Patent US5653907A successfully refreshed from Google Patents.
US5653907A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lightweight thermally responsive mold for resin transfer molding
Assignee: Ford Global Technologies LLC
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Filing: 1996-02-15
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Granted: 1997-08-05
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Expires: 2016-02-15
Abstract
Abstract A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.
Inventors
- 👤 Kenneth Neil Kendall
- 👤 Alan Robert Harrison
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 23:12
CPC Classifications
B; B29; B29C; B29C70/00; B29C70/04; B29C70/28; B29C70/40; B29C70/42; B29C70/46; B29C70/48; B29C33/00; B29C33/30; B29C33/307; B29C33/56; B29C33/565
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
100 words
A mold for use with a resin transfer molding process, the mold having improved thermal response characteristics, the mold comprising: first and second support frames including a plurality of upstanding intersecting support ribs; first and second substrates supported by said first and second support frames, respectively, said substrates including heating tubes passing therethrough, wherein each said substrate comprises a material with high thermal coefficient; and first and second hard shells supported by said first and second substrates, respectively, said first and second shells cooperating to form a mold cavity therebetween, each said hard shell being less than 10 mm thick.
Claim 2
Dependent Claim
100 words
A mold for use with a resin transfer molding process, the mold having improved thermal response characteristics, the mold comprising: first and second support frames including a plurality of upstanding intersecting support ribs; first and second substrates supported by said first and second support frames, respectively, said substrates including heating tubes passing therethrough, wherein each said substrate comprises a material with high thermal coefficient; and first and second hard shells supported by said first and second substrates, respectively, said first and second shells cooperating to form a mold cavity therebetween, each said hard shell being less than 10 mm thick.
Claim 3
Dependent Claim
12 words
The mold of claim 1, wherein each said hard shell comprises nickel.
Claim 4
Dependent Claim
14 words
The mold of claim 1, wherein each said substrate comprises a copper-filled epoxy material.
Claim 5
Dependent Claim
15 words
The mold of claim 1, wherein each said substrate is less than 25 mm thick.
Claim 6
Dependent Claim
16 words
The mold of claim 1, wherein said first and second support frames comprise an aluminum material.
Claim 7
Dependent Claim
24 words
The mold of claim 1, wherein said first and second support frames each comprise a peripheral flange which is secured to the respective shell.
Claim 8
Dependent Claim
94 words
A mold for use with a resin transfer molding process, comprising: first and second substantially hollow support frames including a plurality of upstanding intersecting support ribs, each of said support ribs having a height substantially greater than its width; first and second substrates supported by said first and second support frames, respectively, said substrates including heating tubes passing therethrough; and first and second nickel shells supported by said first and second substrates, respectively, said first and second shells cooperating to form a mold cavity therebetween, each said shell being less than 10 mm thick.
Claim 9
Dependent Claim
94 words
A mold for use with a resin transfer molding process, comprising: first and second substantially hollow support frames including a plurality of upstanding intersecting support ribs, each of said support ribs having a height substantially greater than its width; first and second substrates supported by said first and second support frames, respectively, said substrates including heating tubes passing therethrough; and first and second nickel shells supported by said first and second substrates, respectively, said first and second shells cooperating to form a mold cavity therebetween, each said shell being less than 10 mm thick.
Claim 10
Dependent Claim
27 words
The mold of claim 7, wherein each said substrate comprises a copper-filled epoxy material less than 25 mm thick, and each said frame comprises an aluminum material.
Claim 11
Dependent Claim
132 words
A mold for use with a resin transfer molding process, comprising: first and second support frames including a plurality of upstanding intersecting aluminum support ribs, each of said support ribs having a length substantially greater than its width, said support frames each having a peripheral flange; first and second copper-filled epoxy substrates supported by said first and second support frames, respectively, said substrates each being less than 25 mm thick, and each said substrate including a plurality of heating tubes passing therethrough; and first and second nickel shells supported by said first and second substrates, respectively, said first and second shells cooperating to form a mold cavity therebetween, each said shell being less than 10 mm thick, and each said shell being secured to the peripheral flange on the respective support frame.
Claim 12
Dependent Claim
132 words
A mold for use with a resin transfer molding process, comprising: first and second support frames including a plurality of upstanding intersecting aluminum support ribs, each of said support ribs having a length substantially greater than its width, said support frames each having a peripheral flange; first and second copper-filled epoxy substrates supported by said first and second support frames, respectively, said substrates each being less than 25 mm thick, and each said substrate including a plurality of heating tubes passing therethrough; and first and second nickel shells supported by said first and second substrates, respectively, said first and second shells cooperating to form a mold cavity therebetween, each said shell being less than 10 mm thick, and each said shell being secured to the peripheral flange on the respective support frame.
References Cited (Backward Citations)
US2313253A
Cited
US2591858A
Cited
US2776453A
Cited
US2994297A
Cited
US3723584A
Cited
US3734449A
Cited
US3792986A
Cited
US4018552A
Cited
US4338068A
Cited
US4872827A
Cited
US5041247A
Cited
US5156754A
Cited
US5169549A
Cited
US5204042A
Cited
US5176839A
Cited
US5437547A
Cited
US5266259A
Cited
US5376317A
Cited
US5388803A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-04 | 2001-02-03 | 2001-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-04 | 2005-02-03 | 2005-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-04 | 2009-02-03 | 2009-08-05 | $7700.00 | Window Closed / Lapsed |