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Patent US5696665A successfully refreshed from Google Patents.
US5696665A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package with diamond heat sink
Assignee: Saint Gobain Ceramics and Plastics Inc
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Filing: 1996-04-22
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Granted: 1997-12-09
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Expires: 2016-04-22
Abstract
Abstract An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond or diamond-coated silicon carbide or molybdenum, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate. The thermal connection can be by bonding the pins directly to the substrate.
Inventors
- 👤 Bela G. Nagy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:01
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W40/20; H10W40/25; H10W40/254; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
76 words
An integrated circuit package comprising: (a) an integrated circuit, (b) a lead frame having a plurality of legs in electrical connnection with the integrated circuit, and (c) an electrically insulating, thermally conductive substrate having first and second faces, the first face being coated with diamond film which is in intimate thermal contact with both the integrated circuit and the plurality of legs of the lead frame, the bulk of the substrate comprising a thermally-conductive non-diamond material.
Claim 2
Dependent Claim
76 words
An integrated circuit package comprising: (a) an integrated circuit, (b) a lead frame having a plurality of legs in electrical connnection with the integrated circuit, and (c) an electrically insulating, thermally conductive substrate having first and second faces, the first face being coated with diamond film which is in intimate thermal contact with both the integrated circuit and the plurality of legs of the lead frame, the bulk of the substrate comprising a thermally-conductive non-diamond material.
Claim 3
Dependent Claim
23 words
The package of claim 1 wherein the non-diamond material is chosen from the group consisting of molybdenum, aluminum nitride, graphite, and silicon carbide.
Claim 4
Dependent Claim
17 words
The package of claim 2 wherein the diamond film has a thickness of at least 5 micrometers.
Claim 5
Dependent Claim
14 words
The package of claim 1 wherein the non-diamond material is about 500 microns thick.
References Cited (Backward Citations)
US4764804A
Cited
EP0273556A1
Cited
US5008737A
Cited
JPH03227535A
Cited
US5146314A
Cited
EP0515094A1
Cited
EP0538798A1
Cited
JPH05160304A
Cited
JPH05251609A
Cited
US5379187A
Cited
JPH06291217A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-08 | 2001-06-09 | 2001-12-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-08 | 2005-06-09 | 2005-12-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-08 | 2009-06-09 | 2009-12-09 | $7700.00 | Window Closed / Lapsed |