US5688704A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit fabrication
Assignee: Nokia of America Corp
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Filing: 1995-11-30
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Granted: 1997-11-18
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Expires: 2015-11-30
Abstract
Abstract A method of integrated circuit fabrication is disclosed. Layers of silicon nitride and silicide dioxide are formed upon a silicon substrate. These layers are etched to create a channel having the width of the intended gate. The silicon dioxide is then wet etched. Next, polysilicon is deposited within the channel. The silicon dioxide and the silicon nitride layers are then removed. A T-shaped polysilicon gate facilitates the formation of rectangular-shaped silicon nitride spacers. Subsequent salicidation is performed.
Inventors
- 👤 Chun-Ting Liu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 06:29
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/0223; H10D30/0225
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
108 words
A method of semiconductor integrated circuit fabrication comprising: forming first and second material layers overlying a substrate; forming a channel through said first and second layers; isotropically etching said second layer, thereby creating two cavities adjacent said channel; depositing a conductive material in said channel and said cavities; thereby forming a structure having a generally "T" shape; having two arms and a central portion; removing said second layer; anisotropically etching said first layer; thereby forming rectangular spacers comprised of said first material; and removing said two arms of said "T" shaped structure, at least some of said central portion of said structure remaining, thereby exposing said rectangular spacers.
Claim 2
Independent Claim
108 words
A method of semiconductor integrated circuit fabrication comprising: forming first and second material layers overlying a substrate; forming a channel through said first and second layers; isotropically etching said second layer, thereby creating two cavities adjacent said channel; depositing a conductive material in said channel and said cavities; thereby forming a structure having a generally "T" shape; having two arms and a central portion; removing said second layer; anisotropically etching said first layer; thereby forming rectangular spacers comprised of said first material; and removing said two arms of said "T" shaped structure, at least some of said central portion of said structure remaining, thereby exposing said rectangular spacers.
Claim 3
Dependent Claim
40 words
The method of claim 1 further including the steps of: blanket depositing a refractory metal upon said central portion of said structure and said substrate; reacting said refractory metal with said central portion of said structure to form a silicide.
Claim 4
Dependent Claim
19 words
The method of claim 2 in which a first dielectric is formed between said first material and said substrate.
Claim 5
Dependent Claim
38 words
The method of claim 3 in which a portion of said first dielectric is exposed by said channel forming step and further including the step of removing said exposed portion of said first dielectric, thereby exposing said substrate.
Claim 6
Dependent Claim
21 words
The method of claim 4 further including the step of growing a gate oxide upon said exposed portion of said substrate.
Claim 7
Dependent Claim
33 words
The method of claim 5 further including the step of exposing said substrate to a dopant species after removal of said two arms of said "T" structure thereby forming source and drain regions.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-17 | 2001-05-19 | 2001-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-17 | 2005-05-19 | 2005-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-17 | 2009-05-19 | 2009-11-18 | $7700.00 | Window Closed / Lapsed |