US5641838A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermostable coating materials
Assignee: International Business Machines Corp
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Filing: 1995-06-07
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Granted: 1997-06-24
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Expires: 2015-06-07
Abstract
Abstract Novel intermediate compounds capable of being applied to a semiconductor precursor by spin-on methods which exhibit good planarity and gap-fill characteristics, the cured composites of which are capable of withstanding temperatures in excess of 500 DEG C. The disclosure further encompasses a process for fabricating semiconductor devices utilizing the intermediate compounds and its composite.
Inventors
- 👤 Harold George Linde
- 👤 Rosemary Ann Previti-Kelly
- 👤 Thomas Joseph Reen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:54
CPC Classifications
C; C09; C09D; C09D183/00; C09D183/14; C07; C07F; C07F7/00; C07F7/02; C07F7/08; C07F7/10; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1057; C08G73/106; C08G73/1075; C08G73/1082; C08G77/00; C08G77/48; C08G77/54; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31652; Y10T428/31663
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
86 words
A thermostable composite consisting essentially of a perylene diimide having the structure ##STR5## and a poly(silsesquioxane), said thermostable composite produced by the process of: (a) combining perylene dianhydride and a primary or secondary aminoalkyl-alkoxysilane in a solvent in a molar ratio of about 1:4; (b) mixing at a temperature between 15° C. and 80° C. for 4 to 20 hours; (c) heating under conditions such that a mechanically stable solid is formed; and (d) curing at 500° to 620° C. under nitrogen for about 30 minutes.
Claim 2
Dependent Claim
86 words
A thermostable composite consisting essentially of a perylene diimide having the structure ##STR5## and a poly(silsesquioxane), said thermostable composite produced by the process of: (a) combining perylene dianhydride and a primary or secondary aminoalkyl-alkoxysilane in a solvent in a molar ratio of about 1:4; (b) mixing at a temperature between 15° C. and 80° C. for 4 to 20 hours; (c) heating under conditions such that a mechanically stable solid is formed; and (d) curing at 500° to 620° C. under nitrogen for about 30 minutes.
Claim 3
Dependent Claim
79 words
A thermostable composite produced by the process of claim 1 comprising: a combining perylene dianhydride and a primary or secondary aminosilane in a solvent in a molar ratio of about 1:4; (b) mixing at a temperature between 15° and 80° C. for 4 to 20 hours; (c) setting by heating to final temperature of about 150° C. over the course of 10 to 30 minutes; and (d) curing at 500° to 620° C. under nitrogen for about 30 minutes.
Claim 4
Dependent Claim
30 words
The composite according to claim 1 further characterized in that said composite exhibits less than 1% weight loss upon exposure to temperatures from 500° to 600° C. for one hour.
Claim 5
Dependent Claim
44 words
The composite according to claim 1 further characterized in that said composite exhibits an RIE etch rate more than 4 time that of silicon nitride in 20/80 CF 4 /O 2 and less than 1/4 that of silicon nitride in pure O 2 .
Claim 6
Dependent Claim
73 words
The composite of claim 1 wherein said composite is a result of the reaction of: perylene dianhydride; and an aminosilane having a formula of: ##STR6## wherein R is selected from the group consisting of H, alkyl and alkylamine; X is selected from the group consisting of alkyl of at least 2 carbons and aryl; Z is alkyl or a direct bond; Y is selected from the group consisting of alkoxy, halo and silazane.
Claim 7
Dependent Claim
11 words
The composite of claim 5 wherein the aminosilane is an aminoalkyltrialkoxysilane.
Claim 8
Dependent Claim
10 words
The composite of claim 6 wherein the aminoalkyltrialkoxysilane is aminopropyltriethoxysilane.
Claim 9
Dependent Claim
18 words
A thermostable composite, consisting essentially of: (a) a perylene diimide having the structure ##STR7## and (b) a poly(silsesquioxane).
Claim 10
Dependent Claim
18 words
A thermostable composite, consisting essentially of: (a) a perylene diimide having the structure ##STR7## and (b) a poly(silsesquioxane).
Claim 11
Dependent Claim
24 words
A thermostable composite according to claim 8 wherein said composite comprises about four silicon atoms in the poly(silsesquioxane) for each molecule of perylene diimide.
Claim 12
Dependent Claim
25 words
A thermostable composite according to claim 8 wherein said composite comprises at least four silicon atoms in the poly(silsesquioxane) for each molecule of perylene diimide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-23 | 2000-12-23 | 2001-06-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-23 | 2004-12-23 | 2005-06-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-23 | 2008-12-23 | 2009-06-24 | $7700.00 | Window Closed / Lapsed |