Patent US5640052A successfully refreshed from Google Patents.
US5640052A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnection structure of electronic parts
Assignee: NEC Corp
•
Filing: 1996-05-03
•
Granted: 1997-06-17
•
Expires: 2016-05-03
Abstract
Abstract An interconnection structure is provided which is simple in structure and is easily manufactured and in which stress generated in solder bumps is minimized. Pads of a semiconductor chip and pads of a substrate are connected to each other by solder bumps. The solder bumps are hourglass-shaped. Metal core members are provided in the solder bumps, respectively. The core member is constituted with a circular bottom portion and a circular pin portion. The core member is soldered to the pad of the semiconductor chip by solder.
Inventors
- 👤 Kenji Tsukamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:41
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W72/20; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10318; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/072; H10W72/07231; H10W72/07236; H10W72/231; H10W72/234; H10W72/241; H10W72/251; H10W72/252; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
91 words
An interconnection structure for electronic parts, comprising: a plurality of hourglass-shaped solder bumps for electrically connecting a first electronic part to a second electronic part; and core members provided in said solder bumps, respectively, each of said core members comprising a pin portion having a tip portion, wherein said core members directly contact said first electronic part, said tip portion being spaced from said second electronic part, a solder bump being partially provided in said space between the tip portion and said second electronic part to provide an electrical connection therebetween.
Claim 2
Dependent Claim
91 words
An interconnection structure for electronic parts, comprising: a plurality of hourglass-shaped solder bumps for electrically connecting a first electronic part to a second electronic part; and core members provided in said solder bumps, respectively, each of said core members comprising a pin portion having a tip portion, wherein said core members directly contact said first electronic part, said tip portion being spaced from said second electronic part, a solder bump being partially provided in said space between the tip portion and said second electronic part to provide an electrical connection therebetween.
Claim 3
Dependent Claim
24 words
The interconnection structure claimed in claim 1, wherein said first electronic part comprises an LSI bare-chip and said second electronic part comprises a substrate.
Claim 4
Dependent Claim
17 words
The interconnection structure claimed in claim 2, wherein said core members are provided on said LSI bare-chip.
Claim 5
Dependent Claim
32 words
The interconnection structure claimed in claim 1, wherein said first electronic part comprises a substrate, said second electronic part comprises an LSI bare-chip, and said core members are provided on said substrate.
Claim 6
Dependent Claim
18 words
The interconnection structure claimed in claim 1, wherein said pin portions of said core members are pin-pointed, respectively.
Claim 7
Dependent Claim
20 words
The interconnection structure claimed in claim 1, wherein said pin portions of said core members have elliptic cross sections, respectively.
Claim 8
Dependent Claim
27 words
The interconnection structure claimed in claim 1, wherein said pin portions of said core members have center holes extending from top ends of said pin portions, respectively.
Claim 9
Dependent Claim
18 words
The interconnection structure claimed in claim 1, wherein each said core member has a plurality of pin portions.
Claim 10
Dependent Claim
112 words
A semiconductor device comprising: an LSI bare-chip; a plurality of pads disposed on a surface of said LSI bare-chip; and core members mounted on each of said pads, each of said core members comprising a pin portion having a tip portion, wherein an amount of solder is attached to each said core member, the amount of solder being selected such that said solder, when reflown, provides an hourglass-shaped configuration, and wherein the length of said pin portion is selected such that said tip portion is spaced from said second electronic part and when said solder is reflown, said tip portion is electrically connected to a second electronic part through said reflown solder.
Claim 11
Dependent Claim
112 words
A semiconductor device comprising: an LSI bare-chip; a plurality of pads disposed on a surface of said LSI bare-chip; and core members mounted on each of said pads, each of said core members comprising a pin portion having a tip portion, wherein an amount of solder is attached to each said core member, the amount of solder being selected such that said solder, when reflown, provides an hourglass-shaped configuration, and wherein the length of said pin portion is selected such that said tip portion is spaced from said second electronic part and when said solder is reflown, said tip portion is electrically connected to a second electronic part through said reflown solder.
References Cited (Backward Citations)
US3488840A
Cited
US3470611A
Cited
US3921285A
Cited
EP0084464A2
Cited
US4545610A
Cited
US4970570A
Cited
EP0270067A2
Cited
US4818728A
Cited
US4845542A
Cited
FR2622741A1
Cited
EP0480754A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-16 | 2000-12-16 | 2001-06-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-16 | 2004-12-16 | 2005-06-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-16 | 2008-12-16 | 2009-06-17 | $7700.00 | Window Closed / Lapsed |