Patent US5650663A successfully refreshed from Google Patents.
US5650663A
Expired / Lapsed
US
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Electronic package with improved thermal properties
Assignee: Advanced Technology Interconnect Inc
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Filing: 1995-07-03
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Granted: 1997-07-22
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Expires: 2015-07-03
Abstract
Abstract An electronic package having improved thermal performance. In the case of a plastic package, the inner ends of the leads of the lead frame are attached to a heat slug by a high thermal conductivity material such as solder or a polymeric material. In the case of a metal package, the inner ends of the leads of the leadframe are attached to the metal base component by a high thermal conductivity material.
Inventors
- 👤 Arvind Parthasarathi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:58
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W40/258; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
76 words
An electronic package comprising: a. a heat spreading substrate, b. an electronic device attached to said heat spreading substrate, c. a lead frame having a plurality of leads having their inner ends wire bonded to said electronic device and their outer ends extending from said package, and d. a high thermal conductivity material selected from the group consisting of solders and conductive polymers connecting said inner ends of each said lead to the heat spreading substrate.
Claim 2
Dependent Claim
76 words
An electronic package comprising: a. a heat spreading substrate, b. an electronic device attached to said heat spreading substrate, c. a lead frame having a plurality of leads having their inner ends wire bonded to said electronic device and their outer ends extending from said package, and d. a high thermal conductivity material selected from the group consisting of solders and conductive polymers connecting said inner ends of each said lead to the heat spreading substrate.
Claim 3
Dependent Claim
27 words
The electronic package of claim 1 wherein said heat spreading substrate, said electronic device and said inner ends of said leads are encased in a plastic body.
Claim 4
Dependent Claim
14 words
The electronic package of claim 1 wherein said high thermal conductivity material is solder.
Claim 5
Dependent Claim
29 words
The electronic package of claim 3 wherein said solder attaching said inner ends of said leads to said substrate has a melting point of about 230° C. or above.
Claim 6
Dependent Claim
32 words
The electronic package of claim 3 wherein said solder attaching said inner ends of said leads to said substrate has a melting point of from about 250° C. to about 300° C.
Claim 7
Dependent Claim
19 words
The electronic package of claim 1 wherein said high thermal conductivity material is a high thermal conductivity polymeric material.
Claim 8
Dependent Claim
27 words
The electronic package of claim 1 wherein said electronic device, the inner ends of said leads and said heat spreading substrate are encased in a plastic body.
Claim 9
Dependent Claim
42 words
The electronic package of claim 1 wherein said electronic device, the inner ends of said leads and the side walls and top surface of said heat spreading substrate are encased in a plastic body, with the bottom surface of said substrate exposed.
Claim 10
Dependent Claim
32 words
The electronic package of claim 1 wherein said heat spreading substrate is fabricated from aluminum, copper, or alloys thereof, and said lead frame is fabricated from copper, copper alloys or iron-nickel alloys.
Claim 11
Dependent Claim
17 words
The electronic package of claim 9 wherein said heat spreading substrate has an electrically insulating coating thereon.
Claim 12
Dependent Claim
86 words
An electronic package comprising: a. a metal cover component, b. a metal base component, said base component and said cover component defining a cavity, c. an electronic component attached to said base component and positioned in said cavity, d. a lead frame disposed between and adapted to be bonded to said cover and base components and having inner lead ends, and e. a high thermal conductivity material selected from the group consisting of solders and conductive polymers connecting said inner lead ends to said base component.
Claim 13
Dependent Claim
86 words
An electronic package comprising: a. a metal cover component, b. a metal base component, said base component and said cover component defining a cavity, c. an electronic component attached to said base component and positioned in said cavity, d. a lead frame disposed between and adapted to be bonded to said cover and base components and having inner lead ends, and e. a high thermal conductivity material selected from the group consisting of solders and conductive polymers connecting said inner lead ends to said base component.
Claim 14
Dependent Claim
14 words
The electronic package of claim 11 wherein said high thermal conductivity material is solder.
Claim 15
Dependent Claim
28 words
The electronic package of claim 12 wherein said solder attaching said inner lead ends to said base component has a melting point of about 230° C. or above.
Claim 16
Dependent Claim
33 words
The electronic package of claim 12 wherein said solder attaching said inner ends of said leads to said base component has a melting point of from about 250° C. to about 300° C.
Claim 17
Dependent Claim
19 words
The electronic package of claim 11 wherein said high thermal conductivity material is a high thermal conductivity polymeric material.
Claim 18
Dependent Claim
34 words
The electronic package of claim 11 wherein said cover component and said base component are fabricated from aluminum or aluminum alloys and said lead frame is fabricated from copper, copper alloys or iron-nickel alloys.
Claim 19
Dependent Claim
26 words
The electronic package of claim 16 wherein at least a portion of the surface of the base component and cover component has an anodization layer thereon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-21 | 2001-01-20 | 2001-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-21 | 2005-01-20 | 2005-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-21 | 2009-01-20 | 2009-07-22 | $7700.00 | Window Closed / Lapsed |