Patent EP0204676A2 successfully refreshed from Google Patents.
Patent US5672212A successfully refreshed from Google Patents.
US5672212A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Rotational megasonic cleaner/etcher for wafers
Assignee: Texas Instruments Inc
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Filing: 1996-11-25
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Granted: 1997-09-30
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Expires: 2016-11-25
Abstract
Abstract A method and apparatus for a wafer processing apparatus using a rotation mechanism. Wafers 13 are placed into a carrier 1 which has a central axis. The carrier 1 and wafers 13 are placed into a megasonic tank 15 with a megasonic transducer 23. A rotational driving system 25 is used to rotate the wafer carrier 1 and the wafers 13 about the central axis while the wafers are in the tank 1. Other embodiments are provided.
Inventors
- 👤 James T. Manos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 23:15
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0404; B; B08; B08B; B08B3/00; B08B3/04; B08B3/10; B08B3/12; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
232 words
An method for processing semiconductor wafers, comprising the steps of: providing a tank having sides attached to a bottom; providing a wafer carrier loaded with semiconductor wafers for processing, said wafer carrier having supports for holding a plurality of wafers to be processed, said supports securely holding said semiconductor wafers at the edges of said wafers; providing support means within said tank for holding said wafer carrier inside said tank so that said wafer carrier can rotate freely about an axis; providing rotation means coupled to said wafer carrier for causing said wafer carrier to rotate about its axis within said tank while said wafers are securely held within said wafer carrier; rotating said wafer carrier and said wafers within said tank while processing said wafers, thereby exposing all areas of said wafers equally during said processing; providing a megasonic transducer within said tank; directing megasonic energy at said wafer carrier and said wafers while said wafers are rotating: providing a solution for performing a desired operation on said wafers disposed in said tank; immersing said wafers in said solution while said wafers are being rotated, and simultaneously exposing said wafers to megasonic energy from said megasonic transducer, wherein said step of providing a solution comprises the steps of: providing spray and fill nozzles disposed within said tank; and filling said tank with a cleaning solution using said spray and fill nozzles.
Claim 2
Independent Claim
232 words
An method for processing semiconductor wafers, comprising the steps of: providing a tank having sides attached to a bottom; providing a wafer carrier loaded with semiconductor wafers for processing, said wafer carrier having supports for holding a plurality of wafers to be processed, said supports securely holding said semiconductor wafers at the edges of said wafers; providing support means within said tank for holding said wafer carrier inside said tank so that said wafer carrier can rotate freely about an axis; providing rotation means coupled to said wafer carrier for causing said wafer carrier to rotate about its axis within said tank while said wafers are securely held within said wafer carrier; rotating said wafer carrier and said wafers within said tank while processing said wafers, thereby exposing all areas of said wafers equally during said processing; providing a megasonic transducer within said tank; directing megasonic energy at said wafer carrier and said wafers while said wafers are rotating: providing a solution for performing a desired operation on said wafers disposed in said tank; immersing said wafers in said solution while said wafers are being rotated, and simultaneously exposing said wafers to megasonic energy from said megasonic transducer, wherein said step of providing a solution comprises the steps of: providing spray and fill nozzles disposed within said tank; and filling said tank with a cleaning solution using said spray and fill nozzles.
Claim 3
Independent Claim
232 words
An method for processing semiconductor wafers, comprising the steps of: providing a tank having sides attached to a bottom; providing a wafer carrier loaded with semiconductor wafers for processing, said wafer carrier having supports for holding a plurality of wafers to be processed, said supports securely holding said semiconductor wafers at the edges of said wafers; providing support means within said tank for holding said wafer carrier inside said tank so that said wafer carrier can rotate freely about an axis; providing rotation means coupled to said wafer carrier for causing said wafer carrier to rotate about its axis within said tank while said wafers are securely held within said wafer carrier; rotating said wafer carrier and said wafers within said tank while processing said wafers, thereby exposing all areas of said wafers equally during said processing; providing a megasonic transducer with said tank; directing megasonic energy at said wafer carrier and said wafers while said wafers are rotating: providing a solution for performing a desired operation on said wafers disposed in said tank; immersing said wafers in said solution while said wafers are being rotated, and simultaneously exposing said wafers to megasonic energy from said megasonic transducer, wherein said step of providing a solution comprises the steps of: providing spray and fill nozzles disposed within said tank; and filling said tank with an etching solution using said spray and fill nozzles.
Claim 4
Independent Claim
232 words
An method for processing semiconductor wafers, comprising the steps of: providing a tank having sides attached to a bottom; providing a wafer carrier loaded with semiconductor wafers for processing, said wafer carrier having supports for holding a plurality of wafers to be processed, said supports securely holding said semiconductor wafers at the edges of said wafers; providing support means within said tank for holding said wafer carrier inside said tank so that said wafer carrier can rotate freely about an axis; providing rotation means coupled to said wafer carrier for causing said wafer carrier to rotate about its axis within said tank while said wafers are securely held within said wafer carrier; rotating said wafer carrier and said wafers within said tank while processing said wafers, thereby exposing all areas of said wafers equally during said processing; providing a megasonic transducer with said tank; directing megasonic energy at said wafer carrier and said wafers while said wafers are rotating: providing a solution for performing a desired operation on said wafers disposed in said tank; immersing said wafers in said solution while said wafers are being rotated, and simultaneously exposing said wafers to megasonic energy from said megasonic transducer, wherein said step of providing a solution comprises the steps of: providing spray and fill nozzles disposed within said tank; and filling said tank with an etching solution using said spray and fill nozzles.
Claim 5
Dependent Claim
30 words
The method of claim 1, wherein said bottom of said tank is operable to travel upwards and downwards for providing a sealed condition and an open condition for said tank.
Claim 6
Dependent Claim
33 words
The method of claim 3, wherein said bottom is moved downwards away from said tank after said wafers are exposed to said megasonic energy for a predetermined time, thereby draining away said solution.
Claim 7
Dependent Claim
35 words
The method of claim 3, and further comprising the step of: applying a rinsing agent on said rotating wafer carrier and said wafers from said nozzles after said bottom is moved away from said tank.
Claim 8
Dependent Claim
70 words
The method of claim 3, and further comprising the steps of: moving said bottom upwards to seal said tank after the solution is drained away; rotating the wafers; spraying a rinsing agent from said nozzles onto said wafers until said tank is filled and said rotating wafers are immersed in the rinsing agent; and activating the megasonic transducer uniformly expose the rotating wafers to megasonic energy for a predetermined time.
Claim 9
Dependent Claim
81 words
The method of claim 3, and further comprising the steps of: providing a top placed over said tank; and rotating said wafer carrier and said wafers while said bottom is moved away from said tank to perform a spin drying operation on said wafers, any liquids remaining on said wafers being transferred by the force of the rotation to said sides of the tank and to said top, the liquids then draining away from said wafers and out of the tank.
Claim 10
Dependent Claim
95 words
The method of claim 1, wherein said step of immersing said wafers in said solution while said wafers are being rotated, and simultaneously exposing said wafers to megasonic energy from said megasonic transducer comprises: immersing said wafers in said solution; rotating said wafer carrier and said wafers into a first desired position; exposing said wafer carrier and said wafers to megasonic energy from said megasonic transducer for a predetermined time; and rotating said wafer carrier and said wafers into a next desired position to expose a different area of said wafers to the megasonic energy.
Claim 11
Independent Claim
60 words
A method of processing at least one semiconductor wafer, comprising the steps of: applying a solution to the at least one semiconductor wafer by spraying the at least one semiconductor wafer with the solution; and rotating the at least one semiconductor wafer, wherein said step of applying a solution includes immersing the at least one semiconductor wafer in said solution.
Claim 12
Independent Claim
60 words
A method of processing at least one semiconductor wafer, comprising the steps of: applying a solution to the at least one semiconductor wafer by spraying the at least one semiconductor wafer with the solution; and rotating the at least one semiconductor wafer, wherein said step of applying a solution includes immersing the at least one semiconductor wafer in said solution.
Claim 13
Independent Claim
66 words
A method of processing at least one semiconductor wafer, comprising the steps of: applying a solution to the at least one semiconductor wafer by spraying the at least one semiconductor wafer with the solution; and rotating the at least one semiconductor wafer, wherein said step of applying a solution includes spraying the at least one semiconductor wafer with said solution until said solution fills said tank.
Claim 14
Independent Claim
66 words
A method of processing at least one semiconductor wafer, comprising the steps of: applying a solution to the at least one semiconductor wafer by spraying the at least one semiconductor wafer with the solution; and rotating the at least one semiconductor wafer, wherein said step of applying a solution includes spraying the at least one semiconductor wafer with said solution until said solution fills said tank.
Claim 15
Independent Claim
89 words
A method of processing at least one semiconductor wafer, comprising the steps of: exposing the at least one semiconductor wafer to megasonic energy; and rotating the at least one semiconductor wafer in a stepwise fashion to a new stationary position, then exposing a section of the semiconductor wafer to the megasonic energy, and then rotating the at least one semiconductor wafer to a new position, this process being repeated until all sections of the at least one semiconductor wafer have been exposed to megasonic energy for a predetermined time.
Claim 16
Independent Claim
89 words
A method of processing at least one semiconductor wafer, comprising the steps of: exposing the at least one semiconductor wafer to megasonic energy; and rotating the at least one semiconductor wafer in a stepwise fashion to a new stationary position, then exposing a section of the semiconductor wafer to the megasonic energy, and then rotating the at least one semiconductor wafer to a new position, this process being repeated until all sections of the at least one semiconductor wafer have been exposed to megasonic energy for a predetermined time.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-29 | 2001-03-31 | 2001-09-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-29 | 2005-03-31 | 2005-09-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-29 | 2009-03-31 | 2009-09-30 | $7700.00 | Window Closed / Lapsed |