Structuring of printed circuit boards

Abstract

Abstract In the method according to the invention for the production of multilayer foil printed circuit board from preliminary products (A), with current paths (B) structured in electrical conductive layers (1,3) and with electrically conductive metal platings (C,D) from conductive layer (1) to conductive layer (3) through an insulating layer (2), or for producing semifinished products for such foil circuit boards, in first method steps a structuring means (7,7',13) is applied in controlled, local manner to the preliminary product (A) and resist layers (8,9) are coated with the preliminary product (A), the structuring means (7,7',13) being applied either to the resist layers (8,9) and the resist layer (8,9) is locally removed, or the resist layers (8,9) are applied to the structuring means (7,7',13) and in a further method step the applied structuring means (7,7',13) are removed, so that openings (10,10') are formed in the resist layers (8,9) and extend down to the insulating layer (2) and in a further method step through or blind holes (11,11') are locally etched in the insulating layer (2) at the position of the openings (10,10') and for producing electrically conductive metal platings (C,D) electrically conductive deposition substances (12) are deposited in the through or blind holes (11,11').

Inventors

• 👤 Walter Schmidt
• 👤 Marco Martinelli

Bibliographic Details