Composite electronic device package-connector unit

Claim 2

A composite electronic device package and connector unit comprising a conductive member including a plurality of lead members extending from opposite directions and having mutually spaced terminal members at one end adapted to be connected to an electronic device and a plurality of associated male connector pins rigidly joined to respective ends of said lead members opposite to said terminal members, said male connector pins having a substantially greater thickness than said lead members, web members integrally connecting said respective ends of said lead members to said male connector pins, said web members having a varying thickness tapering from said lead members to the substantially greater thickness of said male connector pins means for supporting the electronic device in electrical communication with said terminal members, and a preselected nonconductive encapsulation material encapsulating said plurality of lead members, said web members and a preselected portion of said male connector pins to expose the end portions thereof extending away from said web members, said encapsulation material including a cavity exposing said terminal members to permit electrical connections To be made between said terminal members and the electronic device.

Claim 3

A composite electronic device package in accordance with claim 1 wherein said male connector pins extend outwardly away from said encapsulation material and generally perpendicular to said lead members.

Claim 4

A composite electronic device package in accordance with claim 2 wherein said plurality of lead members are coplanar and extent into said encapsulation material from mutually opposite directions, said web members each have a generally right-angle bend therein, and said male connector pins extend from the encapsulation material in a direction normal to the plane defined by said lead members.

Claim 5

A composite electronic device package and connector in accordance with claim 3 wherein said terminal members are coplanar and terminate in spaced relationship to define a partially enclosed space adapted to accommodate the electronic device, said space being exposed by said cavity, and said male connector pins depend from the relatively thickest portions of said web members adjacent opposed peripheral portions of said cavity and extend from said encapsulation material in aligned spaced relationship with respect to each other.

Claim 6

A composite electronic device package and connector in accordance with claim 4 wherein the electronic device comprises a semiconductor device having a plurality of circuit elements at a surface thereof, said semiconductor device being supported within said space in said cavity, mans electrically connecting said terminal members with selected circuit elements, and a closure means is sealingly disposed within said cavity.

Claim 7

A composite electronic device package and connector in accordance with claim 4 wherein a bonding pad is provided including an enlarged central portion arranged in spaced relationship from said terminal members in said partially enclosed space, said bonding pad including a pair of support members extending from said enlarged central portion and terminating within said encapsulation material to rigidly support said bonding pad, said support members being coplanar with said terminal members and said lead members, each support member including a bend at an angle to the plane defined by said coplanar terminal members to effect positioning of said enlarged central portion at the base of said cavity spaced from said coplanar terminal members.

Claim 8

A composite electronic device package and connector in accordance with claim 6 wherein the electronic device comprises a semiconductor device supported on said enlarged central portion of said bonding pad and having an exposed surface substantially flush with the plane defined by said terminal members, said exposed surface including a plurality of circuit elements, electrical conductors interconnecting said terminal members and selected circuit elements, and a plug of encapsulation material sealingly disposed within said cavity for protecting and maintaining said semiconductor device and said conductors rigidly in position.

Claim 9

A composite electronic device package and connector in accordance with claim 3 wherein said terminal members are arranged in a generally radial configuration to define a space within said cavity, said space being substantially completely surrounded by said terminal members.

Claim 10

A composite electronic device package and connector in accordance with claim 8 wherein the electronic device comprises a semiconductor device having a plurality of circuit elements at a surface thereof, said semiconductor device being disposed in registration with said space and being supported at said surface by said radially arranged terminal members in electrical contact with selected circuit elements.

Claim 11

A composite electronic device package and connector in accordance with claim 9 wherein said terminal members are supported by said encapsulation material at the base of said cavity and a plug of encapsulation material is sealingly disposed within said cavity.

Claim 12

An integral package and connecTor unit for electronic devices comprising a plurality of spaced lead members of a first preselected thickness having inner ends defining a plurality of coplanar terminal members adapted to be connected to an electronic device and having outer ends terminating in aligned spaced relationship, a plurality of male connector pins of a second preselected thickness greater than said first preselected thickness integrally connected to said outer ends of said lead members forming L-shaped junctions therewith, said male connector pins extending generally perpendicularly form said outer ends and terminating in aligned parallel relationship and being adapted for connection in an electronic system, a nonconductive encapsulation material encapsulating said lead members said L-shaped junctions and preselected portions of said male connector pins and means defining a selectively sealable cavity in said encapsulation material exposing said coplanar terminal members.

Claim 13

An integral package and connecTor unit for electronic devices comprising a plurality of spaced lead members of a first preselected thickness having inner ends defining a plurality of coplanar terminal members adapted to be connected to an electronic device and having outer ends terminating in aligned spaced relationship, a plurality of male connector pins of a second preselected thickness greater than said first preselected thickness integrally connected to said outer ends of said lead members forming L-shaped junctions therewith, said male connector pins extending generally perpendicularly form said outer ends and terminating in aligned parallel relationship and being adapted for connection in an electronic system, a nonconductive encapsulation material encapsulating said lead members said L-shaped junctions and preselected portions of said male connector pins and means defining a selectively sealable cavity in said encapsulation material exposing said coplanar terminal members.

Claim 14

An integral package and connector unit in accordance with claim 11 wherein said L-shaped junctions vary transversely in thickness between said first preselected thickness at said outer ends of said lead members and said second preselected thickness at said male connectors.

Claim 15

An integral package and connector unit in accordance with claim 12 wherein said L-shaped junctions include edge portions of said first preselected thickness defined at the associated outer ends of said lead members.

Claim 16

An integral package and connector unit in accordance with claim 12 wherein a semiconductor device is supported within said cavity in electrical communication with said terminal members and a closure means formed of said encapsulation material is sealingly disposed within said cavity.

Claim 17

An integral package and connector unit in accordance with claim 12 wherein said lead members and said male connector pins are formed of a unitary body of conductive material.

Claim 18

An integral package and connector unit in accordance with claim 15 wherein said lead members have a thickness of approximately 0.010 inch and said male connector pins have a thickness of approximately 0.025 inch.

Claim 19

A unitary package and connector unit for an electronic device comprising a first row of spaced lead members extending from a predetermined direction having inner ends defining a plurality of terminal members and having outer ends terminating in aligned spaced relationship, a second row of spaced lead members extending from an opposite direction from said first row, having inner ends defining terminal members cooperating with said plurality of terminal members to define an array of coplanar terminal members adapted for connection to an electronic device, and having outer ends terminating in aligned spaced relationship, said first and second rows of lead members being of a first preselected thickness, a plurality of male connectors of a second preselected thickness greater than said first preselected thickness integrally joined to said outer ends of said first and second rows of lead members by integral L-shaped junctions, said male connectors defining first and second rows depending generally perpendicularly from said first and second rows of lead members respectively in aligned parallel relationship and being adapted for connection to an electronic system, and a nonconductive encapsulation material encapsulating said lead members said junctions and a preselected portion of said male connectors, said encapsulation material having a selectively closable cavity exposing said array of coplanar terminal members.

Claim 20

A unitary package and connector unit for an electronic device comprising a first row of spaced lead members extending from a predetermined direction having inner ends defining a plurality of terminal members and having outer ends terminating in aligned spaced relationship, a second row of spaced lead members extending from an opposite direction from said first row, having inner ends defining terminal members cooperating with said plurality of terminal members to define an array of coplanar terminal members adapted for connection to an electronic device, and having outer ends terminating in aligned spaced relationship, said first and second rows of lead members being of a first preselected thickness, a plurality of male connectors of a second preselected thickness greater than said first preselected thickness integrally joined to said outer ends of said first and second rows of lead members by integral L-shaped junctions, said male connectors defining first and second rows depending generally perpendicularly from said first and second rows of lead members respectively in aligned parallel relationship and being adapted for connection to an electronic system, and a nonconductive encapsulation material encapsulating said lead members said junctions and a preselected portion of said male connectors, said encapsulation material having a selectively closable cavity exposing said array of coplanar terminal members.

Claim 21

A unitary package and connector unit in accordance with claim 17 wherein a bonding pad for mechanically supporting the electronic device is supported within said cavity by said encapsulation material in a position generally centrally located with respect to said array of terminal members and spaced from said terminal members.

Claim 22

A unitary package and connector unit in acCordance with claim 18 wherein the electronic device comprises a semiconductor device supported by said bonding pad, means electrically connecting preselected areas of said semiconductor device with said array of terminal members exposed by said cavity, and means for sealingly closing said cavity.

Claim 23

A unitary package and connector unit in accordance with claim 17 wherein said coplanar terminal members are arranged in mutually spaced relationship in a generally radial array for mechanically supporting a semiconductor device within said cavity.

Claim 24

A unitary package and connector unit in accordance with claim 20 wherein said terminal members are supported at least partially embedded in the encapsulation material at the base of said cavity and the semiconductor device is disposed directly on said terminal members to effect direct electrical contact with preselected areas of said semiconductor device, and closure means sealingly disposed within said cavity.

Claim 25

An electronic device package and connector unit comprising a plurality of spaced lead members including inner ends defining a plurality of coplanar terminal members adapted to be connected to an electronic device and outer ends terminating in enlarged shoulder members, said shoulder members each including an integral flange depending therefrom, a nonconductive encapsulating material encapsulating said lead members, said encapsulation material having a selectively sealable cavity exposing said terminal members, and having an outer edge surface terminating at said shoulder members, a plurality of male connector pins rigidly secured to said flanges and terminating at their outer ends in aligned relationship spaced from said encapsulation material, said male connector pins being adapted for connection in an electronic system.

Claim 26

An electronic device package and connector unit comprising a plurality of spaced lead members including inner ends defining a plurality of coplanar terminal members adapted to be connected to an electronic device and outer ends terminating in enlarged shoulder members, said shoulder members each including an integral flange depending therefrom, a nonconductive encapsulating material encapsulating said lead members, said encapsulation material having a selectively sealable cavity exposing said terminal members, and having an outer edge surface terminating at said shoulder members, a plurality of male connector pins rigidly secured to said flanges and terminating at their outer ends in aligned relationship spaced from said encapsulation material, said male connector pins being adapted for connection in an electronic system.

Claim 27

An electronic device package and connector unit in accordance with claim 22 wherein said shoulder members extend outwardly from the outer edge surface of said encapsulation material a predetermined distance sufficient to define a space intermediate the outer edge surface of said encapsulation material and said flanges, and the inner ends of said male connector pins are disposed within said space rigidly attached to the inwardly facing surfaces of said flanges and extending exteriorly of said encapsulation material.

Claim 28

An electronic device package and connector unit in accordance with claim 23 wherein said flanges depend generally perpendicular to said shoulder members forming an arcuate junction therewith.

Claim 29

An electronic device package and connector unit in accordance with claim 23 wherein said plurality of lead members are coplanar and extend into said encapsulation material from opposite directions, and said coplanar terminals members are arranged in spaced relationship to define a partially enclosed space adapted to accommodate the electronic device, said space being exposed by said cavity.

Claim 30

An electronic device package and connector unit in accordance with claim 25 wherein a semiconductor bonding pad is disposed within said space arranged spaced from said terminal members and supported by said encapsulation material at the base of said cavity spaced from the plane defined by said terminal members.

Claim 31

An electronic device package and connector unit in accordance with claim 26 wherein the electronic device comprises a semiconductor device supported on said bonding pad, said semiconductor device having a plurality of circuit elements at an exposed surface thereof, substantially flush with the plane defined by said terminal members, means electrically interconnecting said terminal members with preselected circuit elements, and sealant means disposed within said cavity.

Claim 32

An electronic device package and connector unit in accordance with claim 23 wherein said plurality of lead members are coplanar and extend into said encapsulation material from opposite directions and said terminals members are arranged in a generally radial configuration within Said cavity and are at least partially embedded within said encapsulation material.

Claim 33

An electronic device package and connector unit in accordance with claim 28 wherein the electronic device comprises a semiconductor device having a plurality of circuit elements at a surface thereof, said semiconductor device being supported within said cavity with said surface in direct engagement with said terminals to effect electrical connections between said terminal members and preselected circuit elements, and a sealant plug is sealingly disposed within said cavity.