US5622898A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of making an integrated circuit chip composite including parylene coated wire
Assignee: International Business Machines Corp
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Filing: 1995-05-19
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Granted: 1997-04-22
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Expires: 2015-05-19
Abstract
Abstract A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.
Inventors
- 👤 John H. Zechman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:14
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W42/261; H10W42/276; H10W44/00; H10W44/601; H10W70/00; H10W70/40; H10W70/464; H10W70/465; H10W70/466; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; H10W44/20; H10W44/203; H10W44/209; H10W44/212; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/07531; H10W72/07536; H10W72/07551; H10W72/07552; H10W72/50; H10W72/521; H10W72/522; H10W72/523; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/555; H10W72/59; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
70 words
A method for fabricating a composite which comprises providing an integrated circuit chip having electrically conductive site thereon; interconnecting conductive lead to said conductive site with electrically conductive wire; then conformally coating said wire with a dielectric material wherein said dielectric is parylene; then coating said dielectric material with an electrically conductive coating and then encapsulating the chip, wire and portion of said conductive lead in a dielectric encapsulating composition.
Claim 2
Independent Claim
70 words
A method for fabricating a composite which comprises providing an integrated circuit chip having electrically conductive site thereon; interconnecting conductive lead to said conductive site with electrically conductive wire; then conformally coating said wire with a dielectric material wherein said dielectric is parylene; then coating said dielectric material with an electrically conductive coating and then encapsulating the chip, wire and portion of said conductive lead in a dielectric encapsulating composition.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein said electrically conductive site is aluminum.
Claim 4
Dependent Claim
11 words
The method of claim 1 wherein said conductive lead is copper.
Claim 5
Dependent Claim
12 words
The method of claim 1 wherein said conductive lead is gold-plated copper.
Claim 6
Dependent Claim
12 words
The method of claim 1 wherein said dielectric material is parylene N.
Claim 7
Dependent Claim
17 words
The method of claim 1 wherein the dielectric material is about 0.0001 to about 0.0003 inches thick.
Claim 8
Dependent Claim
15 words
The method of claim 1 wherein parylene is coated on said wire by vapor deposition.
Claim 9
Dependent Claim
12 words
The method of claim 1 wherein said electrically conductive coating is aluminum.
Claim 10
Dependent Claim
17 words
The method of claim 1 wherein said dielectric material is about 0.0001 to about 0.001 inches thick.
Claim 11
Dependent Claim
15 words
The method of claim 1 wherein said wire is 0.0005 to about 0.003 inches thick.
Claim 12
Dependent Claim
15 words
The method of claim 1 wherein said wire is at least about 5 mm long.
Claim 13
Dependent Claim
11 words
The method of claim 1 wherein said wire is gold wire.
Claim 14
Dependent Claim
13 words
The method of claim 1 wherein said encapsulating composition is an epoxy composition.
Claim 15
Dependent Claim
14 words
The method of claim 1 wherein said wire is at least 3 mm long.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-04-21 | 2000-10-21 | 2001-04-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-04-21 | 2004-10-21 | 2005-04-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-04-21 | 2008-10-21 | 2009-04-22 | $7700.00 | Window Closed / Lapsed |