Automatic test detection of unsoldered thru-hole connector leads

Claim 2

A circuit card for mounting thereon electronic components having leads, comprising: (a) a first side; (b) a second side being opposite of said first side; (c) a plurality of thru-holes extending through said card between said first and second sides thereof, said thru-holes being adapted to secure said leads of thru-hole components to said electronic card; (d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said first side to said second side; and (e) a plurality of test etches, each test etch being associated with a respective one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said respective thru-hole connection pad and initially electrically isolated therefrom and being adapted for forming an electrical connection from a component lead after said lead is soldered to said thru-hole connection pad to electrically connect it to said test etch.

Claim 3

The circuit card of claim 1, wherein said test etches are positioned parallel to a diameter of said thru-hole.

Claim 4

The circuit card of claim 2, further including a test pad accessible by an automatic testing device for use in testing the electrical connection.

Claim 5

The circuit card of claim 1, each of said thru-hole connection pads further comprising a first rectangular edge tangent to a diameter of said thru hole, and wherein said test etches further include a second rectangular edge positioned parallel to said first rectangular edge of said thru-hole connection pad.

Claim 6

The circuit card of claim 4, further including a test pad accessible by an automatic testing device for use in testing the electrical connection.

Claim 7

The circuit card of claim 1, further including a test pad accessible by an automatic testing device for use in testing the electrical connection.

Claim 8

A circuit card, comprising: a) a component side for mounting electrical components; b) a reverse side being opposite of said component side; c) a plurality of thru-holes extending through said card between said component and reverse sides thereof, said thru-holes used to secure said leads of thru-hole components to said circuit card; d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said component side to said reverse side; and e) a plurality of test etches, each test etch being associated with one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said thru-hole connection pad and used for forming an electrical connection from a component lead soldered to said thru-hole connection pad to said test etch, wherein each of said test etches is positioned concentric to a respective one of said thru-hole connection pads.

Claim 9

A circuit card, comprising: a) a component side for mounting electrical components; b) a reverse side being opposite of said component side; c) a plurality of thru-holes extending through said card between said component and reverse sides thereof, said thru-holes used to secure said leads of thru-hole components to said circuit card; d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said component side to said reverse side; and e) a plurality of test etches, each test etch being associated with one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said thru-hole connection pad and used for forming an electrical connection from a component lead soldered to said thru-hole connection pad to said test etch, wherein each of said test etches is positioned concentric to a respective one of said thru-hole connection pads.

Claim 10

The circuit card of claim 7, further including a test pad accessible by an automatic testing device for use in testing the electrical connection.

Claim 11

A circuit card, comprising: a) a component side for mounting electrical components; b) a reverse side being opposite of said component side; c) a plurality of thru-holes extending through said card between said component and reverse sides thereof, said thru-holes used to secure said leads of thru-hole components to said circuit card; d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said component side to said reverse side; and e) a plurality of test etches, each test etch being associated with one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said thru-hole connection pad and used for forming an electrical connection from a component lead soldered to said thru-hole connection pad to said test etch, wherein each of said test etches further comprises a circular ring positioned concentric about said thru-hole connection pads.

Claim 12

A circuit card, comprising: a) a component side for mounting electrical components; b) a reverse side being opposite of said component side; c) a plurality of thru-holes extending through said card between said component and reverse sides thereof, said thru-holes used to secure said leads of thru-hole components to said circuit card; d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said component side to said reverse side; and e) a plurality of test etches, each test etch being associated with one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said thru-hole connection pad and used for forming an electrical connection from a component lead soldered to said thru-hole connection pad to said test etch, wherein each of said test etches further comprises a circular ring positioned concentric about said thru-hole connection pads.

Claim 13

The circuit card of claim 9, further including a test pad accessible by an automatic testing device for use in testing the electrical connection.

Claim 16

The method of claim 6, said circuit card further including a test pad accessible by an automatic testing device for use in testing the electrical connection, further including the step of automatic testing for completion of the electrical connection.

Claim 17

An electronic circuit board having conductive traces thereon, for the installation of thru-hole components having leads, comprising: a) a plurality of conductive thru-holes positioned on said electronic circuit board, adapted for receiving therein component leads; b) a plurality of conductive thru-hole connection pads positioned in close proximity to, and electrically isolated from, said conductive thru-holes, and adapted to permit formation of a solder bridge between said thru-holes and said conductive thru-hole connection pads upon soldering said lead in said thru-hole; and c) a plurality of test pads electrically connected to said connection pads, electrically isolated from said thru-holes until said lead is soldered in said thru-hole.

Claim 18

An electronic circuit board having conductive traces thereon, for the installation of thru-hole components having leads, comprising: a) a plurality of conductive thru-holes positioned on said electronic circuit board, adapted for receiving therein component leads; b) a plurality of conductive thru-hole connection pads positioned in close proximity to, and electrically isolated from, said conductive thru-holes, and adapted to permit formation of a solder bridge between said thru-holes and said conductive thru-hole connection pads upon soldering said lead in said thru-hole; and c) a plurality of test pads electrically connected to said connection pads, electrically isolated from said thru-holes until said lead is soldered in said thru-hole.

Claim 19

The circuit board of claim 13, further including means for verifying the existence of said solder bridges.

Claim 20

An electronic circuit board including a plurality of conductive thru-holes, said conductive thru-holes being positioned on said electronic circuit board and adapted for receiving thru-hole component leads; a plurality of conductive thru-hole connection pads electrically connected to said conductive thru-holes, positioned in close proximity to, and electrically isolated from, said thru-holes and further being adapted to permit formation of a solder bridge between a respective thru-hole connection pad and test etch upon soldering said component lead in said thru-hole; and a plurality of test pads electrically connected to said test etches, electrically isolated from said thru-holes until said lead is soldered in said thru-hole for verifying the existence of said solder bridges, said electronic circuit board produced by the process which includes the steps of: a) inserting the leads of the thru-hole components into the circuit board thru-holes, each lead being placed into one thru-hole; b) soldering lead of the thru-hole component leads to its respective thru-hole thereby forming a solder joint forming a solder bridge between the thru-hole and the test etch wherein said connection pad is connected to a test pad for use by an automated testing device to test the solder joints; and c) verifying the solder joint of each thru-hole component lead by testing the electrical connection between two test pads interconnected by a solder bridge to the lead to be tested.

Claim 21

An electronic circuit board including a plurality of conductive thru-holes, said conductive thru-holes being positioned on said electronic circuit board and adapted for receiving thru-hole component leads; a plurality of conductive thru-hole connection pads electrically connected to said conductive thru-holes, positioned in close proximity to, and electrically isolated from, said thru-holes and further being adapted to permit formation of a solder bridge between a respective thru-hole connection pad and test etch upon soldering said component lead in said thru-hole; and a plurality of test pads electrically connected to said test etches, electrically isolated from said thru-holes until said lead is soldered in said thru-hole for verifying the existence of said solder bridges, said electronic circuit board produced by the process which includes the steps of: a) inserting the leads of the thru-hole components into the circuit board thru-holes, each lead being placed into one thru-hole; b) soldering lead of the thru-hole component leads to its respective thru-hole thereby forming a solder joint forming a solder bridge between the thru-hole and the test etch wherein said connection pad is connected to a test pad for use by an automated testing device to test the solder joints; and c) verifying the solder joint of each thru-hole component lead by testing the electrical connection between two test pads interconnected by a solder bridge to the lead to be tested.

Claim 22

A circuit card for mounting thereon electronic components having leads, including a first side; a second side being opposite of said first side; a plurality of thru-holes extending through said card between said first and second sides thereof, said thru-holes being adapted to receive said leads of thru-hole components; a plurality of thru-hole connection pads each being formed on said circuit card about the periphery of one of said thru-holes thereby providing an electrical connection from said first side to said second side; and a plurality of test etches, each test etch being associated with one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said thru-hole connection pad and initially electrically isolated therefrom and being adapted for forming an electrical connection from a component lead after said lead is soldered to said thru-hole connection pad to electrically connect it to said test etch, said test etch further having a test pad accessible by an automatic testing device for use in testing the electrical connection, wherein said circuit card is produced by the process which includes the steps of: a) inserting the component leads into the printed circuit board through thru-holes; b) soldering each component lead to its respective thru-hole thereby forming a solder joint bridge between the connection pad and test etch wherein said connection pad is thereby connected to a test pad for use by an automated testing device to test the solder joints; and c) verifying the solder joint of each lead of the thru-hole component by testing the electrical connection between two test pads interconnected by at least one solder bridge to the lead to be tested.

Claim 23

A circuit card for mounting thereon electronic components having leads, including a first side; a second side being opposite of said first side; a plurality of thru-holes extending through said card between said first and second sides thereof, said thru-holes being adapted to receive said leads of thru-hole components; a plurality of thru-hole connection pads each being formed on said circuit card about the periphery of one of said thru-holes thereby providing an electrical connection from said first side to said second side; and a plurality of test etches, each test etch being associated with one of said thru-holes, said test etches being positioned within a distance of less than about 0.030 inches of said thru-hole connection pad and initially electrically isolated therefrom and being adapted for forming an electrical connection from a component lead after said lead is soldered to said thru-hole connection pad to electrically connect it to said test etch, said test etch further having a test pad accessible by an automatic testing device for use in testing the electrical connection, wherein said circuit card is produced by the process which includes the steps of: a) inserting the component leads into the printed circuit board through thru-holes; b) soldering each component lead to its respective thru-hole thereby forming a solder joint bridge between the connection pad and test etch wherein said connection pad is thereby connected to a test pad for use by an automated testing device to test the solder joints; and c) verifying the solder joint of each lead of the thru-hole component by testing the electrical connection between two test pads interconnected by at least one solder bridge to the lead to be tested.

Claim 24

A circuit card for mounting thereon electronic components having leads, comprising: (a) a first side; (b) a second side being opposite of said first side; (c) a plurality of thru-holes extending through said card between said first and second sides thereof, said thru-holes being adapted to secure said component leads to said electronic card; (d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said first side to said second side; and (e) a plurality of test etches, each test etch being associated with a respective one of said thru-holes, said test etches being positioned within a molten solderable distance bridgeable by molten solder surface tension of said respective thru-hole connection pad and initially electrically isolated therefrom and being adapted for forming an electrical connection from a component lead after said lead is soldered to said thru-hole connection pad to electrically connect it to said test etch.

Claim 25

A circuit card for mounting thereon electronic components having leads, comprising: (a) a first side; (b) a second side being opposite of said first side; (c) a plurality of thru-holes extending through said card between said first and second sides thereof, said thru-holes being adapted to secure said component leads to said electronic card; (d) a plurality of thru-hole connection pads formed on said circuit card about the periphery of each of said thru-holes, said thru-hole connection pads providing an electrical connection from said first side to said second side; and (e) a plurality of test etches, each test etch being associated with a respective one of said thru-holes, said test etches being positioned within a molten solderable distance bridgeable by molten solder surface tension of said respective thru-hole connection pad and initially electrically isolated therefrom and being adapted for forming an electrical connection from a component lead after said lead is soldered to said thru-hole connection pad to electrically connect it to said test etch.