US5143855A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making contact openings in color image sensor passivation layer
Assignee: Eastman Kodak Co
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Filing: 1991-06-17
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Granted: 1992-09-01
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Expires: 2011-06-17
Abstract
Abstract This invention relates to a method for fabricating a color solid-state image sensor which comprises, the steps of: forming an inorganic passivation layer over an array of photosensing elements and their associate bonding patterns; providing a color filter array over the passivation layer; forming a photoresist layer over the color filter array and other exposed areas; forming a pattern in the photoresist such that portions over the bonding pad areas are opened; and removing selective regions of the passivation layer to expose the bonding pads.
Inventors
- 👤 Laurel J. Pace
- 👤 William C. McColgin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 18:38
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/30; H10F77/306; H10F77/331
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
104 words
A method of making contact openings for a bonding pad pattern in an inorganic passivation layer on which color filters have been fabricated, comprising the steps of: (a) forming an inorganic passivation layer over an array of photosensing elements and their associated bonding pad patterns; (b) providing a color filter array over the passivation layer; (c) forming a photoresist layer that covers the color filter array and other exposed layers; (d) forming a pattern in the photoresist such that portions over the bonding pad areas are opened; and (e) removing by wet etching selective regions of the passivation layer to expose the bonding pads.
Claim 2
Independent Claim
104 words
A method of making contact openings for a bonding pad pattern in an inorganic passivation layer on which color filters have been fabricated, comprising the steps of: (a) forming an inorganic passivation layer over an array of photosensing elements and their associated bonding pad patterns; (b) providing a color filter array over the passivation layer; (c) forming a photoresist layer that covers the color filter array and other exposed layers; (d) forming a pattern in the photoresist such that portions over the bonding pad areas are opened; and (e) removing by wet etching selective regions of the passivation layer to expose the bonding pads.
Claim 3
Dependent Claim
19 words
A method according to claim 1 characterized in that it further comprises the steps of removing the overlying photoresist.
Claim 4
Dependent Claim
15 words
A method according to claim 1 characterized in that the photoresist is a positive-working photoresist.
Claim 5
Dependent Claim
15 words
A method according to claim 1 characterized in that the photoresist is a negative-working photoresist.
Claim 6
Dependent Claim
22 words
A method according to claim 2 characterized in that the photoresist removal is realized by using a mixture of n-butanol and xylene.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-01 | 1996-03-02 | 1996-09-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-01 | 2000-03-02 | 2000-09-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-01 | 2004-03-02 | 2004-09-01 | $7700.00 | Window Closed / Lapsed |