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US5672890A Expired / Lapsed US ⏱️ 0.0 years remaining

Field effect transistor with lightly doped drain regions

Assignee: Sumitomo Electric Industries Ltd
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Filing: 1995-09-12
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Granted: 1997-09-30
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Expires: 2015-09-12
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Abstract

Abstract It is an object of the present invention to provide a structure of a field effect transistor, which effectively suppresses a leakage current from a source/drain region to a substrate side without increasing a parasitic capacitance, and a method of manufacturing the same. According to the present invention, when an LDD structure is to be constituted by forming, in a semiconductor substrate, an active layer of a first conductivity type, a heavily doped layer of the first conductivity type, which is separated from the active layer by a predetermined distance and has a high impurity concentration; and an intermediate concentration layer of the first conductivity type, which is formed between the active layer and the heavily doped layer and has an impurity concentration lower than that of the heavily doped layer, regions of a second conductivity (these regions are converted into depletion layers upon contact with the corresponding regions of the first conductivity), which cover the entire bottom portion of the corresponding region are formed.

Inventors

  • 👤 Shigeru Nakajima

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 09:03
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/17; H10D62/351; H10D62/357; H10D62/13; H10D62/149; H10D62/161; H10D62/213; H10D62/221

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 317 words
A field effect transistor having a Lightly Doped Drain structure, comprising: a semiconductor substrate; a gate electrode formed on a top surface of said semiconductor substrate; an active layer of a first conductivity type, which is formed in said substrate while being in Schottky contact with said gate electrode; a buried layer of a second conductivity type, which is located under said active layer while being in direct contact with said active layer; source and drain regions extending from said top surface of said substrate toward a rear surface of said substrate in an opposite side of said top surface and separated from each other by said active layer, said active layer forming a channel for current flow between said source region and said drain region; and ohmic electrodes respectively formed on said source and drain regions; each of said source and drain regions having: a first region having a high impurity concentration and including a first upper region of the first conductivity type, said first upper region extending from said top surface of said substrate toward said rear surface of said substrate, and a first lower region of the second conductivity type, said first lower region being located under said first upper region while being in direct contact with and covering an entire bottom surface of said first upper region, and a second region having a portion between said active layer and said first region and having an impurity concentration lower than that of said first region, said portion including a second upper region of the first conductivity type, said second upper region extending from said top surface of said substrate toward said rear surface of said substrate, and a second lower region of the second conductivity type, said second lower region being located under said second upper region while being in direct contact with and covering an entire bottom surface of said second upper region.
Claim 2
Dependent Claim 317 words
A field effect transistor having a Lightly Doped Drain structure, comprising: a semiconductor substrate; a gate electrode formed on a top surface of said semiconductor substrate; an active layer of a first conductivity type, which is formed in said substrate while being in Schottky contact with said gate electrode; a buried layer of a second conductivity type, which is located under said active layer while being in direct contact with said active layer; source and drain regions extending from said top surface of said substrate toward a rear surface of said substrate in an opposite side of said top surface and separated from each other by said active layer, said active layer forming a channel for current flow between said source region and said drain region; and ohmic electrodes respectively formed on said source and drain regions; each of said source and drain regions having: a first region having a high impurity concentration and including a first upper region of the first conductivity type, said first upper region extending from said top surface of said substrate toward said rear surface of said substrate, and a first lower region of the second conductivity type, said first lower region being located under said first upper region while being in direct contact with and covering an entire bottom surface of said first upper region, and a second region having a portion between said active layer and said first region and having an impurity concentration lower than that of said first region, said portion including a second upper region of the first conductivity type, said second upper region extending from said top surface of said substrate toward said rear surface of said substrate, and a second lower region of the second conductivity type, said second lower region being located under said second upper region while being in direct contact with and covering an entire bottom surface of said second upper region.
Claim 3
Dependent Claim 112 words
A transistor according to claim 1, wherein said second region comprises a plurality of intermediate concentration regions each having a portion between said active layer and said first region, and wherein said portion of each intermediate concentration region includes an second upper intermediate concentration region of the first conductivity type, said upper intermediate concentration region extending from said top surface of said substrate toward said rear surface of said substrate, and a lower intermediate concentration region of the second conductivity type, said lower intermediate concentration region being located under said upper intermediate concentration region while being in direct contact with and covering an entire bottom surface of said upper intermediate concentration region.
Claim 4
Dependent Claim 39 words
A transistor according to claim 2, wherein depths from said top surface of said semiconductor substrate to bottom portions of said plurality of intermediate concentration regions decrease in a stepwise manner from said first region toward said active layer.
Claim 5
Dependent Claim 30 words
A transistor according to claim 2, wherein, in said second regions has a dopant concentration profile that decreases in a stepwise manner from said first region toward said active layer.
Claim 6
Dependent Claim 55 words
A transistor according to claim 1, wherein a dopant concentration and a thickness of said second lower region of said second region is optimized so that a sufficient potential barrier is formed at an interface between said second lower region and said second upper region without increasing a parasitic capacitance of said field effect transistor.
Claim 7
Dependent Claim 80 words
A transistor according to claim 2, wherein a dopant concentration and a thickness of said lower intermediate concentration lower region of said each intermediate concentration region are set so that a sufficient potential barrier is formed at an interface between said lower intermediate concentration region and said corresponding upper intermediate concentration region without increasing a parasitic capacitance of said field effect transistor, said corresponding upper intermediate concentration region being located on and in contact with said lower intermediate concentration region.

References Cited (Backward Citations)

JPS61222177A Cited
JPS6279673A Cited
US5124770A Cited
JPS63124471A Cited
JPS63281470A Cited
JPS6412579A Cited
JPH01208867A Cited
US4962054A Cited
US5182218A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-09-29 2001-03-31 2001-09-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-09-29 2005-03-31 2005-09-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-09-29 2009-03-31 2009-09-30 $7700.00 Window Closed / Lapsed

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