US5712802A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermal protection of traction inverters
Assignee: General Electric Co
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Filing: 1996-04-16
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Granted: 1998-01-27
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Expires: 2016-04-16
Abstract
Abstract A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown includes the steps of computing the cooling air mass flow rate, creating an electronic model of the semiconductor/heat sink combination and estimating the semiconductor junction temperature from the mass flow rate and model. The cooling mass flow rate is determined by measuring the temperature of the cooling air prior to passage over the heat sink, measuring atmospheric pressure of the cooling air, determining the volumetric air flow rate of the cooling air and computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate. Power dissipation in the semiconductors is then computed and heat sink and semiconductor temperatures are estimated from power dissipation and cooling air mass flow rate. Semiconductor power dissipation is limited so as to restrict semiconductor temperature to a safe operating value.
Inventors
- 👤 Ajith Kuttannair Kumar
- 👤 Peter Billey Macchiaroli
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:05
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2089; H05K7/20909; H05K7/20918; G; G05; G05D; G05D23/00; G05D23/19; G05D23/1917; H05K7/20945
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
127 words
A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown, the method comprising the steps of: measuring the temperature of the cooling air prior to passage over the heat sink; measuring atmospheric pressure of the cooling air; determining the volumetric air flow rate of the cooling air; computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate; calculating power dissipation in the semiconductors; estimating heat sink and semiconductor temperatures from the calculated power dissipation and computed cooling air mass flow rate; and limiting semiconductor power dissipation so as to restrict semiconductor temperature to a safe operating value.
Claim 2
Independent Claim
127 words
A method for providing thermal protection for forced air cooled power electronic semiconductors without direct measurement of semiconductor temperature, the semiconductors being mounted on a heat sink over which cooling air is blown, the method comprising the steps of: measuring the temperature of the cooling air prior to passage over the heat sink; measuring atmospheric pressure of the cooling air; determining the volumetric air flow rate of the cooling air; computing, from the cooling air temperature, pressure and volumetric flow rate, the cooling air mass flow rate; calculating power dissipation in the semiconductors; estimating heat sink and semiconductor temperatures from the calculated power dissipation and computed cooling air mass flow rate; and limiting semiconductor power dissipation so as to restrict semiconductor temperature to a safe operating value.
Claim 3
Dependent Claim
20 words
The method of claim 1 and including the step of controlling the volumetric air flow rate to regulate semiconductor temperature.
Claim 4
Dependent Claim
83 words
The method of claim 1 wherein the step of calculating power dissipation includes the steps of: computing switching losses in the semiconductors from monitored values of applied DC voltage, switching frequency, fundamental output current frequency and current magnitude; calculating power factor from measured values of current, torque, fundamental output current frequency, applied DC voltage and modulation index; computing semiconductor conduction losses from the calculating power factor, measured current and modulation index; and summing the switching losses and conduction losses to obtain power dissipation.
Claim 5
Dependent Claim
47 words
The method of claim 1 wherein the step of estimating includes the steps of: creating an electronic model simulating the thermal characteristics of the heat sink and semiconductors; and computing semiconductor temperature from the electronic model based on computed power dissipation and cooling air mass flow rate.
Claim 6
Dependent Claim
108 words
The method of claim 1 wherein the cooling air is supplied from a blower and the step of computing the cooling air mass flow rate comprises the steps of: measuring cooling air flow rate at ##EQU2## a fixed blower speed; computing cooling air flow rate ##EQU3## at other blower speeds in direct proportion to the flow rate at the fixed speed; computing a standard air mass flow rate from the relationship ##EQU4## computing an actual air mass flow rate from the standard air mass flow rate in which actual flow rate is determined from: ##EQU5## where R is mass flow, T is temperature and P is atmospheric pressure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-26 | 2001-07-28 | 2002-01-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-26 | 2005-07-28 | 2006-01-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-26 | 2009-07-28 | 2010-01-27 | $7700.00 | Window Closed / Lapsed |