 6 wherein said silver-alloy layer comprises between 0.01-1.0 atomic percent niobium.
Claim 11
Dependent Claim
15 words
The method of claim 6 wherein said silver-alloy layer comprises between 0.01-1.0 atomic percent palladium.
Claim 12
Dependent Claim
14 words
The method of claim 6 wherein said silver-alloy layer comprises 0.01-1.0 atomic percent vanadium.
Claim 13
Dependent Claim
21 words
The method of claim 6 wherein said silver-alloy layer is formed by sputtering from a target comprising silver and said additive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-02-16 | 2001-08-18 | 2002-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-02-16 | 2005-08-18 | 2006-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-02-16 | 2009-08-18 | 2010-02-17 | $7700.00 | Window Closed / Lapsed |