US5700697A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for packaging an integrated circuit using a reconstructed package
Assignee: PROMEX INDUSTRIES Inc
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Filing: 1995-06-06
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Granted: 1997-12-23
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Expires: 2015-06-06
Abstract
Abstract A reconstructed package for an integrated circuit (IC) chip and a method of re-configuring any prefabricated IC package (with or without a silicon chip and wires inside) so that an IC chip can be installed and interconnected for normal use. A pre-molded plastic or other package is abraded to expose the wire bond pads and to form a mounting surface to which a new chip may be mounted. The encapsulating material is removed without damaging the plating material on the lead frame. The new chip is then mounted onto the mounting surface and new wire bonds are connected between the new chip and the lead frame. Encapsulating material, such as epoxy, is then placed over the chip and wire bonds and cured. The invention provides an alternative process whereby the die can be encapsulated in minutes per unit.
Inventors
- 👤 Joseph J. Dlugokecki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 11:04
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/114; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
115 words
A method of packaging an integrated circuit chip, comprising the steps of: (a) obtaining a circuit package, the package having a lead frame encapsulated in an encapsulating material, the lead frame having a plurality of fingers, each finger having a wire bond pad thereon; (b) removing the encapsulating material to expose a plurality of the wire bond pads; (c) mounting a chip within the package, the chip having a plurality of contact pads thereon; (e) connecting a wire bond between one of the plurality of contact pads on the chip and one of the plurality of wire bond pads; and (f) encapsulating the chip and the plurality of wire bond pads in an insulating material.
Claim 2
Independent Claim
115 words
A method of packaging an integrated circuit chip, comprising the steps of: (a) obtaining a circuit package, the package having a lead frame encapsulated in an encapsulating material, the lead frame having a plurality of fingers, each finger having a wire bond pad thereon; (b) removing the encapsulating material to expose a plurality of the wire bond pads; (c) mounting a chip within the package, the chip having a plurality of contact pads thereon; (e) connecting a wire bond between one of the plurality of contact pads on the chip and one of the plurality of wire bond pads; and (f) encapsulating the chip and the plurality of wire bond pads in an insulating material.
Claim 3
Dependent Claim
30 words
The method of claim 1 wherein the step of removing the encapsulating material comprises removing the encapsulating material within a first distance above the surface of the wire bond pads.
Claim 4
Dependent Claim
18 words
The method of claim 1 wherein the step of removing the encapsulating material comprises grinding the encapsulating material.
Claim 5
Dependent Claim
19 words
The method of claim 1 wherein the step of removing the encapsulating material comprises chemically etching the encapsulating material.
Claim 6
Dependent Claim
19 words
The method of claim 1 wherein the step of removing the encapsulating material comprises sand blasting the encapsulating material.
Claim 7
Dependent Claim
26 words
The method of claim 5 wherein the step of sand blasting the encapsulating material comprises impinging a fine powder against the encapsulating material under high pressure.
Claim 8
Dependent Claim
25 words
The method of claim 5 wherein the step of sand blasting the encapsulating material comprises impinging a liquid against the encapsulating material under high pressure.
Claim 9
Dependent Claim
24 words
The method of claim 7 wherein the step of impinging a liquid comprises delivering a pulsating liquid under high pressure against the encapsulating material.
Claim 10
Dependent Claim
19 words
The method of claim 1 wherein the step of removing the encapsulating material comprises plasma etching the encapsulating material.
Claim 11
Dependent Claim
22 words
The method of claim 1 wherein the step of removing the encapsulating material comprises impinging the encapsulating material with a pressurized liquid.
Claim 12
Dependent Claim
26 words
The method of claim 1 wherein the step of removing the encapsulating material includes removing at least a portion of another chip mounted within the package.
Claim 13
Dependent Claim
33 words
The method of claim 1 further comprising cleaning the exposed wire bond pads prior to connecting the plurality of wire bonds between the contact pads on the chip and the wire bond pads.
Claim 14
Dependent Claim
26 words
The method of claim 12 wherein the step of cleaning the wire bond pads comprises delivering de-ionized water using a high pressure pulsating liquid ejector device.
Claim 15
Dependent Claim
33 words
The method of claim 13 wherein the step of cleaning the wire bond pads further comprises removing the de-ionized water by delivering electronic grade alcohol using a high pressure pulsating liquid ejector device.
Claim 16
Dependent Claim
17 words
The method of claim 1 further comprising cleaning ultrasonically the exposed wire bond pads in de-ionized water.
Claim 17
Dependent Claim
16 words
The method of claim 1 further comprising cleaning ultrasonically the exposed wire bond pads in alcohol.
Claim 18
Independent Claim
120 words
A method of packaging an integrated circuit chip in an existing pre-fabricated package, the package having a lead frame encapsulated in an insulating material, the lead frame having a plurality of fingers, each finger having a wire bond pad thereon, the method comprising the steps of: (a) exposing a plurality of the wire bond pads by removing the insulating material thereover; (b) mounting the integrated circuit chip within the package, the integrated circuit chip having a plurality of contact pads thereon; (d) electrically connecting a plurality of the contact pads on the integrated circuit chip to a plurality of the exposed wire bond pads; and (e) encapsulating the integrated circuit chip and exposed wire bond pads with an encapsulating material.
Claim 19
Independent Claim
120 words
A method of packaging an integrated circuit chip in an existing pre-fabricated package, the package having a lead frame encapsulated in an insulating material, the lead frame having a plurality of fingers, each finger having a wire bond pad thereon, the method comprising the steps of: (a) exposing a plurality of the wire bond pads by removing the insulating material thereover; (b) mounting the integrated circuit chip within the package, the integrated circuit chip having a plurality of contact pads thereon; (d) electrically connecting a plurality of the contact pads on the integrated circuit chip to a plurality of the exposed wire bond pads; and (e) encapsulating the integrated circuit chip and exposed wire bond pads with an encapsulating material.
Claim 20
Dependent Claim
52 words
The method of packaging an integrated circuit chip as set forth in claim 17 wherein the step of exposing a plurality of the wire bond pads comprises using at least one removal technique selected from the group comprising: sand blasting, mechanical grinding, chemical etching, plasma etching, ultrasonic cleaning, and pressurized liquid impingement.
Claim 21
Independent Claim
82 words
A method of packaging an integrated circuit chip by modifying a circuit package having encapsulated wire bond pads to which electrical connection is to be made by an encapsulated integrated circuit chip, the method comprising: removing the existing encapsulating material to expose the wire bond pads, mounting the integrated circuit chip within the package and electrically connecting it to the wire bond pads, and reconstructing the package by adding insulating material over the mounted integrated circuit chip and the wire bond pads.
Claim 22
Independent Claim
82 words
A method of packaging an integrated circuit chip by modifying a circuit package having encapsulated wire bond pads to which electrical connection is to be made by an encapsulated integrated circuit chip, the method comprising: removing the existing encapsulating material to expose the wire bond pads, mounting the integrated circuit chip within the package and electrically connecting it to the wire bond pads, and reconstructing the package by adding insulating material over the mounted integrated circuit chip and the wire bond pads.
Claim 23
Dependent Claim
48 words
The method of packaging an integrated circuit chip as set forth in claim 19 wherein the step of removing the existing encapsulating material comprises using at least one removal technique selected from the group comprising: sand blasting, grinding, chemical etching, plasma etching, ultrasonic cleaning, and pressurized liquid impingement.
References Cited (Backward Citations)
US3482419A
Cited
US3627901A
Cited
US3762039A
Cited
US3969813A
Cited
US4089704A
Cited
US4384917A
Cited
US4567006A
Cited
US4359360A
Cited
US4691225A
Cited
US4474621A
Cited
JPS60124834A
Cited
DD223295A1
Cited
JPS6124405A
Cited
JPS6172196A
Cited
JPS61110437A
Cited
JPS62247553A
Cited
US4768286A
Cited
JPS63184347A
Cited
JPS63287043A
Cited
US4980019A
Cited
US4914813A
Cited
JPH02260548A
Cited
JPH02278740A
Cited
US5041396A
Cited
US5155068A
Cited
JPH0496259A
Cited
US5149662A
Cited
WO1992020096A1
Cited
US5138430A
Cited
USH1379H
Cited
US5180093A
Cited
US5252179A
Cited
US5406117A
Cited
US5398926A
Cited
US5424254A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-22 | 2001-06-23 | 2001-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-22 | 2005-06-23 | 2005-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-22 | 2009-06-23 | 2009-12-23 | $7700.00 | Window Closed / Lapsed |