Semiconductor device having a single-crystal metal wiring
Abstract
Abstract The method of producing a semiconductor device includes the steps of forming a groove having a predetermined pattern shape on the surface of a substrate; forming a metal film on the substrate while reaction with the surface of the substrate is suppressed; and agglomerating the metal film by in-situ annealing, wherein agglomeration of the metal film is started before the metal film reacts with the surface of the substrate due to annealing, while formation of a native oxide on the metal film is suppressed, and whereby the metal film is filled into the groove by annealing at a predetermined temperature for a predetermined period of time. The structure of the semiconductor device includes an insulator in which there is formed a groove portion having a predetermined pattern shape and an electrode interconnection made of a single-crystal metal which is filled in the groove portion.
Inventors
- 👤 Junichi Wada
- 👤 Hisashi Kaneko
- 👤 Kyoichi Suguro
- 👤 Nobuo Hayasaka
- 👤 Haruo Okano
Bibliographic Details
Claims Analysis
Total Claims: 6References Cited (Backward Citations)
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