US4797785A
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US
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Circuit arrangement and resonant label, and a process for its production
Assignee: Actron Entwicklungs AG
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Filing: 1987-07-29
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Granted: 1989-01-10
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Expires: 2007-07-29
Abstract
Abstract To produce an electrically conducting circuit pattern (2), in particular a resonant label, on a substrate (1), the insulating layer to be provided between two surface sections (2, 2a) of the circuit pattern is applied in a liquid or pasty, i.e. deformable, state so that its thickness and arrangement can be more readily influenced. A typical circuit arrangement which can be produced by a process of this type is distinguished by the fact that either the insulating layer (6) is as thin as possible or it is present only over the conducting parts (2, 2a), whereas areas lying in between are free from such an insulating layer (6).
Inventors
- 👤 Paul R. Jorgensen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:48
CPC Classifications
H; H05; H05K; H05K3/00; G; G08; G08B; G08B13/00; G08B13/22; G08B13/24; G08B13/2402; G08B13/2428; G08B13/2437; H05K1/00; H05K1/16; H05K1/165; H10; H10D; H10D86/00; H10D86/80; H10D86/85; H05K1/162; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09672; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0571; H05K3/02; H05K3/06; H05K3/061; H05K3/40; H05K3/4038; H05K3/4084; H05K3/46; H05K3/4611; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
111 words
A circuit arrangement comprising: a substrate; a first circuit pattern formed on the substrate which comprises a first circuit section and a second circuit section; and a second circuit pattern superposed on the first circuit pattern, which comprises a third circuit section and a fourth circuit section; said second and fourth circuit sections having corresponding size and shape and being separated and adhered by an adhesive insulating material; and wherein said first and third circuit sections have an adhesive insulating layer therebetween, and crimped portions of at least one of said first and third circuit sections extend through said insulating layer for directly conductively interconnecting said first and third circuit sections.
Claim 2
Dependent Claim
111 words
A circuit arrangement comprising: a substrate; a first circuit pattern formed on the substrate which comprises a first circuit section and a second circuit section; and a second circuit pattern superposed on the first circuit pattern, which comprises a third circuit section and a fourth circuit section; said second and fourth circuit sections having corresponding size and shape and being separated and adhered by an adhesive insulating material; and wherein said first and third circuit sections have an adhesive insulating layer therebetween, and crimped portions of at least one of said first and third circuit sections extend through said insulating layer for directly conductively interconnecting said first and third circuit sections.
Claim 3
Dependent Claim
23 words
An arrangement as in claim 1, wherein the thickness of the adhesive insulating material is not substantially greater than that of the substrate.
Claim 4
Dependent Claim
45 words
An arrangement as in claim 1, wherein the material of the adhesive insulating material has a non-adhesive state in which it is non-adhesively applicable to said first pattern, and an adhesive state in which it binds said second circuit pattern to said first circuit pattern.
Claim 5
Dependent Claim
14 words
An arrangement as in claim 3, wherein the insulating material comprises a heat-activatable adhesive.
Claim 6
Dependent Claim
14 words
An arrangement as in claim 3, wherein the insulating layer comprises a hot-seal adhesive.
Claim 7
Dependent Claim
14 words
An arrangement as in claim 1, wherein the insulating material comprises an etchant-resistant adhesive.
Claim 8
Dependent Claim
29 words
An arrangement as in claim 1, wherein at least a portion of said substrate not having said first circuit pattern thereon is substantially free of said adhesive insulating material.
Claim 9
Dependent Claim
19 words
An arrangement as in claim 1, wherein said adhesive insulating material has a maximum thickness of substantially 20 microns.
Claim 10
Dependent Claim
17 words
An arrangement as in claim 8, wherein said maximum thickness is substantially no greater than 15 microns.
Claim 11
Dependent Claim
17 words
An arrangement as in claim 9, wherein said maximum thickness is substantially no greater than 7 microns.
Claim 12
Dependent Claim
20 words
An arrangement as in claim 10, wherein the thickness of said adhesive insulating material is substantially at least 3 microns.
Claim 13
Dependent Claim
48 words
An arrangement as in claim 1, wherein: said second and fourth circuit sections form a capacitor; said first circuit section forms an inductor conductively interconnected with said second circuit section; and said circuit arrangement forms an LC resonant circuit which includes said inductor in series with said capacitor.
Claim 14
Dependent Claim
110 words
A resonant label comprising: a substrate; a first circuit pattern formed on the substrate, which comprises a first circuit portion and a second circuit portion; and a second circuit pattern superposed on the first pattern, which comprises a third circuit portion and a fourth circuit portion; said second and fourth circuit portions having corresponding size and shape and being separated and adhered by an adhesive insulating layer; and wherein said first and third circuit portions have an adhesive insulating layer therebetween, and crimped portions of at least one of said first and third circuit portions extend through said insulating layer for directly conductively interconnecting said first and third circuit portions.
Claim 15
Dependent Claim
110 words
A resonant label comprising: a substrate; a first circuit pattern formed on the substrate, which comprises a first circuit portion and a second circuit portion; and a second circuit pattern superposed on the first pattern, which comprises a third circuit portion and a fourth circuit portion; said second and fourth circuit portions having corresponding size and shape and being separated and adhered by an adhesive insulating layer; and wherein said first and third circuit portions have an adhesive insulating layer therebetween, and crimped portions of at least one of said first and third circuit portions extend through said insulating layer for directly conductively interconnecting said first and third circuit portions.
Claim 16
Dependent Claim
22 words
A resonant label as in claim 13, wherein beads of said adhesive insulating layer project beyond said second and fourth circuit portions.
Claim 17
Dependent Claim
48 words
A resonant label as in claim 13, wherein said first circuit portion further defines a lower contact pad directly conductively interconnected with said inductor, said lower contact pad being conductively interconnected by said crimped portions with said third circuit portion, the latter defining a corresponding upper contact pad.
Claim 18
Dependent Claim
42 words
A resonant label as in claim 15, wherein said inductor of said first circuit portion defines a surface area on said substrate, said lower contact pad being within said surface area and occupying less than substantially 40 percent of said surface area.
Claim 19
Dependent Claim
22 words
A resonant label as in claim 16, wherein said lower contact pad occupies less than substantially 25 percent of said surface area.
Claim 20
Dependent Claim
19 words
A resonant label as in claim 16, wherein said capacitor is outside said surface area defined by said inductor.
Claim 21
Dependent Claim
52 words
A resonant label as in claim 13, wherein: said first circuit portion forms an inductor conductively interconnected with said second circuit portion; said second and fourth circuit portions form a capacitor; and said first and second circuit patterns form an LC resonant circuit which includes said inductor in series with said capacitor.
Claim 22
Dependent Claim
16 words
A resonant label as in claim 13, wherein said adhesive insulating layer comprises an etchant-resistant adhesive.
Claim 23
Dependent Claim
104 words
A process for manufacturing a circuit arrangement comprising the steps of: applying a first circuit pattern having first and second circuit portions on a substrate; applying an adhesive insulating layer to said first circuit pattern; superposing a second circuit pattern having third and fourth circuit portions on said adhesive insulating layer, said second and fourth circuit portions having corresponding size and shape and being adhered and separated by said adhesive insulating layer; and crimping portions of at least one of said first and third circuit portions so as to extend through said insulating layer and directly conductively interconnect said first and third circuit portions.
Claim 24
Dependent Claim
104 words
A process for manufacturing a circuit arrangement comprising the steps of: applying a first circuit pattern having first and second circuit portions on a substrate; applying an adhesive insulating layer to said first circuit pattern; superposing a second circuit pattern having third and fourth circuit portions on said adhesive insulating layer, said second and fourth circuit portions having corresponding size and shape and being adhered and separated by said adhesive insulating layer; and crimping portions of at least one of said first and third circuit portions so as to extend through said insulating layer and directly conductively interconnect said first and third circuit portions.
Claim 25
Dependent Claim
39 words
A process as in claim 21, wherein said adhesive insulating layer is initially applied to said first circuit pattern in a non-adhesive state, and is activated after application of said second circuit pattern to be in an adhesive state.
Claim 26
Dependent Claim
36 words
A process as in claim 21, wherein said second circuit pattern is initially applied to a second substrate, said second circuit pattern being on said second substrate when it is superposed on said adhesive insulating layer.
Claim 27
Dependent Claim
13 words
A process as in claim 23, wherein said second substrate is subsequently removed.
Claim 28
Dependent Claim
24 words
A process as in claim 23, wherein said second substrate is subsequently or simultaneously adhered to said first substrate by said adhesive insulating layer.
Claim 29
Dependent Claim
18 words
A process as in claim 25, wherein said top substrate is adhered to said bottom substrate by heat-sealing.
Claim 30
Dependent Claim
65 words
A process as in claim 21, wherein said first circuit pattern is formed by the steps of: applying an electrically conducting film to said substrate; employing an etchant-resistant material as said adhesive insulating layer; applying said adhesive insulating layer to said film in a pattern corresponding to said first circuit pattern; and etching portions of said film not having said adhesive insulating layer applied thereto.
Claim 31
Dependent Claim
27 words
A process as in claim 21, wherein said adhesive insulating layer is initially applied with a positive thickness tolerance and is then adjusted to a lesser thickness.
Claim 32
Dependent Claim
13 words
A process as in claim 28, wherein said thickness is adjusted by hot-punching.
Claim 33
Dependent Claim
36 words
A process as in claim 21, wherein said second and fourth circuit portions define a capacitance, said capacitance being adjusted by adjusting the thickness of said adhesive insulating layer between said second and fourth circuit portions.
Claim 34
Dependent Claim
48 words
A process as in claim 21, wherein: said second and fourth circuit portions form a capacitor; said first circuit portion forms an inductor conductively interconnected with said second circuit portion; and said circuit arrangement forms an LC resonant circuit which includes said inductor in series with said capacitor.
Claim 35
Dependent Claim
15 words
A process as in claim 21, wherein said adhesive insulating layer comprises an etchant-resistant adhesive.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-01-10 | 1992-07-11 | 1993-01-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-01-10 | 1996-07-11 | 1997-01-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-01-10 | 2000-07-11 | 2001-01-10 | $7700.00 | Window Closed / Lapsed |