Patent US5645932A successfully refreshed from Google Patents.
US5645932A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit-like metallic foil sheet and the like and process for producing them
Assignee: Miyake Inc
•
Filing: 1994-12-30
•
Granted: 1997-07-08
•
Expires: 2014-12-30
Abstract
Abstract A circuit-like metallic foil sheet for resonant tags and the like, and a process for fabricating the same. The circuit-like metallic foil sheet is fabricated by a process comprising: fabricating a laminate by adhering, to a carrier sheet such as a paper or a plastic film, a metallic foil whose surface is coated with hot-melt adhesive resin film, using an adhesive whose adhesion force decreases by heating; stamping out the metallic foil of the laminate to provide thereto a predtermined circuit-like pattern using a stamping die; superposing the metallic foil side of the laminate on a support such as a plastic film: and trasnferring the circuit-like metallic foil to the surface of the support by heating the circuit-like pattern from the support side or the carrier sheet side. A circuit board comprising a resonant circuit or a printed wiring circuit can be obtained with high precision without employing an etching process in which chemicals are used.
Inventors
- 👤 Shinya Uchibori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:27
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/046; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/0672; H01; H01F; H01F41/00; H01F41/02; H01F41/04; H01F41/041; H05K3/041; B; B32; B32B; B32B2519/00; B32B2519/02; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K1/16; H05K1/165; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/05; H05K2203/0502; H05K2203/0528; H05K2203/11; H05K2203/1105; H05K3/38; H05K3/386; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/108; Y10T428/00; Y10T428/28; Y10T428/2813; Y10T428/2817
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
117 words
A process for fabricating a circuit-like metallic foil sheet for resonant tag and the like, said process using a laminate comprising a carrier sheet such as a paper or a plastic film having adhered thereto a metallic foil as the base material, and said process comprising: patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil; disposing the surface of a support opposed to the side of said laminate having thereon the metallic foil; and transferring the circuit-like metallic foil to the surface of the support by heating only said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.
Claim 2
Dependent Claim
117 words
A process for fabricating a circuit-like metallic foil sheet for resonant tag and the like, said process using a laminate comprising a carrier sheet such as a paper or a plastic film having adhered thereto a metallic foil as the base material, and said process comprising: patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil; disposing the surface of a support opposed to the side of said laminate having thereon the metallic foil; and transferring the circuit-like metallic foil to the surface of the support by heating only said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.
Claim 3
Dependent Claim
118 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein, said process uses, as the base material, a laminate comprising a carrier sheet adhered thereto a metallic foil and a coating of a thermal adhesive resin formed further thereon, and said process comprising: patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil; disposing the surface of a support opposed to the side of said laminate having thereon the metallic foil; and transferring the circuit-like metallic foil to the surface of the support by heating said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.
Claim 4
Dependent Claim
122 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein, said process uses a laminate comprising a carrier sheet adhered thereto a metallic foil as the base material, and said process comprising: patterning the metallic foil of said laminate using a stamping die to provide a predetermined circuit-like pattern on the metallic foil; disposing opposed to the side of said laminate having thereon the metallic foil, the surface of a support which itself is thermal adhesive or which has thereon a coating of a thermal adhesive; and transferring the circuit-like metallic foil to the surface of the support by heating said circuit-like patterned portion from the carrier sheet side of said laminate or from the support side.
Claim 5
Dependent Claim
111 words
A process for fabricating a circuit-like metallic foil sheet, said processing comprising: providing a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet adhered thereto the metallic foil, by means of patterning using a stamping die; superposing on said patterned first laminate, a second laminate comprising a carrier sheet adhered thereto a metallic sheet being patterned by means of patterning using a stamping die; and heating only said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive films being interposed therebetween.
Claim 6
Dependent Claim
111 words
A process for fabricating a circuit-like metallic foil sheet, said processing comprising: providing a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet adhered thereto the metallic foil, by means of patterning using a stamping die; superposing on said patterned first laminate, a second laminate comprising a carrier sheet adhered thereto a metallic sheet being patterned by means of patterning using a stamping die; and heating only said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive films being interposed therebetween.
Claim 7
Dependent Claim
29 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the metallic foils are adhered to the carrier sheets using an easily removable adhesive.
Claim 8
Dependent Claim
52 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 5, wherein the adhesive used for adhering the metallic foils to the carrier sheets is characterized in that it comprises a blend of an adhesion adhesive and a curing agent, and that the adhesion force thereof decreases by heating.
Claim 9
Dependent Claim
36 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the metallic foil is a 3 to 150 μm thick foil of a metal such as aluminum, copper, or stainless steel.
Claim 10
Dependent Claim
37 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the metallic foil is a 10 to 60 μm thick foil of a metal such as aluminum, copper foil, or stainless steel.
Claim 11
Dependent Claim
20 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, wherein the support is a dielectric.
Claim 12
Dependent Claim
17 words
A sheet comprising a circuit-like metallic foil obtained according to a process as claimed in claim 1.
Claim 13
Dependent Claim
46 words
A process for fabricating a circuit-like metallic foil sheet as claimed in claim 1, including the step of forming a resonant circuit on both sides of said support by transferring to each side of the support a circuit-like metallic foil to thereby produce a resonant tag.
Claim 14
Dependent Claim
127 words
A process for fabricating a circuit-like metallic foil sheet useful as a resonant tag comprising: providing, by means of patterning using a stamping die, a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet having adhered thereto the metallic foil and having further thereon a hot-melt adhesive dielectric resin film; superposing on said patterned first laminate, a second laminate comprising a carrier sheet adhered thereto a metallic sheet having being patterned by means of patterning using a stamping die; and heating only said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive dielectric resin films interposed therebetween.
Claim 15
Dependent Claim
127 words
A process for fabricating a circuit-like metallic foil sheet useful as a resonant tag comprising: providing, by means of patterning using a stamping die, a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet having adhered thereto the metallic foil and having further thereon a hot-melt adhesive dielectric resin film; superposing on said patterned first laminate, a second laminate comprising a carrier sheet adhered thereto a metallic sheet having being patterned by means of patterning using a stamping die; and heating only said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive dielectric resin films interposed therebetween.
Claim 16
Dependent Claim
39 words
The process of claim 12 for fabricating a circuit-like metallic foil sheet useful as a resonant tag including the step of forming a second laminate comprising a thermal adhesive dielectric resin film on the surface of the metal foil.
Claim 17
Dependent Claim
124 words
A process for fabricating a circuit-like metallic foil sheet having utility as a resonant tag, said processing comprising: providing a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet having adhered thereto the metallic foil, by means of patterning using a stamping die; superposing on said patterned first laminate, a second laminate comprising a carrier sheet having adhered thereto a metallic sheet being patterned by means of patterning using a stamping die; and heating only said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive films being interposed therebetween to form a resonant tag.
Claim 18
Dependent Claim
124 words
A process for fabricating a circuit-like metallic foil sheet having utility as a resonant tag, said processing comprising: providing a predetermined circuit-like pattern on a metallic foil of a first laminate comprising a carrier sheet having adhered thereto the metallic foil, by means of patterning using a stamping die; superposing on said patterned first laminate, a second laminate comprising a carrier sheet having adhered thereto a metallic sheet being patterned by means of patterning using a stamping die; and heating only said circuit-like patterned portions from the carrier sheet side of either or both of the first and the second laminates, thereby forming circuit-like metallic foils on both sides of said support with hot-melt adhesive films being interposed therebetween to form a resonant tag.
Claim 19
Dependent Claim
12 words
The product resulting from the process of any one of claims 11-14.
References Cited (Backward Citations)
US2969300A
Cited
US3497410A
Cited
US4495232A
Cited
EP0142380A2
Cited
US4797785A
Cited
US4846922A
Cited
US4717438A
Cited
US4818312A
Cited
EP0285559A1
Cited
GB2211702A
Cited
EP0316847A2
Cited
EP0340670A2
Cited
US5006856A
Cited
US5174847A
Cited
US5184111A
Cited
US5059950A
Cited
WO1992021113A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-07 | 2001-01-06 | 2001-07-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-07 | 2005-01-06 | 2005-07-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-07 | 2009-01-06 | 2009-07-08 | $7700.00 | Window Closed / Lapsed |