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US5689796A
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Method of manufacturing molded copper-chromium family metal alloy article
Assignee: Toho Kinzoku Co Ltd
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Filing: 1996-07-18
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Granted: 1997-11-18
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Expires: 2016-07-18
Abstract
Abstract The method of the invention is concerned with the manufacture of a molded copper-chromium family metal based alloy article which involves the steps of injection-molding a mixture of copper powder, a chromium family metal powder, an iron family metal powder and a thermoplastic organic binder made up of a polymer binder and low molecular binder in a ratio by volume of 5:1 to 1:1, dewaxing a molded body formed by the injection-molding by heating in a reducing atmosphere, and then sintering the dewaxed molded body at 1,100 DEG to 1,450 DEG C. in a reducing atmosphere. According to this method, molded articles having a high dimensional accuracy and high density can be provided.
Inventors
- 👤 Takao Kasai
- 👤 Naoto Ogasawara
- 👤 Naoyoshi Akiyoshi
- 👤 Takeo Hamada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:52
CPC Classifications
B; B22; B22F; B22F3/00; B22F3/22; B22F3/225; B22F1/00; B22F1/10; B22F1/103; C; C22; C22C; C22C1/00; C22C1/04; C22C1/045; B22F2998/00
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
88 words
A method of manufacturing a molded copper-chromium family metal based alloy article which comprises injection-molding a mixture consisting essentially of copper powder, a chromium family metal powder, an iron family metal powder, phosphorous and a thermoplastic organic binder consisting essentially of a polymer binder and a low molecular binder in a ratio by volume of 5:1 to 1:1, dewaxing a molded body formed by the injection-molding by heating in a reducing atmosphere, and then sintering the dewaxed molded body at 1,100 to 1,450° C. in a reducing atmosphere.
Claim 2
Independent Claim
88 words
A method of manufacturing a molded copper-chromium family metal based alloy article which comprises injection-molding a mixture consisting essentially of copper powder, a chromium family metal powder, an iron family metal powder, phosphorous and a thermoplastic organic binder consisting essentially of a polymer binder and a low molecular binder in a ratio by volume of 5:1 to 1:1, dewaxing a molded body formed by the injection-molding by heating in a reducing atmosphere, and then sintering the dewaxed molded body at 1,100 to 1,450° C. in a reducing atmosphere.
Claim 3
Dependent Claim
14 words
The method of claim 1 wherein the chromium family metal is tungsten or molybdenum.
Claim 4
Dependent Claim
28 words
The method of claim 1 wherein said phosphorus is present as a compound selected from the group consisting of copper phosphide, nickel phosphide, cobalt phosphide and copper phosphate.
Claim 5
Dependent Claim
14 words
The method of claim 1 wherein said mixture is pulverized by a jet mill.
Claim 6
Dependent Claim
56 words
The method of claim 1, wherein said polymer binder is selected from the group consisting of copolymers of ethylene vinyl acetate-butyl methacrylate-styrene, polypropylene, polyethylene and mixtures thereof and said low molecular binder is selected from the group consisting of polyethylene wax, paraffin wax, microcrystalline wax, carnauba wax, stearic acid, dibutyl phthalate, oleic acid and mixtures thereof.
Claim 7
Dependent Claim
20 words
The method of claim 1, wherein the ratio of polymer binder to low molecular binder is from 3:1 to 1:1.
Claim 8
Dependent Claim
46 words
The method of claim 1, wherein the copper powder has a mean particle size of from 1-2 μm, the chromium family metal powder has a mean particle size of from 1-2 μm and the iron family powder has a mean particle size of from 1-2 μm.
Claim 9
Dependent Claim
50 words
The method of claim 1, wherein the ratio of copper powder to chromium family metal powder is 10:90-25:75, by weight, the iron family metal powder is present in an amount of from 0.2 to 0.5 wt. % and the phosphorus is present in an amount of from 0.01-0.1 wt. %.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-17 | 2001-05-19 | 2001-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-17 | 2005-05-19 | 2005-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-17 | 2009-05-19 | 2009-11-18 | $7700.00 | Window Closed / Lapsed |