EP0231737A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Continuous process for the manufacture of printed circuit boards
Assignee: International Business Machines Corp
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Filing: 1987-01-02
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Granted: —
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Expires: 2007-01-02
Abstract
Abstract A continuous method for the manufacture of a circuit board wherein a coating of a solvent-free thermosetting resin is applied (22) to the surface of a metal foil (17). The resin coated foil is advanced into contact with a reinforcing cloth sheet layer (19) to form a foil/cloth assembly. The assembly is continuously conveyed between a pair of endless belts (10, 11) revolving in opposite directions with mutually facing surfaces, the belts being heated (23) to the curing temperature of the resin while the belts are pressed against the assembly to continuously compact the assembly and cure the resin to form a composite product (16) which can then be circuitized to form a printed circuit board.
Inventors
- 👤 Eugene A. Eggers
- 👤 William J. Summa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 16:15
CPC Classifications
B; B32; B32B; B32B38/00; B32B38/08; B32B15/00; B32B15/14; B32B37/00; B32B37/10; B32B37/1027; H; H05; H05K; H05K3/00; H05K3/02; H05K3/022; B32B2038/0052; B32B2038/0076; B32B2260/00; B32B2260/04; B32B2260/046; B32B2457/00; B32B2457/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2203/00; H05K2203/06; H05K2203/068; H05K2203/11; H05K2203/1121; H05K2203/15; H05K2203/1545
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
182 words
A method for the continuous manufacture of a composite circuit board which comprises the continuous steps of coating (22) the surface of a metal foil (17) with a layer of a liquid thermosetting resin free of a volatile solvent, heating (21) the foil to a temperature below the curing temperature of the resin to further fluidize the resin, advancing the heated resin coated foil into contact with a sheet (19) of reinforcing cloth to form a foil/cloth assembly, continuously conveying the said assembly between a pair of rotating endless belts (10, 11) having mutally facing surfaces (10a, 11a) mutually pressable against one another in a heating zone (23) heated to the curing temperature of the resin, pressing the mutually facing surfaces of the belts against the assembly to simultaneously compress the assembly and impregnate the assembly with the resin, curing the resin in the heating zone (23) whereby there is formed a composite structure (16) bonded together with the cured resin, and then cooling (24) the composite structure while the belts remain pressed against the composite structure to obtain the circuit board.
Claim 2
Independent Claim
182 words
A method for the continuous manufacture of a composite circuit board which comprises the continuous steps of coating (22) the surface of a metal foil (17) with a layer of a liquid thermosetting resin free of a volatile solvent, heating (21) the foil to a temperature below the curing temperature of the resin to further fluidize the resin, advancing the heated resin coated foil into contact with a sheet (19) of reinforcing cloth to form a foil/cloth assembly, continuously conveying the said assembly between a pair of rotating endless belts (10, 11) having mutally facing surfaces (10a, 11a) mutually pressable against one another in a heating zone (23) heated to the curing temperature of the resin, pressing the mutually facing surfaces of the belts against the assembly to simultaneously compress the assembly and impregnate the assembly with the resin, curing the resin in the heating zone (23) whereby there is formed a composite structure (16) bonded together with the cured resin, and then cooling (24) the composite structure while the belts remain pressed against the composite structure to obtain the circuit board.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein the metal foil is copper foil.
Claim 4
Independent Claim
15 words
The method of any previous claim wherein the reinforcing cloth is a glass fiber cloth.
Claim 5
Independent Claim
15 words
The method of any previous claim wherein the liquid thermosetting resin is an epoxy resin.
Claim 6
Dependent Claim
13 words
The method of claim 4 wherein the epoxy resin is an epoxy-styrene composition.
Claim 7
Independent Claim
24 words
The method of any previous claim wherein the composite structure is compressed by the belts at a pressure of about 200 to 350 kPa.
Claim 8
Independent Claim
55 words
The method of any previous claim wherein a second sheet (20) of reinforcing cloth and/or a second metal foil (18) are advanced into contact with the foil/cloth assembly (17, 19) and together with it are conveyed between said pair of rotating belts (10, 11), pressed, bonded and cured to form one composite product structure (16).
Claim 9
Independent Claim
31 words
The method of any previous claim wherein the metal foil layer or layers (17, 18) of the cooled composite (16) are etched to form circuits to obtain a printed circuit board.
Claim 10
Dependent Claim
44 words
The method of claim 8 wherein the printed circuit composite board laminate (16) has subsequently applied thereto a plurality of metal foil (32, 43) and reinforcing cloth (34, 35, 41, 42) layers coated, pressed and cured to form a multilayer laminated circuit board (55).
Claim 11
Dependent Claim
30 words
The method of claim 9 wherein the outer metal foil (32, 43) of said multilayer laminated structure (55) are etched to form circuits to obtain a multilayer printed circuit board.
References Cited (Backward Citations)
No citation records indexed.
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