Stabilization of a patterned planarizing layer for solid state imagers prior to color filter pattern formation

Claim 1

A method for fabrication of permanent three-color color filter arrays on each of a plurality of image sensors on a semiconductor body, comprising the steps of: forming on one surface of a semiconductor body a plurality of image sensors with first topographic features, bond pads with second topographic features associated with each one of said plurality of image sensors, and streets with third topographic features separating each one of said plurality of image sensors and associated bond pads; applying a patternable planarizing layer to partially planarize said first and second and third topographic features; patterning the planarizing layer by patternwise activating exposure and pattern development so that the planarizing layer is removed from said bond pads but remains on said image sensors and said streets; stabilizing the patterned planarizing layer to render it inert to the conditions encountered in subsequent color filter array fabrication steps; deposing a color filter pattern of a first color on the partially planarized first topographic features of each one of said image sensors; and repeating said color filter pattern deposing step once with a second color and once more with a third color to obtain a permanent three-color color filter array on each one of said image sensors.

Claim 2

A method for fabrication of permanent three-color color filter arrays on each of a plurality of image sensors on a semiconductor body, comprising the steps of: forming on one surface of a semiconductor body a plurality of image sensors with first topographic features, bond pads with second topographic features associated with each one of said plurality of image sensors, and streets with third topographic features separating each one of said plurality of image sensors and associated bond pads; applying a patternable planarizing layer to partially planarize said first and second and third topographic features; patterning the planarizing layer by patternwise activating exposure and pattern development so that the planarizing layer is removed from said bond pads but remains on said image sensors and said streets; stabilizing the patterned planarizing layer to render it inert to the conditions encountered in subsequent color filter array fabrication steps; deposing a color filter pattern of a first color on the partially planarized first topographic features of each one of said image sensors; and repeating said color filter pattern deposing step once with a second color and once more with a third color to obtain a permanent three-color color filter array on each one of said image sensors.