US5643801A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Laser processing method and alignment
Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1995-08-04
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Granted: 1997-07-01
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Expires: 2015-08-04
Abstract
Abstract A laser processing process which includes laser annealing a silicon film 2 μm or less in thickness by irradiating a laser beam 400 nm or less in wavelength and being operated in pulsed mode with a pulse width of 50 nsec or more and preferably, 100 nsec or more. The invention further relates to a laser processing apparatus which includes a laser generation device and a stage for mounting thereon a sample provide separately from said device, to thereby prevent transfer of vibration attributed to the movement of the stage to the laser generation device and the optical system. A stable laser beam can be obtained to thereby improve productivity.
Inventors
- 👤 Hiroaki Ishihara
- 👤 Kazuhisa Nakashita
- 👤 Hideto Ohnuma
- 👤 Nobuhiro Tanaka
- 👤 Hiroki Adachi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 09:30
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/20; H10P14/38; H10P14/3802; H10P14/3808; H10P14/3816; B; B23; B23K; B23K26/00; B23K26/02; B23K26/04; H10D; H10D84/00; H10D84/01; H10D84/02; H10D84/03; H10D84/038; H10D86/00; H10D86/01; H10D86/021; H10D86/0221; H10D86/0223; H10D86/0229; H10D88/00; H10D88/01; H10P14/29; H10P14/2901; H10P14/2921; H10P14/2922; H10P14/32; H10P14/3202; H10P14/3238; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3411; H10P14/381; H10P34/00; H10P34/40; H10P34/42; Y; Y10; Y10S; Y10S117/00; Y10S117/903; Y10S117/904; Y10S148/00; Y10S148/09
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
125 words
A laser processing method comprising: mounting a sample on a stage capable of making translational movement in at least one direction and rotational movement; aligning at least two alignment markers provided on the sample through at least two monitoring cameras to bring the alignment markers of the sample in parallel with markers of said monitoring cameras by translating or rotating the stage; irradiating a laser beam to said sample, said laser beam including a laser irradiation plane; and rotating the stage after said aligning step and before said irradiating step to correct for rotational displacement between the monitoring cameras and the laser beam during the aligning step such that a pattern provided on said sample is parallel with the laser irradiation plane of said laser.
Claim 2
Dependent Claim
125 words
A laser processing method comprising: mounting a sample on a stage capable of making translational movement in at least one direction and rotational movement; aligning at least two alignment markers provided on the sample through at least two monitoring cameras to bring the alignment markers of the sample in parallel with markers of said monitoring cameras by translating or rotating the stage; irradiating a laser beam to said sample, said laser beam including a laser irradiation plane; and rotating the stage after said aligning step and before said irradiating step to correct for rotational displacement between the monitoring cameras and the laser beam during the aligning step such that a pattern provided on said sample is parallel with the laser irradiation plane of said laser.
Claim 3
Dependent Claim
15 words
The process of claim 1 wherein said translational movement is carried out by a servomotor.
Claim 4
Dependent Claim
16 words
The process of claim 1 wherein said rotational movement is carried out by a pulse motor.
Claim 5
Dependent Claim
26 words
The process of claim 1 wherein the irradiation of said laser beam is carried out for laser scribing, laser annealing or laser doping of said sample.
References Cited (Backward Citations)
US4328553A
Cited
US4083272A
Cited
US4160263A
Cited
JPS5567132A
Cited
US4249960A
Cited
US4370175A
Cited
US4803528A
Cited
US4439245A
Cited
US4937618A
Cited
US4835704A
Cited
US4764485A
Cited
US5221365A
Cited
US5313076A
Cited
US5219786A
Cited
US5424244A
Cited
US5372836A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-30 | 2000-12-30 | 2001-07-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-30 | 2004-12-30 | 2005-07-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-30 | 2008-12-30 | 2009-07-01 | $7700.00 | Window Closed / Lapsed |