US5670262A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
Assignee: Michigan Molecular Institute
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Filing: 1995-05-09
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Granted: 1997-09-23
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Expires: 2015-05-09
Abstract
Abstract A film of polyimidebenzoxazole (PIBO) having an electrically conductive layer adhered to at least one face thereto, wherein the PIBO film has a tensile strength greater than 200 MPa. A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a PIBO film. A printed wiring board (PWB) having at least one polyimidebenzoxazole (PIBO) dielectric layer wherein the PWB has at least one thin dielectric base material layer, at least one thin conductor, at least one narrow conductor width and at least one small diameter via.
Inventors
- 👤 David A. Dalman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:51
CPC Classifications
C; C08; C08G; C08G73/00; C08G73/06; C08G73/18; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; C08G73/22; C08L; C08L79/00; C08L79/04; C08L79/08; C09; C09J; C09J179/00; C09J179/04; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; H05K1/0313; H05K1/032; H05K1/0346; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/26; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
45 words
A polyimidebenzoxazole (PIBO) film having an electrically conductive layer adhered to at least one face thereto wherein the PIBO film has a tensile strength greater than about 200 MPa at 25° C. and an elastic modulus greater than about 0.5 GPa at about 25° C.
Claim 2
Dependent Claim
45 words
A polyimidebenzoxazole (PIBO) film having an electrically conductive layer adhered to at least one face thereto wherein the PIBO film has a tensile strength greater than about 200 MPa at 25° C. and an elastic modulus greater than about 0.5 GPa at about 25° C.
Claim 3
Dependent Claim
18 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the PIBO film is less than about 150 microns thick.
Claim 4
Dependent Claim
18 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the PIBO film is less than about 50 microns thick.
Claim 5
Dependent Claim
19 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the electrically conductive layer is less than about 50 microns thick.
Claim 6
Dependent Claim
19 words
The polyimidebenzoxazole (PIBO) film of claim 4 wherein the electrically conductive layer is less than about 17 microns thick.
Claim 7
Dependent Claim
24 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the electrically conductive layer is selected from the group consisting of copper, aluminum or alloys thereof.
Claim 8
Dependent Claim
50 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the polyimidebenzoxazole (PIBO) film is selected from the group consisting of: a) the reaction product of pyromellitic dianhydride and 5-amino-2-(p-aminophenyl) benzoxazole; b) the reaction product of pyromellitic dianhydride and 2,6-(4,4'-diaminodiphenyl) benzo 1,2-d:5,4-d'!bisoxazole; and c) the reaction product of pyromellitic dianhydride and 2,2'-p-phenylene-bis(5-aminobenzoxazole).
Claim 9
Dependent Claim
25 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the polyimidebenzoxazole (PIBO) film at about 25° C. has a tensile strength greater than about 250 MPa.
Claim 10
Dependent Claim
24 words
The polyimidebenzoxazole (PIBO) film of claim 8 wherein the polyimidebenzoxazole (PIBO) has a tensile strength greater than about 300 MPa at about 25° C.
Claim 11
Dependent Claim
29 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the polyimidebenzoxazole (PIBO) film has a permanent lateral deformation of less than about 0.02 percent as determined by IPC 650 2.2.4A.
Claim 12
Dependent Claim
39 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the polyimidebenzoxazole (PIBO) film has a coefficient of thermal expansion (CTE) in the XY direction between about 1 and 7 ppm per ° C. from about -55° to about 125° C.
Claim 13
Dependent Claim
36 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the polyimidebenzoxazole (PIBO) polymer film has a CTE of less than about 100 ppm per ° C. in the Z direction from about -55° to about 125° C.
Claim 14
Dependent Claim
25 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the polyimidebenzoxazole (PIBO) film has an elastic modulus greater than about 5 GPa at about 25° C.
Claim 15
Dependent Claim
19 words
The polyimldebenzoxazole (PIBO) film of claim 1 wherein the electrically conductive layer is bonded directly to the PIBO film.
Claim 16
Dependent Claim
23 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the electrically conductive layer is adhered to the PIBO film by means of an adhesive.
Claim 17
Dependent Claim
20 words
The polyimidebenzoxazole (PIBO) film of claim 1 wherein the film is in the form of a panel or processed panel.
Claim 18
Dependent Claim
51 words
A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a polyimidebenzoxazole (PIBO) film having a tensile strength of at least 200 MPa at 25° C. and said printed wiring board passes thermal cycling test IPC 650 2.6.6B.
Claim 19
Dependent Claim
51 words
A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a polyimidebenzoxazole (PIBO) film having a tensile strength of at least 200 MPa at 25° C. and said printed wiring board passes thermal cycling test IPC 650 2.6.6B.
Claim 20
Dependent Claim
18 words
The printed wiring board of claim 17 wherein the printed wiring board is a single-sided printed wiring board.
Claim 21
Dependent Claim
18 words
The printed wiring board of claim 17 wherein the printed wiring board is a double-sided printed wiring board.
Claim 22
Dependent Claim
18 words
The printed wiring board of claim 17 wherein the printed wiring board is a multilayer printed wiring board.
Claim 23
Dependent Claim
57 words
The printed wiring board of claim 20 wherein the multilayer printed wiring board has at least one dielectric adhesive layer, wherein the dielectric adhesive layer is an adhesive selected from the group consisting of: a) epoxy; b) polyimide; c) cyanate ester; d) polyamic acid and e) PIBO film having an adhesive joined to at least one face.
Claim 24
Dependent Claim
19 words
The printed wiring board of claim 20 has a circuit density of greater than 160 leads per square inch.
Claim 25
Dependent Claim
21 words
The printed wiring board of claim 22 which is a multichip module (MCM) that has at least two surface mounted ICs.
Claim 26
Dependent Claim
25 words
The printed wiring board of claim 17 wherein the dielectric layer is PIBO, said dielectric layer has a thickness of less than about 150 microns.
Claim 27
Dependent Claim
25 words
The printed wiring board of claim 24 wherein the dielectric layer is PIBO, said dielectric layer has a thickness of less than about 50 microns.
Claim 28
Dependent Claim
20 words
The printed wiring board of claim 17 wherein at least one circuitry layer is less than about 50 microns thick.
Claim 29
Dependent Claim
20 words
The printed wiring board of claim 17 wherein at least one circuitry layer is less than about 17 microns thick.
Claim 30
Dependent Claim
25 words
The printed wiring board of claim 17 wherein at least one circuitry layer is selected from the group consisting of copper, aluminum or alloys thereof.
Claim 31
Dependent Claim
31 words
The printed wiring board in claim 17 wherein said dielectric layer has a dielectric constant between about 2 and 3.3 over a frequency range of about 1 KHz to 1 GHz.
Claim 32
Dependent Claim
28 words
The printed wiring board of claim 17 wherein at least one circuitry layer has at least one conductor having a line width of less than about 100 microns.
Claim 33
Dependent Claim
28 words
The printed wiring board of claim 17 wherein at least one circuitry layer has at least two conductors having a conductor spacing of less than about 100 microns.
Claim 34
Dependent Claim
31 words
The printed wiring board of claim 17 wherein at least two of the conductive circuitry layers have at least one interconnecting via having a diameter of less than about 200 microns.
Claim 35
Dependent Claim
29 words
The printed wiring board of claim 17 wherein at least one circuitry layer has at least one annular hole ring having a width between 0 and about 200 microns.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-22 | 2001-03-24 | 2001-09-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-22 | 2005-03-24 | 2005-09-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-22 | 2009-03-24 | 2009-09-23 | $7700.00 | Window Closed / Lapsed |