US5635337A
Expired / Lapsed
US
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Method for producing a multi-step structure in a substrate
Assignee: International Business Machines Corp
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Filing: 1993-05-05
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Granted: 1997-06-03
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Expires: 2013-05-05
Abstract
Abstract A structure of openings is produced in two or more layers of silylated, polyimide photoresist. Openings in subsequent layers, which overlap previous openings, are of larger size. Then the structure is transferred to an organic substrate using oxygen plasma etching with up to 3% CF 4 . The smallest opening transferred to the substrate extends through the substrate.
Inventors
- 👤 Johann Bartha
- 👤 Johann Greschner
- 👤 Karl H. Probst
- 👤 Gerhard Schmid
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:01
CPC Classifications
G; G03; G03F; G03F7/00
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
131 words
Method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and in which at least one of the photoresist layers includes a silylated photoresist selected from the group consisting of: photoresists silylated after deposition and photoresists deposited as silylated photoresists.
Claim 2
Dependent Claim
131 words
Method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and in which at least one of the photoresist layers includes a silylated photoresist selected from the group consisting of: photoresists silylated after deposition and photoresists deposited as silylated photoresists.
Claim 3
Independent Claim
126 words
The method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and in which the structure is transferred by simultaneously etching both the substrate and the previous photoresist layer to form the multi-step opening structure.
Claim 4
Independent Claim
126 words
The method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and in which the structure is transferred by simultaneously etching both the substrate and the previous photoresist layer to form the multi-step opening structure.
Claim 5
Dependent Claim
110 words
Method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and filling the opening structure with a conductive substrate.
Claim 6
Dependent Claim
110 words
Method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and filling the opening structure with a conductive substrate.
Claim 7
Independent Claim
140 words
The method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and in which steps f), g), h) and i) are all performed in one continuous etching process in which part of steps f) and g) are done concurrently and part of steps h) and i) are done concurrently.
Claim 8
Independent Claim
140 words
The method for producing a substrate with a multi-step structure, comprising the steps: producing a substrate; depositing a first photoresist layer on top of the substrate; forming a first opening in the photoresist layer; depositing a further photoresist layer on top of the first photoresist layer; forming a further opening in the further photoresist layer which is larger and overlays all of the opening in the first photoresist layer to build a multi-step opening structure in multiple photoresist layers; then transferring the multi-step opening structure of the photoresist layers into the substrate to produce a similar multi-step opening structure in the substrate; and in which steps f), g), h) and i) are all performed in one continuous etching process in which part of steps f) and g) are done concurrently and part of steps h) and i) are done concurrently.
References Cited (Backward Citations)
US3518084A
Cited
US5266446A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-02 | 2000-12-02 | 2001-06-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-02 | 2004-12-02 | 2005-06-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-02 | 2008-12-02 | 2009-06-03 | $7700.00 | Window Closed / Lapsed |