Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto

Claim 2

An electronic package comprising: a substantially rigid, thermally conductive support member; a thin, flexible circuitized substrate including a dielectric member having a first layer of circuitry positioned on a first surface thereof and a second layer of circuitry positioned on a second surface thereof opposite said first surface, said thin, flexible circuitized substrate including a plurality of conductive through-holes located within said dielectric member and interconnecting said first and second layers of circuitry, said thin circuitized substrate being directly bonded to said support member in an electrically insulative manner, including along the portion of said dielectric member having said plurality of through-holes therein; a semiconductor device bonded to said support member in a thermally conductive manner at a location relative to said first and second layers of circuitry of said circuitized substrate, said semiconductor device including a surface having a plurality of electrical contact sites thereon for being electrically coupled to said first of said layers of said circuitry of said circuitized substrate, said contact sites and said first layer of circuitry of said thin circuitized substrate electrically coupled to said contact sites occupying a substantially coplanar relationship; and a plurality of solder elements positioned on selected portions of said first layer of said circuitry and electrically coupled to said contact sites of said semiconductor device.

Claim 3

The electronic package of claim 1 wherein said thermally conductive support member comprises a metallic sheet member.

Claim 4

The electronic package of claim 1 wherein said metallic sheet member is comprised of copper.

Claim 5

The electronic package of claim 1 wherein said thermally conductive support member includes at least one indentation therein, said semiconductor device being bonded to said support member at the location of said indentation.

Claim 6

The electronic package of claim 1 wherein selected ones of said electrical contact sites of said semiconductor device are electrically coupled to said first layer of said circuitry of said circuitized substrate by a plurality of conductive wires.

Claim 7

The electronic package of claim 1 wherein said first layer of said circuitry of said circuitized substrate electrically coupled to said contact sites of said semiconductor device includes a plurality of projecting lead members, selected ones of said projecting lead members being electrically coupled to respective ones of said electrical contact sites of said semiconductor device.

Claim 8

The electronic package of claim 1 wherein said thermally conductive support member serves as both a heat sinking member for heat generated by said semiconductor device during operation of said electronic package and as a stiffener member for retaining said thin circuitized substrate in a substantially planar orientation.

Claim 9

The electronic package of claim 1 wherein said second layer of said circuitry of said thin flexible circuitized substrate faces said thermally conductive support member.

Claim 10

The electronic package of claim 8 wherein said thin flexible circuitized substrate is bonded to said thermally conductive support member by an electrically insulative adhesive.

Claim 11

The electronic package of claim 1 wherein said thin flexible circuitized substrate is bonded to said thermally conductive support member by an electrically insulative adhesive.

Claim 12

The electronic package of claim 1 wherein said semiconductor device is bonded to said support member by a thermally conductive adhesive, whereby heat from said semiconductor device will readily pass to said thermally conductive support member.

Claim 13

The electronic package of claim 1 further including a quantity of encapsulant material substantially covering at least part of said semiconductor device and at least part of said circuitry of said thin flexible circuitized substrate.

Claim 14

The electronic package of claim 1 wherein selected ones of said plurality of solder elements positioned on said selected portions of said first layer of said circuitry are positioned on respective ones of said conductive through-holes within said dielectric member.

Claim 15

The electronic package of claim 1 further including a second circuitized substrate electrically coupled to said thin, flexible circuitized substrate, said electronic package further including a plurality of solder elements positioned on said selected portions of said first layer of said circuitry of said thin, flexible circuitized substrate to provide said electrical coupling between said circuitized substrates.

Claim 16

The electronic package of claim 1 wherein said thermally conductive support member includes a base and at least one spacer member, said spacer member spacing said thin flexible circuitized substrate a predetermined distance from said base portion.

Claim 17

An electronic package comprising: a substantially rigid, thermally conductive support member; a thin, flexible circuitized substrate including a dielectric member having a first surface including at least one layer of circuitry positioned on said first surface thereof, said thin, flexible circuitized substrate including a plurality of through-holes located within said dielectric member and extending through said dielectric member to respective parts of said layer of circuitry of said thin, flexible circuitized substrate, said thin, flexible circuitized substrate being directly bonded to said support member in an electrically insulative manner, including along the portion of said dielectric member having said plurality of through-holes therein, such that said at least one layer of said circuitry faces said substantially rigid, thermally conductive support member; said substantially rigid, thermally conductive support member adapted for having a semiconductor device bonded to a predetermined portion of said support member in a thermally conductive manner at a location immediately adjacent said thin, flexible circuitized substrate, such that electrical contact sites of said semiconductor device can be directly electrically coupled to said thin, flexible circuitized substrate directly bonded to said support member; and first and second pluralities of solder elements each positioned on said thin, flexible circuitized substrate at respective ones of said through-holes within said dielectric member so as to be electrically coupled to said at least one layer of said circuitry, said first plurality of said solder elements being positioned nearer said predetermined portion of said substantially rigid, thermally conductive support member than said second plurality of said solder elements.

Claim 18

An electronic package comprising: a substantially rigid, thermally conductive support member; a thin, flexible circuitized substrate including a dielectric member having a first surface including at least one layer of circuitry positioned on said first surface thereof, said thin, flexible circuitized substrate including a plurality of through-holes located within said dielectric member and extending through said dielectric member to respective parts of said layer of circuitry of said thin, flexible circuitized substrate, said thin, flexible circuitized substrate being directly bonded to said support member in an electrically insulative manner, including along the portion of said dielectric member having said plurality of through-holes therein, such that said at least one layer of said circuitry faces said substantially rigid, thermally conductive support member; said substantially rigid, thermally conductive support member adapted for having a semiconductor device bonded to a predetermined portion of said support member in a thermally conductive manner at a location immediately adjacent said thin, flexible circuitized substrate, such that electrical contact sites of said semiconductor device can be directly electrically coupled to said thin, flexible circuitized substrate directly bonded to said support member; and first and second pluralities of solder elements each positioned on said thin, flexible circuitized substrate at respective ones of said through-holes within said dielectric member so as to be electrically coupled to said at least one layer of said circuitry, said first plurality of said solder elements being positioned nearer said predetermined portion of said substantially rigid, thermally conductive support member than said second plurality of said solder elements.

Claim 19

The electronic package of claim 16 wherein said thermally conductive support member comprises a metallic sheet member.

Claim 20

The electronic package of claim 17 wherein said metallic sheet member is comprised of copper.

Claim 21

The electronic package of claim 16 wherein said predetermined portion of said thermally conductive support member comprises an indentation such that said semiconductor device is adapted for being positioned within said indentation.

Claim 22

The electronic package of claim 16 wherein selected ones of said electrical contact sites of said semiconductor device are adapted for being electrically coupled to said thin, flexible circuitized substrate by a plurality of conductive wires.

Claim 23

The electronic package of claim 16 wherein said thermally conductive support member is adapted for serving as both a heat sinking member for heat generated by said semiconductor device during operation of said electronic package and as a stiffener member for retaining said thin, flexible circuitized substrate in a substantially planar orientation.

Claim 24

The electronic package of claim 16 wherein said thin, flexible circuitized substrate is bonded to said thermally conductive support member by an electrically insulative adhesive.

Claim 25

The electronic package of claim 16 further including a quantity of encapsulant material adapted for substantially covering at least part of said semiconductor device and at least part of said circuitry of said thin, flexible circuitized substrate when said semiconductor device is bonded to said thermally conductive support member.

Claim 26

The electronic package of claim 16 further including a second circuitized substrate having a plurality of conductors each electrically coupled to a respective one of said solder elements of both said first and second pluralities of said solder elements positioned on said thin, flexible circuitized substrate.

Claim 27

The electronic package of claim 16 wherein said thermally conductive support member includes both a base portion and at least one spacer member positioned on said base portion, said thin, flexible circuitized substrate being bonded directly to said spacer member, said spacer member spacing said thin, flexible circuitized substrate a predetermined distance from said base portion of said support member.

Claim 28

The electronic package of claim 16 wherein said dielectric member is comprised of polyimide.