US5633072A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a multilayer printed wire board
Assignee: Akzo Nobel NV
•
Filing: 1995-06-07
•
Granted: 1997-05-27
•
Expires: 2015-06-07
Abstract
Abstract A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.
Inventors
- 👤 Erik Middelman
- 👤 Pieter H. Zuuring
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 12:43
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; B; B32; B32B; B32B37/00; B32B37/12; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/02; H05K2201/0275; H05K2201/0287; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0759; H05K3/38; H05K3/386; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49146; Y10T29/49155; Y10T29/49158; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/249921; Y10T428/249924; Y10T428/24994; Y10T428/24995; Y10T428/249951; Y10T428/249994
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
159 words
A multilayer printed wire board obtainable by a method comprising lamination bonding at least one hard base substrate comprising conductive traces on both sides and at least one intermediate substrate comprising a hard core layer comprising a flowable adhesive layer on at least a side thereof facing the conductive traces of the base substrate, the lamination being conducted under a pressure sufficiently high so as to bring the core layer of the intermediate substrate at least substantially into contact with the conductive traces of the base substrate with the adhesive filling the voids between the traces, and wherein the base substrate and the intermediate substrate comprising a fiber-reinforced matrix material, the reinforcement being in the form of a crosswise arrangement of layers of unidirectionally (UD) oriented fibers, and wherein the substrates are balanced and mid-plane symmetric crossply laminates exhibiting thermal coefficients of expansion in the X and Y directions about equal to those of the electrically conductive material employed.
Claim 2
Dependent Claim
159 words
A multilayer printed wire board obtainable by a method comprising lamination bonding at least one hard base substrate comprising conductive traces on both sides and at least one intermediate substrate comprising a hard core layer comprising a flowable adhesive layer on at least a side thereof facing the conductive traces of the base substrate, the lamination being conducted under a pressure sufficiently high so as to bring the core layer of the intermediate substrate at least substantially into contact with the conductive traces of the base substrate with the adhesive filling the voids between the traces, and wherein the base substrate and the intermediate substrate comprising a fiber-reinforced matrix material, the reinforcement being in the form of a crosswise arrangement of layers of unidirectionally (UD) oriented fibers, and wherein the substrates are balanced and mid-plane symmetric crossply laminates exhibiting thermal coefficients of expansion in the X and Y directions about equal to those of the electrically conductive material employed.
Claim 3
Dependent Claim
140 words
A multilayer printed wire board obtainable by a method comprising lamination bonding at least one hard base substrate comprising conductive traces on both sides and at least one intermediate substrate comprising a hard core layer comprising a flowable adhesive layer on at least a side thereof facing the conductive traces of the base substrate, the lamination being conducted under a pressure sufficiently high so as to bring the core layer of the intermediate substrate at least substantially into contact with the conductive traces of the base substrate with the adhesive filling the voids between the traces, and wherein the base substrate and the intermediate substrate comprising a fiber-reinforced matrix material, the reinforcement being in the form of a crosswise arrangement of layers of unidirectionally (UD) oriented fibers, wherein at least one intermediate substrate comprises at least one embedded electronic component.
Claim 4
Dependent Claim
140 words
A multilayer printed wire board obtainable by a method comprising lamination bonding at least one hard base substrate comprising conductive traces on both sides and at least one intermediate substrate comprising a hard core layer comprising a flowable adhesive layer on at least a side thereof facing the conductive traces of the base substrate, the lamination being conducted under a pressure sufficiently high so as to bring the core layer of the intermediate substrate at least substantially into contact with the conductive traces of the base substrate with the adhesive filling the voids between the traces, and wherein the base substrate and the intermediate substrate comprising a fiber-reinforced matrix material, the reinforcement being in the form of a crosswise arrangement of layers of unidirectionally (UD) oriented fibers, wherein at least one intermediate substrate comprises at least one embedded electronic component.
Claim 5
Dependent Claim
38 words
A board according to claim 1 wherein the intermediate substrate is provided with the flowable adhesive layer on one side of its hard core layer and has conductive traces on the other side of its hard core layer.
Claim 6
Dependent Claim
19 words
A board according to claim 1 wherein an intermediate substrate is provided on both sides of the base substrate.
Claim 7
Dependent Claim
81 words
A board according to claim 1 wherein after conductive traces have been formed on an intermediate substrate, there is provided on one or on both outer sides of a laminate formed by lamination bonding of the intermediate substrate and the base substrate, a further intermediate substrate which is provided with a flowable adhesive layer on one side of the hard core layer thereof and the other side of the core of the further intermediate substrate being equipped to form conductive traces.
Claim 8
Dependent Claim
53 words
A board according to claim 1 wherein after conductive traces have been formed on the outside of the intermediate substrate, that had been provided on the formed laminate, additional intermediate substrates and conductive traces are lamination bonded thereto until the final laminate, having the desired number of layers with conductive traces, is obtained.
Claim 9
Dependent Claim
25 words
A board according to claim 1 comprising an intermediate substrate which is provided with the flowable adhesive layer on both sides of hard core layer.
Claim 10
Dependent Claim
73 words
A board according to claim 7 wherein the intermediate substrate is sandwiched between two adjacent base substrates, and such pressure is exerted on the laminate during the laminating process as will bring said hard core layer of the intermediate substrate at least substantially into contact with the conductive traces of the two base substrates and fill any void between these traces, on either side of the intermediate substrate, with the flowable adhesive material.
Claim 11
Dependent Claim
40 words
A board according to claim 8 wherein each of a plurality of n intermediate substrates, with n being an integer higher than 1, is sandwiched between adjacent base substrates, the number of base substrates thus being n+1, followed by lamination.
Claim 12
Dependent Claim
51 words
A board according to claim 1 wherein the thickness of the hard core layer of each intermediate substrate is 0.025-0.6 mm, and the thickness of each flowable adhesive layer on one or both sides of the intermediate substrate) is of the same order of magnitude as that of the conductive traces.
Claim 13
Dependent Claim
19 words
A board according to claim 1 wherein the base substrates are provided with electrically conductive vias in the Z-direction.
Claim 14
Dependent Claim
26 words
A board according to claim 1 a glue based on an uncured or only partially cured thermosetting synthetic material is used as the flowable adhesive layer.
Claim 15
Dependent Claim
27 words
A board according to claim 1 which comprises an intermediate substrate with a flowable adhesive layer having a thickness in the range of 1 to 70 μm.
Claim 16
Dependent Claim
46 words
A board according to claim 1 wherein the matrix of the core layers of the substrates is selected from the following group of thermosetting synthetic materials: EP, UP, VE, PU, PI, BMI, BCI, triazine, BT-epoxy, cyanate ester, acrylate resin, phenol resin, and combinations of these resins.
Claim 17
Dependent Claim
23 words
A board according to claim 1 wherein the matrix of the core layers of the substrates is composed of a thermoplastic synthetic material.
Claim 18
Dependent Claim
24 words
A board according to claim 1 wherein the matrix of the core layers of the substrates comprises thermoplastic as well as thermosetting synthetic materials.
Claim 19
Dependent Claim
43 words
A board according to claim 1 wherein the reinforcing fiber in the fiber-reinforced matrix is selected from the following group of materials: A-glass, AR-glass, C-glass, D-glass, E-glass, R-glass, S1-glass, S2-glass, quartz, silica, PPDT, PBT, PBI, PBO, PEN, PETP, aluminum oxide, and silicon carbide.
Claim 20
Dependent Claim
42 words
A board according to claim 1 wherein the adhesive layer is comprised of a thermosetting synthetic material selected from the group consisting of EP, UP, VE, PI, BMI, BCI, triazine, BT-epoxy, cyanate ester, acrylate, phenol resin, and a combination of these resins.
Claim 21
Dependent Claim
38 words
A board according to claim 2 wherein the intermediate substrate is provided with the flowable adhesive layer on one side of its hard core layer and has conductive traces on the other side of its hard core layer.
Claim 22
Dependent Claim
19 words
A board according to claim 2 wherein an intermediate substrate is provided on both sides of the base substrate.
Claim 23
Dependent Claim
81 words
A board according to claim 2 wherein after conductive traces have been formed on an intermediate substrate, there is provided on one or on both outer sides of a laminate formed by lamination bonding of the intermediate substrate and the base substrate, a further intermediate substrate which is provided with a flowable adhesive layer on one side of the hard core layer thereof and the other side of the core of the further intermediate substrate being equipped to form conductive traces.
Claim 24
Dependent Claim
53 words
A board according to claim 2 wherein after conductive traces have been formed on the outside of the intermediate substrate, that had been provided on the formed laminate, additional intermediate substrates and conductive traces are lamination bonded thereto until the final laminate having the desired number of layers with conductive traces, is obtained.
Claim 25
Dependent Claim
26 words
A board according to claim 2 comprising an intermediate substrate which is provided with the flowable adhesive layer on both sides of the hard core layer.
Claim 26
Dependent Claim
73 words
A board according to claim 23 wherein the intermediate substrate is sandwiched between two adjacent base substrates, and such pressure is exerted on the laminate during the laminating process as will bring said hard core layer of the intermediate substrate at least substantially into contact with the conductive traces of the two base substrates and fill any void between these traces, on either side of the intermediate substrate, with the flowable adhesive material.
Claim 27
Dependent Claim
40 words
A board according to claim 24 wherein each of a plurality of n intermediate substrates, with n being an integer higher than 1, is sandwiched between adjacent base substrates, the number of base substrates thus being n+1, followed by lamination.
Claim 28
Dependent Claim
51 words
A board according to claim 2 wherein the thickness of the hard core layer of each intermediate substrate is 0.025-0.6 mm, and the thickness of each flowable adhesive layer on one or both sides of the intermediate substrate is of the same order of magnitude as that of the conductive traces.
Claim 29
Dependent Claim
19 words
A board according to claim 2 wherein the base substrates are provided with electrically conductive vias in the Z-direction.
Claim 30
Dependent Claim
27 words
A board according to claim 2 wherein a glue based on an uncured or only partially cured thermosetting synthetic material is used as the flowable adhesive layer.
Claim 31
Dependent Claim
27 words
A board according to claim 2 which comprises an intermediate substrate with a flowable adhesive layer having a thickness in the range of 1 to 70 μm.
Claim 32
Dependent Claim
46 words
A board according to claim 2 wherein the matrix of the core layers of the substrates is selected from the following group of thermosetting synthetic materials: EP, UP, VE, PU, PI, BMI, BCI, triazine, BT-epoxy, cyanate ester, acrylate resin, phenol resin, and combinations of these resins.
Claim 33
Dependent Claim
23 words
A board according to claim 2 wherein the matrix of the core layers of the substrates is composed of a thermoplastic synthetic material.
Claim 34
Dependent Claim
24 words
A board according to claim 2 wherein the matrix of the core layers of the substrates comprises thermoplastic as well as thermosetting synthetic materials.
Claim 35
Dependent Claim
43 words
A board according to claim 2 wherein the reinforcing fiber in the fiber-reinforced matrix is selected from the following group of materials: A-glass, AR-glass, C-glass, D-glass, E-glass, R-glass, S1-glass, S2-glass, quartz, silica, PPDT, PBT, PBI, PBO, PEN, PETP, aluminum oxide, and silicon carbide.
Claim 36
Dependent Claim
42 words
A board according to claim 2 wherein the adhesive layer is comprised of a thermosetting synthetic material selected from the group consisting of EP, UP, VE, PI, BMI, BCI, triazine, BT-epoxy, cyanate ester, acrylate, phenol resin, and a combination of these resins.
References Cited (Backward Citations)
US3473992A
Cited
US3756891A
Cited
US3969177A
Cited
US4201616A
Cited
US4299873A
Cited
US4606787A
Cited
US4404059A
Cited
US4501787A
Cited
EP0231737A2
Cited
US4943334A
Cited
EP0374319A1
Cited
US4937132A
Cited
US4847136A
Cited
JPH01283996A
Cited
US5153987A
Cited
US5045381A
Cited
DE4007558A1
Cited
US5261153A
Cited
US5350621A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-26 | 2000-11-25 | 2001-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-26 | 2004-11-25 | 2005-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-26 | 2008-11-25 | 2009-05-27 | $7700.00 | Window Closed / Lapsed |