Patent US5703407A successfully refreshed from Google Patents.
US5703407A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin-sealed type semiconductor device
Assignee: Toshiba Corp
•
Filing: 1996-02-12
•
Granted: 1997-12-30
•
Expires: 2016-02-12
Abstract
Abstract In the resin-sealed type semiconductor device of the present invention, the inner lead is adhered onto the semiconductor element via the insulating tape, and electrically connected to the semiconductor element. The inner lead, the insulating tape and the semiconductor element are sealed by resin in a package. The outer lead is integrated with the inner lead to form a step, formed thicker than that of the inner lead, and has an exposed surface in the same plane as the upper surface of the package.
Inventors
- 👤 Masahiko Hori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10P; H10P14/00; H10P14/60; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
190 words
A resin-sealed type semiconductor device comprising: a semiconductor element having a main surface and a plurality of electrodes arranged on said main surface; a plurality of leads, each said lead constituted by an inner lead portion and an outer lead portion, bottom surfaces of said inner lead portions being overlapped with and fixed to the main surface of said semiconductor element via an adhesive insulating material, top surfaces of said inner lead portions being respectively electrically connected to said electrodes of said semiconductor element, and top surfaces of said outer lead portions being elevated relative to said top surfaces of said inner lead portions; and a resin package for sealing said semiconductor element, said inner lead portions, and said outer lead portions, while leaving said top surfaces of said outer lead portions exposed in a same plane as a top surface of a portion of said resin package sealing the main surface of said semiconductor element, and side surfaces of said outer lead portions being exposed in flush relation with a peripheral surface of said resin package, such that said plurality of leads do not protrude from said resin package.
Claim 2
Dependent Claim
190 words
A resin-sealed type semiconductor device comprising: a semiconductor element having a main surface and a plurality of electrodes arranged on said main surface; a plurality of leads, each said lead constituted by an inner lead portion and an outer lead portion, bottom surfaces of said inner lead portions being overlapped with and fixed to the main surface of said semiconductor element via an adhesive insulating material, top surfaces of said inner lead portions being respectively electrically connected to said electrodes of said semiconductor element, and top surfaces of said outer lead portions being elevated relative to said top surfaces of said inner lead portions; and a resin package for sealing said semiconductor element, said inner lead portions, and said outer lead portions, while leaving said top surfaces of said outer lead portions exposed in a same plane as a top surface of a portion of said resin package sealing the main surface of said semiconductor element, and side surfaces of said outer lead portions being exposed in flush relation with a peripheral surface of said resin package, such that said plurality of leads do not protrude from said resin package.
Claim 3
Dependent Claim
42 words
The device according to claim 1, wherein said side surfaces of said outer lead portions are spaced beyond a side of said semiconductor element by a distance corresponding to a thickness of said resin package sealing the side of said semiconductor element.
Claim 4
Dependent Claim
195 words
A resin-sealed type semiconductor device comprising: a semiconductor element having a main surface and a plurality of electrodes arranged on said main surface; a plurality of leads, each said lead constituted by an inner lead portion and an outer lead portion, bottom surfaces of said inner lead portions being overlapped with and fixed to the main surface of said semiconductor element via an adhesive insulating material, and top surfaces of said outer lead portions being elevated relative to top surfaces of said inner lead portions; and bonding wires respectively electrically connecting bonding sites on said top surfaces of said inner lead portions to said electrodes of said semiconductor element; and a resin package for sealing said semiconductor element, said inner lead portions, and said outer lead portions, while leaving said top surfaces of said outer lead portions exposed in a same plane as a top surface of a portion of said resin package sealing the main surface of said semiconductor element, and side surfaces of said outer lead portions being exposed in flush relation with a peripheral surface of said resin package, such that said plurality of leads do not protrude from said resin package.
Claim 5
Dependent Claim
195 words
A resin-sealed type semiconductor device comprising: a semiconductor element having a main surface and a plurality of electrodes arranged on said main surface; a plurality of leads, each said lead constituted by an inner lead portion and an outer lead portion, bottom surfaces of said inner lead portions being overlapped with and fixed to the main surface of said semiconductor element via an adhesive insulating material, and top surfaces of said outer lead portions being elevated relative to top surfaces of said inner lead portions; and bonding wires respectively electrically connecting bonding sites on said top surfaces of said inner lead portions to said electrodes of said semiconductor element; and a resin package for sealing said semiconductor element, said inner lead portions, and said outer lead portions, while leaving said top surfaces of said outer lead portions exposed in a same plane as a top surface of a portion of said resin package sealing the main surface of said semiconductor element, and side surfaces of said outer lead portions being exposed in flush relation with a peripheral surface of said resin package, such that said plurality of leads do not protrude from said resin package.
Claim 6
Dependent Claim
42 words
The device according to claim 3, wherein said side surfaces of said outer lead portions are spaced beyond a side of said semiconductor element by a distance corresponding to a thickness of said resin package sealing the side of said semiconductor element.
Claim 7
Dependent Claim
30 words
The device according to claim 3, wherein portions of said top surfaces of said outer lead portions overlap a portion of said main surface of said semiconductor element main surface.
References Cited (Backward Citations)
US5406124A
Cited
US5493151A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-29 | 2001-06-30 | 2001-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-29 | 2005-06-30 | 2005-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-29 | 2009-06-30 | 2009-12-30 | $7700.00 | Window Closed / Lapsed |