US5491610A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic package having active means to maintain its operating temperature constant
Assignee: GlobalFoundries Inc
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Filing: 1994-09-09
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Granted: 1996-02-13
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Expires: 2014-09-09
Abstract
Abstract An electronic package having an active cooling system for maintaining a semiconductor chip at approximately a constant temperature by monitoring the present temperature of the chip and varying the air flow over a heat sink in thermal contact with the chip in response to the temperature. In addition, the temperature difference between the semiconductor chip module and a printed circuit board is also monitored to maintain that difference at a preset value. The air flow is varied by a variable speed fan or a variable direction baffle.
Inventors
- 👤 Lawrence S.-W. Mok
- 👤 Sampath Purushothaman
- 👤 Bahgat G. Sammakia
- 👤 Janusz S. Wilczynski
- 👤 Tien Y. Wu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 14:56
CPC Classifications
G; G06; G06F; G06F1/00; G06F1/16; G06F1/20; G06F1/206; H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; Y; Y02; Y02D; Y02D10/00
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
94 words
An apparatus for actively cooling a semiconductor chip module comprising: a semiconductor chip module secured to a printed circuit board; a heat sink thermally secured to said module; variable air flow means for directing air flow over said heat sink; means for monitoring the temperature difference between the module and the printed current board; and control means for connecting the means for monitoring the temperature difference between the module and the printed circuit board and the variable air flow means to regulate the air flow to maintain the temperature difference at a preset value.
Claim 2
Independent Claim
94 words
An apparatus for actively cooling a semiconductor chip module comprising: a semiconductor chip module secured to a printed circuit board; a heat sink thermally secured to said module; variable air flow means for directing air flow over said heat sink; means for monitoring the temperature difference between the module and the printed current board; and control means for connecting the means for monitoring the temperature difference between the module and the printed circuit board and the variable air flow means to regulate the air flow to maintain the temperature difference at a preset value.
Claim 3
Dependent Claim
16 words
The apparatus of claim 1 wherein said variable air flow means is a variable speed fan.
Claim 4
Dependent Claim
19 words
The apparatus of claim 1 wherein said variable air flow means is a variable direction baffle and a fan.
Claim 5
Dependent Claim
37 words
The apparatus of claim 1 wherein said means for monitoring the temperature difference between the module and the printed circuit board module is a separate temperature sensor in thermal contact with each of said module and board.
Claim 6
Dependent Claim
46 words
The apparatus of claim 1 wherein said means for monitoring the temperature difference between the module and the printed circuit board including a temperature sensor in thermal contact with said board and means for sensing the supply current to a semiconductor chip attached to said module.
Claim 7
Dependent Claim
40 words
The apparatus of claim 1 further including means for monitoring the temperature of a semiconductor chip mounted in said module and wherein said control means also regulates the air flow to maintain the chip temperature at a substantially constant temperature.
Claim 8
Independent Claim
63 words
A method for actively cooling a semiconductor chip module comprising the steps of: monitoring the temperature difference between a semiconductor chip module and a printed circuit board on which the module is mounted; and varying the air flow over a heat sink in thermal contact with said module in response to said temperature difference to maintain said temperature difference at a preset value.
Claim 9
Independent Claim
63 words
A method for actively cooling a semiconductor chip module comprising the steps of: monitoring the temperature difference between a semiconductor chip module and a printed circuit board on which the module is mounted; and varying the air flow over a heat sink in thermal contact with said module in response to said temperature difference to maintain said temperature difference at a preset value.
Claim 10
Dependent Claim
26 words
The method of claim 7 wherein the step of varying the air flow over a heat sink includes varying the speed of a variable speed fan.
Claim 11
Dependent Claim
32 words
The method of claim 7 wherein the step of varying the air flow over a heat sink includes varying the direction of a baffle position between the heat sink and a fan.
Claim 12
Dependent Claim
42 words
The method of claim 7 further including the step of monitoring the present temperature of a chip attached to said module and varying the air flow over the heat sink to maintain the temperature of the chip at a substantially constant temperature.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-12 | 1999-08-14 | 2000-02-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-12 | 2003-08-14 | 2004-02-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-12 | 2007-08-14 | 2008-02-13 | $7700.00 | Window Closed / Lapsed |