US5092033A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for packaging semiconductor device
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1991-01-23
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Granted: 1992-03-03
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Expires: 2011-01-23
Abstract
Abstract The present invention comprises the steps of electrically connecting at least one pair of bumps on the semiconductor device, bringing the bumps into contact with a surface of the packaging substrate and moving the semiconductor device relative to the packaging substrate while monitoring whether at least one pair of electrode terminals formed on the surface of the packaging substrate are electrically connected to each other, positioning the semiconductor device with respect to the packaging substrate at a position where the electrode terminals whose electrical connection is monitored are electrically connected to each other, and packaging the semiconductor electrode on the packaging substrate.
Inventors
- 👤 Masanori Nishiguchi
- 👤 Atsushi Miki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:27
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H10P72/04; H10P72/0446; H05K1/00; H05K1/02; H05K1/0266; H05K1/0268; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/16; H05K2203/166; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49144
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
146 words
A method of directly connecting a bump extending from a surface of a semiconductor device to an electrode terminal on a packaging substrate to package said semiconductor device on said packaging substrate, comprising the steps of: electrically connecting at least two bumps on said semiconductor device to each other; bringing said at least two bumps into contact with a surface of said packaging substrate and sliding said semiconductor device relative to said packaging substrate while at least two electrode terminals formed on said surface of said packaging substrate in correspondence with said bumps electrically connected to each other are monitored to determine whether the electrode terminals are electrically connected; positioning said semiconductor device with respect to said packaging substrate at a position where said electrode terminals whose electrical connection is monitored are electrically connected to each other; and packaging said semiconductor device on said packaging substrate.
Claim 2
Independent Claim
146 words
A method of directly connecting a bump extending from a surface of a semiconductor device to an electrode terminal on a packaging substrate to package said semiconductor device on said packaging substrate, comprising the steps of: electrically connecting at least two bumps on said semiconductor device to each other; bringing said at least two bumps into contact with a surface of said packaging substrate and sliding said semiconductor device relative to said packaging substrate while at least two electrode terminals formed on said surface of said packaging substrate in correspondence with said bumps electrically connected to each other are monitored to determine whether the electrode terminals are electrically connected; positioning said semiconductor device with respect to said packaging substrate at a position where said electrode terminals whose electrical connection is monitored are electrically connected to each other; and packaging said semiconductor device on said packaging substrate.
Claim 3
Independent Claim
127 words
A method of directly connecting a bump extending on a surface of a semiconductor device to an electrode terminal on a packaging substrate, thereby packaging said semiconductor device on said packaging substrate, comprising the steps of: clamping a conductive member between said semiconductor device and said packaging substrate to bring a bump on said semiconductor device into contact with an electrode terminal on said packaging substrate; measuring an electrical resistance between said bump and said electrode terminal which are to be directly connected to each other; positioning said semiconductor device with respect to said packaging substrate at a position where the electrical resistance is minimized; and packaging said semiconductor device on said packaging substrate after said conductive member is removed from said bump and said electrode terminal.
Claim 4
Independent Claim
127 words
A method of directly connecting a bump extending on a surface of a semiconductor device to an electrode terminal on a packaging substrate, thereby packaging said semiconductor device on said packaging substrate, comprising the steps of: clamping a conductive member between said semiconductor device and said packaging substrate to bring a bump on said semiconductor device into contact with an electrode terminal on said packaging substrate; measuring an electrical resistance between said bump and said electrode terminal which are to be directly connected to each other; positioning said semiconductor device with respect to said packaging substrate at a position where the electrical resistance is minimized; and packaging said semiconductor device on said packaging substrate after said conductive member is removed from said bump and said electrode terminal.
Claim 5
Dependent Claim
37 words
A method according to claim 2, wherein said conductive member comprises an anisotropic conductive film having a higher conductivity in a direction perpendicular to a film surface than that in a direction parallel to the film surface.
Claim 6
Independent Claim
134 words
A method of directly connecting a bump extending from a surface of a semiconductor device to an electrode terminal on a packaging substrate, thereby packaging said semiconductor device on said packaging substrate, comprising the steps of: clamping a resistance member between said semiconductor device and said packaging substrate to bring said resistance member into contact with a bump on said semiconductor device and a terminal electrode on said packaging substrate; measuring a resistance of a closed circuit formed between a bump and an electrode terminal which are to be directly connected to each other; positioning said semiconductor device with respect to said packaging substrate at a position where the resistance is minimized; and packaging said semiconductor device on said packaging substrate after said resistance member is removed from said bump and said electrode terminal.
Claim 7
Independent Claim
134 words
A method of directly connecting a bump extending from a surface of a semiconductor device to an electrode terminal on a packaging substrate, thereby packaging said semiconductor device on said packaging substrate, comprising the steps of: clamping a resistance member between said semiconductor device and said packaging substrate to bring said resistance member into contact with a bump on said semiconductor device and a terminal electrode on said packaging substrate; measuring a resistance of a closed circuit formed between a bump and an electrode terminal which are to be directly connected to each other; positioning said semiconductor device with respect to said packaging substrate at a position where the resistance is minimized; and packaging said semiconductor device on said packaging substrate after said resistance member is removed from said bump and said electrode terminal.
Claim 8
Dependent Claim
46 words
A method according to claim 4, wherein said resistance member is made of an anisotropic material having a higher permittivity in a direction perpendicular to a surface of said packaging substrate than that in a direction parallel thereto, and said closed circuit is an induction circuit.
Claim 9
Dependent Claim
40 words
A method according to claim 4, wherein said resistance member is made of an anisotropic magnetic material having a higher magnetic permeability in a direction perpendicular to a surface of said packaging substrate than that in a direction parallel thereto.
Claim 10
Independent Claim
127 words
A method of directly connecting a bump extending on a surface of a semiconductor device to an electrode terminal on a packaging substrate, thereby packaging said semiconductor device on said packaging substrate, comprising the step of: clamping a conductive member between said semiconductor device and said packaging substrate to bring a bump on said semiconductor device into contact with an electrode terminal on said packaging substrate; measuring an electrical resistance between said bump and said electrode terminal which are to be directly connected to each other; positioning said semiconductor device with respect to said packaging substrate at a position where the electrical resistance is minimized; and packaging said semiconductor device on said packaging substrate with said conductive member clamped between said semiconductor device and said packaging substrate.
Claim 11
Independent Claim
127 words
A method of directly connecting a bump extending on a surface of a semiconductor device to an electrode terminal on a packaging substrate, thereby packaging said semiconductor device on said packaging substrate, comprising the step of: clamping a conductive member between said semiconductor device and said packaging substrate to bring a bump on said semiconductor device into contact with an electrode terminal on said packaging substrate; measuring an electrical resistance between said bump and said electrode terminal which are to be directly connected to each other; positioning said semiconductor device with respect to said packaging substrate at a position where the electrical resistance is minimized; and packaging said semiconductor device on said packaging substrate with said conductive member clamped between said semiconductor device and said packaging substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-03 | 1995-09-02 | 1996-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-03 | 1999-09-02 | 2000-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-03 | 2003-09-02 | 2004-03-03 | $7700.00 | Window Closed / Lapsed |