Patent US5718367A successfully refreshed from Google Patents.
US5718367A
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US
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Mold transfer apparatus and method
Assignee: International Business Machines Corp
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Filing: 1995-11-21
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Granted: 1998-02-17
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Expires: 2015-11-21
Abstract
Abstract The present invention relates generally to a new mold transfer apparatus and method. More particularly, the invention encompasses an apparatus that is used to form metallic interconnections, such as, for example, solder connections, such as, solder balls or solder columns, using a mold that is already filled with transferable metallic material. However, these metallic interconnections in a mold could also be used to form other structures, such as, for example, heat sinks with fins, etc.
Inventors
- 👤 II James Howard Covell
- 👤 Carol Jill Braun
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:40
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H10; H10W; H10W40/00; H10W40/01; H10W40/03; H10W40/037; H10W70/00; H10W70/099; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/0415; H05K2203/043; H05K2203/12; H05K2203/128
Claims Analysis
Total Claims: 70
Claim 1
Independent Claim
145 words
A method of transferring cast electrical interconnects from a mold to an attachment pad, comprising the steps of: (a) placing a workpiece having said attachment pad onto a base having at least one alignment means, (b) placing said mold over said workpiece such that said alignment means aligns at least a portion of one of said electrical interconnects in physical contact with at least a portion of said pad, (c) placing at least one biasing means over said mold and forming an assembly with said base, mold and workpiece, (d) heating said assembly to a temperature where at least a portion of said electrical interconnects in contact with said pad melts and forms an electrical connection with said pad, and (e) cooling said assembly and removing said biasing means, said mold and thereby forming said workpiece having said attachment pad with said cast electrical interconnects.
Claim 2
Independent Claim
145 words
A method of transferring cast electrical interconnects from a mold to an attachment pad, comprising the steps of: (a) placing a workpiece having said attachment pad onto a base having at least one alignment means, (b) placing said mold over said workpiece such that said alignment means aligns at least a portion of one of said electrical interconnects in physical contact with at least a portion of said pad, (c) placing at least one biasing means over said mold and forming an assembly with said base, mold and workpiece, (d) heating said assembly to a temperature where at least a portion of said electrical interconnects in contact with said pad melts and forms an electrical connection with said pad, and (e) cooling said assembly and removing said biasing means, said mold and thereby forming said workpiece having said attachment pad with said cast electrical interconnects.
Claim 3
Dependent Claim
31 words
The method of claim 1, wherein said mold material is selected from a group consisting of boron nitride, ceramic, copper, epoxy, glass, graphite, metals, metal ceramics, molybdenum, plastics, polyimides and silicon.
Claim 4
Dependent Claim
31 words
The method of claim 1, wherein the material for said electrical interconnects is selected from a group consisting of aluminum, antimony, bismuth, conductive epoxies, copper, gold, lead, silver, solder and tin.
Claim 5
Dependent Claim
21 words
The method of claim 3, wherein said solder consists by weight of between about 1 percent to about 97 percent lead.
Claim 6
Dependent Claim
21 words
The method of claim 3, wherein said solder consists by weight of between about 99 percent to about 3 percent tin.
Claim 7
Dependent Claim
21 words
The method of claim 3, wherein said solder consists by weight of between about 37 percent to about 95 percent lead.
Claim 8
Dependent Claim
16 words
The method of claim 3, wherein said solder consists by weight of about 90 percent lead.
Claim 9
Dependent Claim
21 words
The method of claim 3, wherein said solder consists by weight of between about 63 percent to about 5 percent tin.
Claim 10
Dependent Claim
16 words
The method of claim 3, wherein said solder consists by weight of about 10 percent tin.
Claim 11
Dependent Claim
32 words
The method of claim 1, wherein the material for said electrical interconnects is a solder, and wherein the liquidus temperature of said solder is between about 180° C. and about 380° C.
Claim 12
Dependent Claim
16 words
The method of claim 1, wherein said hole has a flare at at least one end.
Claim 13
Dependent Claim
21 words
The method of claim 11, wherein at least one of said flare is between about 1 degree to about 80 degree.
Claim 14
Dependent Claim
21 words
The method of claim 11, wherein at least one of said flare is between about 5 degree to about 45 degree.
Claim 15
Dependent Claim
21 words
The method of claim 11, wherein at least one of said flare is between about 5 degree to about 30 degree.
Claim 16
Dependent Claim
32 words
The method of claim 1, wherein the material for said electrical interconnects is a solder, and wherein the liquidus temperature of said solder is between about 200° C. and about 365° C.
Claim 17
Dependent Claim
32 words
The method of claim 1, wherein the material for said electrical interconnects is a solder, and wherein the liquidus temperature of said solder is between about 225° C. and about 365° C.
Claim 18
Dependent Claim
20 words
The method of claim 1, wherein at least one alignment gauge is used to align said workpiece to said base.
Claim 19
Dependent Claim
21 words
The method of claim 1, wherein at least one of said electrical interconnects is used as a means for transferring heat.
Claim 20
Dependent Claim
25 words
The method of claim 1, wherein said heating step is done in an atmosphere selected from a group consisting of inert atmosphere and reducing atmosphere.
Claim 21
Dependent Claim
30 words
The method of claim 19, wherein said atmosphere is selected from a group consisting of argon atmosphere, carbon dioxide atmosphere, forming gas atmosphere, helium atmosphere, hydrogen atmosphere and nitrogen atmosphere.
Claim 22
Dependent Claim
37 words
The method of claim 1, wherein said mold has at least one backing plate secured to it, and wherein said backing plate is removed after said electrical interconnects have been transferred from said mold onto said workpiece.
Claim 23
Dependent Claim
14 words
The method of claim 1, wherein said attachment pad is an electrical interconnection pad.
Claim 24
Dependent Claim
25 words
The method of claim 1, wherein said workpiece is selected from a group consisting of board, card, ceramics, chip, glass-ceramics, heat-sink, laminate and semiconductor substrate.
Claim 25
Independent Claim
134 words
A method of transferring cast metallic material from a mold to a workpiece, comprising the steps of: (a) placing said workpiece onto a base having at least one alignment means, (b) placing said mold over said workpiece such that said alignment means aligns at least a portion of said metallic material in physical contact with at least a portion of said workpiece, (c) placing at least one biasing means over said mold and forming an assembly with said base, mold and workpiece, (d) heating said assembly to a temperature where at least a portion of said metallic material in contact with said workpiece melts and forms a connection with said workpiece, and (e) cooling said assembly and removing said biasing means and said mold, and thereby forming said workpiece having said cast metallic material.
Claim 26
Independent Claim
134 words
A method of transferring cast metallic material from a mold to a workpiece, comprising the steps of: (a) placing said workpiece onto a base having at least one alignment means, (b) placing said mold over said workpiece such that said alignment means aligns at least a portion of said metallic material in physical contact with at least a portion of said workpiece, (c) placing at least one biasing means over said mold and forming an assembly with said base, mold and workpiece, (d) heating said assembly to a temperature where at least a portion of said metallic material in contact with said workpiece melts and forms a connection with said workpiece, and (e) cooling said assembly and removing said biasing means and said mold, and thereby forming said workpiece having said cast metallic material.
Claim 27
Dependent Claim
31 words
The method of claim 24, wherein said mold material is selected from a group consisting of boron nitride, ceramic, copper, epoxy, glass, graphite, metals, metal ceramics, molybdenum, plastics, polyimides and silicon.
Claim 28
Dependent Claim
28 words
The method of claim 24, wherein said metallic material is selected from a group consisting of aluminum, antimony, bismuth, conductive epoxies, copper, gold, lead, silver, solder and tin.
Claim 29
Dependent Claim
21 words
The method of claim 26, wherein said solder consists by weight of between about 1 percent to about 97 percent lead.
Claim 30
Dependent Claim
21 words
The method of claim 26, wherein said solder consists by weight of between about 99 percent to about 3 percent tin.
Claim 31
Dependent Claim
21 words
The method of claim 26, wherein said solder consists by weight of between about 37 percent to about 95 percent lead.
Claim 32
Dependent Claim
16 words
The method of claim 26, wherein said solder consists by weight of about 90 percent lead.
Claim 33
Dependent Claim
21 words
The method of claim 26, wherein said solder consists by weight of between about 63 percent to about 5 percent tin.
Claim 34
Dependent Claim
16 words
The method of claim 26, wherein said solder consists by weight of about 10 percent tin.
Claim 35
Dependent Claim
29 words
The method of claim 24, wherein said metallic material is a solder, and wherein the liquidus temperature of said solder is between about 180° C. and about 380° C.
Claim 36
Dependent Claim
25 words
The method of claim 24, wherein said mold has at least one hole, and wherein said hole has a flare at at least one end.
Claim 37
Dependent Claim
17 words
The method of claim 34, wherein said flare is between about 1 degree to about 80 degree.
Claim 38
Dependent Claim
17 words
The method of claim 34, wherein said flare is between about 5 degree to about 45 degree.
Claim 39
Dependent Claim
17 words
The method of claim 34, wherein said flare is between about 5 degree to about 30 degree.
Claim 40
Dependent Claim
29 words
The method of claim 24, wherein said metallic material is a solder, and wherein the liquidus temperature of said solder is between about 200° C. and about 365° C.
Claim 41
Dependent Claim
29 words
The method of claim 24, wherein said metallic material is a solder, and wherein the liquidus temperature of said solder is between about 225° C. and about 365° C.
Claim 42
Dependent Claim
20 words
The method of claim 24, wherein at least one alignment gauge is used to align said workpiece to said base.
Claim 43
Dependent Claim
21 words
The method of claim 24, wherein at least one of said metallic material is used as a means for transferring heat.
Claim 44
Dependent Claim
25 words
The method of claim 24, wherein said heating step is done in an atmosphere selected from a group consisting of inert atmosphere and reducing atmosphere.
Claim 45
Dependent Claim
30 words
The method of claim 42, wherein said atmosphere is selected from a group consisting of argon atmosphere, carbon dioxide atmosphere, forming gas atmosphere, helium atmosphere, hydrogen atmosphere and nitrogen atmosphere.
Claim 46
Dependent Claim
37 words
The method of claim 24, wherein said mold has at least one backing plate secured to it, and wherein said backing plate is removed after said metallic material have been transferred from said mold onto said workpiece.
Claim 47
Dependent Claim
25 words
The method of claim 24, wherein said workpiece is selected from a group consisting of board, card, ceramics, chip, glass-ceramics, heat-sink, laminate or semiconductor substrate.
Claim 48
Independent Claim
127 words
An apparatus for transferring cast metallic material in a mold onto a workpiece, comprising: (a) a base having at least one alignment pin, (b) at least one area in said base to accommodate said workpiece, said workpiece in said area, (c) means for placing and aligning said mold over said workpiece, (d) at least one biasing means over said mold to securely hold said mold in contact with said workpiece, (e) a heating means to heat said assembly comprising said biasing means, said mold, said workpiece and said base until said cast metallic material in said mold is transferred onto said workpiece, and (f) a cooling means to cool said assembly and thereby providing said apparatus for transferring cast metallic material in a mold onto a workpiece.
Claim 49
Independent Claim
127 words
An apparatus for transferring cast metallic material in a mold onto a workpiece, comprising: (a) a base having at least one alignment pin, (b) at least one area in said base to accommodate said workpiece, said workpiece in said area, (c) means for placing and aligning said mold over said workpiece, (d) at least one biasing means over said mold to securely hold said mold in contact with said workpiece, (e) a heating means to heat said assembly comprising said biasing means, said mold, said workpiece and said base until said cast metallic material in said mold is transferred onto said workpiece, and (f) a cooling means to cool said assembly and thereby providing said apparatus for transferring cast metallic material in a mold onto a workpiece.
Claim 50
Dependent Claim
31 words
The apparatus of claim 46, wherein said mold material is selected from a group consisting of boron nitride, ceramic, copper, epoxy, glass, graphite, metals, metal ceramics, molybdenum, plastics, polyimides and silicon.
Claim 51
Dependent Claim
28 words
The apparatus of claim 46, wherein said metallic material is selected from a group consisting of aluminum, antimony, bismuth, conductive epoxies, copper, gold, lead, silver, solder and tin.
Claim 52
Dependent Claim
21 words
The apparatus of claim 48, wherein said solder consists by weight of between about 1 percent to about 97 percent lead.
Claim 53
Dependent Claim
21 words
The apparatus of claim 48, wherein said solder consists by weight of between about 99 percent to about 3 percent tin.
Claim 54
Dependent Claim
21 words
The apparatus of claim 48, wherein said solder consists by weight of between about 37 percent to about 95 percent lead.
Claim 55
Dependent Claim
16 words
The apparatus of claim 48, wherein said solder consists by weight of about 90 percent lead.
Claim 56
Dependent Claim
21 words
The apparatus of claim 48, wherein said solder consists by weight of between about 63 percent to about 5 percent tin.
Claim 57
Dependent Claim
16 words
The apparatus of claim 48, wherein said solder consists by weight of about 10 percent tin.
Claim 58
Dependent Claim
29 words
The apparatus of claim 46, wherein said metallic material is a solder, and wherein the liquidus temperature of said solder is between about 180° C. and about 380° C.
Claim 59
Dependent Claim
25 words
The apparatus of claim 46, wherein said mold has at least one hole, and wherein said hole has a flare at at least one end.
Claim 60
Dependent Claim
17 words
The apparatus of claim 56, wherein said flare is between about 1 degree to about 80 degree.
Claim 61
Dependent Claim
17 words
The apparatus of claim 56, wherein said flare is between about 5 degree to about 45 degree.
Claim 62
Dependent Claim
17 words
The apparatus of claim 56, wherein said flare is between about 5 degree to about 30 degree.
Claim 63
Dependent Claim
20 words
The apparatus of claim 46, wherein at least one alignment gauge is used to align said workpiece to said base.
Claim 64
Dependent Claim
17 words
The apparatus of claim 46, wherein said metallic material is used as a means for transferring heat.
Claim 65
Dependent Claim
25 words
The apparatus of claim 46, wherein said heating step is done in an atmosphere selected from a group consisting of inert atmosphere and reducing atmosphere.
Claim 66
Dependent Claim
30 words
The apparatus of claim 62, wherein said atmosphere is selected from a group consisting of argon atmosphere, carbon dioxide atmosphere, forming gas atmosphere, helium atmosphere, hydrogen atmosphere and nitrogen atmosphere.
Claim 67
Dependent Claim
37 words
The apparatus of claim 46, wherein said mold has at least one backing plate secured to it, and wherein said backing plate is removed after said metallic material have been transferred from said mold onto said workpiece.
Claim 68
Dependent Claim
25 words
The apparatus of claim 46, wherein said workpiece is selected from a group consisting of board, card, ceramics, chip, glass-ceramics, heat-sink, laminate and semiconductor substrate.
Claim 69
Dependent Claim
29 words
The apparatus of claim 46, wherein said metallic material is a solder, and wherein the liquidus temperature of said solder is between about 200° C. and about 365° C.
Claim 70
Dependent Claim
29 words
The apparatus of claim 46, wherein said metallic material is a solder, and wherein the liquidus temperature of said solder is between about 225° C. and about 365° C.
References Cited (Backward Citations)
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