Electrostatic chuck assembly

Claim 2

An electrostatic support system for supporting a wafer comprising: a support body positionable in a processing chamber and having a support surface for retaining said wafer, said support body including protective means for preventing catastrophic separation of said wafer from said support surface, a voltage source coupled to said support surface for electrostatically coupling said wafer to said support surface, and a cooling system for cooling said wafer, said cooling system including a source of a gaseous substance, a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface, and a conduit connecting said gas source to said gas distribution grooves for flow of said gaseous substance from said gas source to said gas distribution grooves, said conduit including an inner plenum coupled to said gas source and an outer plenum coupled to said gas distribution grooves, and said protective means including means for restricting the flow of said gaseous substance between said inner plenum and said outer plenum.

Claim 3

The support system of claim 1 in which said gas distribution grooves divide said support surface into a plurality of segments having a substantially uniform surface area.

Claim 4

The support system of claim 2 in which said segments have a substantially planar surface.

Claim 5

The support system of claim 2 in which said segments each have a surface area of about 1.5 to 2.5 square inches.

Claim 6

The support system of claim 1 in which said gas distribution grooves have a depth of about 0.015 inch and a width of about 0.062 inch.

Claim 7

The support system of claim 1 in which said gas distribution grooves have a substantially curved cross-sectional shape.

Claim 8

The support system of claim 1 in which said flow restricting means controls the flow of said gaseous substance between said inner plenum and said outer plenum at a rate such that when a portion of said wafer becomes separated from said support surface, the pressure of said gaseous substance in said gas distribution rings and said inner plenum is insufficient to disengage the remainder of said wafer from said support surface.

Claim 9

An electrostatic support system for supporting a wafer comprising; a support body positionable in a processing chamber and having a support surface for retaining said wafer, said support surface having a plurality of circumferentially spaced holes formed therethrough, said support body including protective means for preventing catastrophic separation of said wafer from said support surface; a voltage source coupled to said support surface for electrostatically coupling said wafer to said support surface; a cooling system for cooling said wafer, said cooling system including a source of a gaseous substance, a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface, and a conduit connecting said gas source to said gas distribution grooves for flow of said gaseous substance from said gas source to said gas distribution grooves, said conduit including a plurality of passageways each coupled to one of said holes extending through said support surface; a lifting mechanism for moving said wafer relative to said support surface, said lifting mechanism including a plurality of vertically extending lifting pins each extending through a different one of said holes formed through said support surface, said lifting pins being movable relative to said support surface between an extended position with said lifting pins extending through said hole in said support surface for supporting said wafer above said support surface and a retracted position with said lifting pins retracted beneath said support surface; said conduit including an inner plenum coupled to said gas source and an outer plenum coupled to said gas distribution grooves, and said protective means including means for restricting the flow of said gaseous substance between said inner plenum and said outer plenum.

Claim 10

An electrostatic support system for supporting a wafer comprising; a support body positionable in a processing chamber and having a support surface for retaining said wafer, said support surface having a plurality of circumferentially spaced holes formed therethrough, said support body including protective means for preventing catastrophic separation of said wafer from said support surface; a voltage source coupled to said support surface for electrostatically coupling said wafer to said support surface; a cooling system for cooling said wafer, said cooling system including a source of a gaseous substance, a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface, and a conduit connecting said gas source to said gas distribution grooves for flow of said gaseous substance from said gas source to said gas distribution grooves, said conduit including a plurality of passageways each coupled to one of said holes extending through said support surface; a lifting mechanism for moving said wafer relative to said support surface, said lifting mechanism including a plurality of vertically extending lifting pins each extending through a different one of said holes formed through said support surface, said lifting pins being movable relative to said support surface between an extended position with said lifting pins extending through said hole in said support surface for supporting said wafer above said support surface and a retracted position with said lifting pins retracted beneath said support surface; said conduit including an inner plenum coupled to said gas source and an outer plenum coupled to said gas distribution grooves, and said protective means including means for restricting the flow of said gaseous substance between said inner plenum and said outer plenum.

Claim 11

An electrostatic support system for supporting a wafer comprising: a support body positionable in a processing chamber and having a support surface for retaining said wafer, said support surface having a plurality of circumferentially spaced holes formed therethrough, a voltage source coupled to said support surface for electrostatically coupling said wafer to said support surface, a cooling system for cooling said wafer, said cooling system including a source of a gaseous substance, a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface, and a conduit connecting said gas source to said gas distribution grooves for flow of said gaseous substance from said gas source to said gas distribution grooves, said conduit including a plurality of passageways each coupled to one of said holes extending through said support surface, each of said passageways is formed with at least one flow restriction for restricting the flow of said gaseous substance between said gas distribution grooves and said gas source, and a lifting mechanism for moving said wafer relative to said support surface, said lifting mechanism including a plurality of vertically extending lifting pins each extending through a different one of said holes formed through said support surface, said lifting pins being movable relative to said support surface between an extended position with said lifting pins extending through said hole in said support surface for supporting said wafer above said support surface and a retracted position with said lifting pins retracted beneath said support surface.

Claim 12

An electrostatic support system for supporting a wafer comprising: a support body positionable in a processing chamber and having a support surface for retaining said wafer, said support surface having a plurality of circumferentially spaced holes formed therethrough, a voltage source coupled to said support surface for electrostatically coupling said wafer to said support surface, a cooling system for cooling said wafer, said cooling system including a source of a gaseous substance, a plurality of gas distribution grooves formed in said support surface and configured for uniformly distributing a gaseous substance between said wafer and said support surface, and a conduit connecting said gas source to said gas distribution grooves for flow of said gaseous substance from said gas source to said gas distribution grooves, said conduit including a plurality of passageways each coupled to one of said holes extending through said support surface, each of said passageways is formed with at least one flow restriction for restricting the flow of said gaseous substance between said gas distribution grooves and said gas source, and a lifting mechanism for moving said wafer relative to said support surface, said lifting mechanism including a plurality of vertically extending lifting pins each extending through a different one of said holes formed through said support surface, said lifting pins being movable relative to said support surface between an extended position with said lifting pins extending through said hole in said support surface for supporting said wafer above said support surface and a retracted position with said lifting pins retracted beneath said support surface.

Claim 13

An electrostatic support system for retaining a wafer in a processing chamber having a chamber wall and a bottom, said support system comprising: a body portion having a support surface for retaining said wafer, a plurality of arm members extending outwardly from said body portion for supporting said body portion in said processing chamber with said body portion and said arm members spaced from the bottom of said chamber, and means for applying a charge to said support surface for electrostatically coupling said wafer to said support surface.

Claim 14

An electrostatic support system for retaining a wafer in a processing chamber having a chamber wall and a bottom, said support system comprising: a body portion having a support surface for retaining said wafer, a plurality of arm members extending outwardly from said body portion for supporting said body portion in said processing chamber with said body portion and said arm members spaced from the bottom of said chamber, and means for applying a charge to said support surface for electrostatically coupling said wafer to said support surface.

Claim 15

The support system of claim 10, and further comprising a carriage assembly mountable to said chamber, said arm members being mounted to said carriage assembly.

Claim 16

The support system of claim 10 in which said arm members are mountable to said chamber wall of said processing chamber.

Claim 17

The support system of claim 12 in which said chamber wall includes a plurality of side wall portions and in which said arm members are positioned on said body portion such that when said support system is installed in said processing chamber, said arm portions are mounted to one of said side wall portions.

Claim 18

The support system of claim 10 in which said support system includes two of said arm members.

Claim 19

The support system of claim 10 in which said means for applying a charge includes a voltage source remote from said body portion and at least one electrical connector coupled to said voltage source and extending through a passageway formed in one of said arm members.

Claim 20

The support system of claim 10 in which said means for applying a charge includes at least one electrode carded by said body portion and an electrode cooling system for cooling said electrode, said electrode cooling system including a liquid source remote from said body portion and a conduit extending through a passageway formed in one of said arm members.

Claim 21

The support system of claim 16 in which said means for applying a charge includes at least one electrical connector extending through a passageway formed in another of said arm members.

Claim 22

The support system of claim 10, and further comprising biasing means for applying an RF bias to said body portion.

Claim 23

The support system of claim 18 in which said biasing means includes a source remote from said body portion and at least one electrical connector extending through a passageway in one of said arm members.

Claim 24

The support system of claim 10, and further comprising a wafer cooling system for cooling said wafer.

Claim 25

The support system of claim 20 in which said wafer cooling system includes a source of a gaseous substance and a conduit coupling said gaseous substance source to said support surface, said conduit extending through a passageway formed in one of said arm members.

Claim 26

The support system of claim 21 in which said wafer cooling system includes a plurality of gas distribution grooves formed in said support surface.

Claim 27

The support system of claim 21 in which said support body includes protective means for preventing catastrophic separation of said wafer from said support surface.

Claim 28

The support system of claim 23 in which said conduit includes an inner plenum coupled to said gas source and an outer plenum coupled to said support surface, and in which said protective means includes means for restricting the flow of said gaseous substance between said inner plenum and said outer plenum.

Claim 29

The support system of claim 21 in which said conduit includes at least one hole extending through said support surface.

Claim 30

The support system of claim 21 in which said body portion includes at least one lifting member movable relative to said support surface between an extended position with said lifting member extending through said hole in said support surface for supporting said wafer above said support surface and a retracted position with said lifting member retracted beneath said support surface.