Abstract In a method of manufacturing a semiconductor device, after forming a poly silicon film 54 on a surface of a silicon substrate 51, a silicon nitride film 55 is formed in accordance with a desired pattern and a local oxidation process is carried out to form a field oxide film 56 having a large thickness. Then, after removing the silicon nitride film 55, the poly silicon film 54 is fully converted in to a silicon oxide film 58 and then the thus converted silicon oxide film is removed by wet etching to expose a clean surface of the silicon substrate 51. The poly silicon film does not constitute an oxygen source, so that during the local oxidation, a lateral diffusion of oxygen is prevented and a generation of bird's beak can be suppressed. Further, the poly silicon film serves as a buffer, no stress remains in the surface of the silicon substrate.
A method of manufacturing a semiconductor device, said method comprising: preparing a semiconductor substrate having a surface; forming a semiconductor film having a first thickness on said surface of the semiconductor substrate, said semiconductor film comprising a semiconductor material in direct contact with said surface of said semiconductor substrate; forming an anti-oxidation film on said semiconductor film; patterning said anti-oxidation film; performing a thermal oxidation to form a first oxide film having a second thickness greater than said first thickness in said surface of the semiconductor substrate, said first oxide film serving as a field oxide film for isolating elements; removing said anti-oxidation film; forming a second oxide film by oxidizing said semiconductor film; and removing said second oxide film to expose a clean surface of the semiconductor substrate.
Claim 2
Independent Claim
129 words
A method of manufacturing a semiconductor device, said method comprising: preparing a semiconductor substrate having a surface; forming a semiconductor film having a first thickness on said surface of the semiconductor substrate, said semiconductor film comprising a semiconductor material in direct contact with said surface of said semiconductor substrate; forming an anti-oxidation film on said semiconductor film; patterning said anti-oxidation film; performing a thermal oxidation to form a first oxide film having a second thickness greater than said first thickness in said surface of the semiconductor substrate, said first oxide film serving as a field oxide film for isolating elements; removing said anti-oxidation film; forming a second oxide film by oxidizing said semiconductor film; and removing said second oxide film to expose a clean surface of the semiconductor substrate.
Claim 3
Dependent Claim
24 words
A method according to claim 1, wherein said semiconductor substrate is made of silicon, and said semiconductor material comprises poly silicon or amorphous silicon.
Claim 4
Dependent Claim
48 words
A method according to claim 2, wherein said anti-oxidation film is formed by forming a silicon nitride film on said semiconductor film and said silicon nitride film is patterned by a reactive ion etching during which said semiconductor film serves as a buffer for the reactive ion etching.
Claim 5
Dependent Claim
17 words
A method according to claim 2, wherein said second oxide film is removed by a wet etching.